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  ? 2008 microchip technology inc. ds70141e dspic30f3010/3011 data sheet high-performance, 16-bit digital signal controllers
ds70141e-page ii ? 2008 microchip technology inc. information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application meets with your specifications. microchip makes no representations or warranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip devices in life support and/or safety applications is entirely at the buyer?s risk, and the buyer agrees to defend, indemnify and hold harmless microchip from any and all damages, claims, suits, or expenses resulting from such use. no licenses are conveyed, implicitly or otherwise, under any microchip intellectual property rights. trademarks the microchip name and logo, the microchip logo, accuron, dspic, k ee l oq , k ee l oq logo, mplab, pic, picmicro, picstart, pro mate, rfpic and smartshunt are registered trademarks of microchip tec hnology incorporated in the u.s.a. and other countries. filterlab, linear active thermistor, mxdev, mxlab, seeval, smartsensor and the embedded control solutions company are registered trademarks of microchip technology incorporated in the u.s.a. analog-for-the-digital age, appl ication maestro, codeguard, dspicdem, dspicdem.net, dspicworks, dsspeak, ecan, economonitor, fansense, in-circuit serial programming, icsp, icepic, mindi, miwi, mpasm, mplab certified logo, mplib, mplink, mtouch, pickit, picdem, picdem.net, pictail, pic 32 logo, powercal, powerinfo, powermate, powertool, real ice, rflab, select mode, total endurance, uni/o, wiperlock and zena are trademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of microchip technology incorporated in the u.s.a. all other trademarks mentioned herein are property of their respective companies. ? 2008, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. note the following details of the code protection feature on microchip devices: ? microchip products meet the specification cont ained in their particular microchip data sheet. ? microchip believes that its family of products is one of the mo st secure families of its kind on the market today, when used i n the intended manner and under normal conditions. ? there are dishonest and possibly illegal methods used to breach the code protection feature. all of these methods, to our knowledge, require using the microchip produc ts in a manner outside the operating specifications contained in microchip?s data sheets. most likely, the person doing so is engaged in theft of intellectual property. ? microchip is willing to work with the customer who is concerned about the integrity of their code. ? neither microchip nor any other semiconductor manufacturer c an guarantee the security of their code. code protection does not mean that we are guaranteeing the product as ?unbreakable.? code protection is constantly evolving. we at microchip are co mmitted to continuously improvi ng the code protection features of our products. attempts to break microchip?s c ode protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona; gresham, oregon and design centers in california and india. the company?s quality system processes and procedures are for its pic ? mcus and dspic ? dscs, k ee l oq ? code hopping devices, serial eeproms, microperipherals, nonvolatile memory and analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001:2000 certified.
? 2008 microchip technology inc. ds70141e-page 1 dspic30f3010/3011 high-performance modified risc cpu: ? modified harvard architecture ? c compiler optimized instruction set architecture with flexible addressing modes ? 83 base instructions ? 24-bit wide instructions, 16-bit wide data path ? 24 kbytes on-chip flash program space (8k instruction words) ? 1 kbyte of on-chip data ram ? 1 kbyte of nonvolatile data eeprom ? 16 x 16-bit working register array ? up to 30 mips operation: - dc to 40 mhz external clock input - 4 mhz-10 mhz oscillator input with pll active (4x, 8x, 16x) ? 29 interrupt sources - 3 external interrupt sources - 8 user-selectable priority levels for each interrupt source - 4 processor trap sources dsp engine features: ? dual data fetch ? accumulator write back for dsp operations ? modulo and bit-reversed addressing modes ? two, 40-bit wide accumulators with optional saturation logic ? 17-bit x 17-bit single-cycle hardware fractional/ integer multiplier ? all dsp instructions single cycle ? 16-bit single-cycle shift peripheral features: ? high-current sink/source i/o pins: 25 ma/25 ma ?timer module with programmable prescaler: - five 16-bit timers/counters; optionally pair 16-bit timers into 32-bit timer modules ? 16-bit capture input functions ? 16-bit compare/pwm output functions ? 3-wire spi modules (supports 4 frame modes) ?i 2 c tm module supports multi-master/slave mode and 7-bit/10-bit addressing ? 2 uart modules with fifo buffers motor control pwm module features: ? 6 pwm output channels - complementary or independent output modes - edge and center-aligned modes ? 3 duty cycle generators ? dedicated time base ? programmable output polarity ? dead-time control for complementary mode ? manual output control ? trigger for a/d conversions quadrature encoder interface module features: ? phase a, phase b and index pulse input ? 16-bit up/down position counter ? count direction status ? position measurement (x2 and x4) mode ? programmable digital noise filters on inputs ? alternate 16-bit timer/counter mode ? interrupt on position counter rollover/underflow analog features: ? 10-bit analog-to-digital converter (adc) with 4 s/h inputs: - 1 msps conversion rate - 9 input channels - conversion available during sleep and idle ? programmable brown-out reset note: this data sheet summarizes features of this group of dspic30f devices and is not intended to be a complete reference source. for more information on the cpu, peripherals, register descriptions and gen- eral device functionality, refer to the ? dspic30f family reference manual ? (ds70046). for more information on the device instruction set and programming, refer to the ? dspic30f/33f programmer?s reference manual? (ds70157). high performance, 16-bit di gital signal controllers
dspic30f3010/3011 ds70141e-page 2 ? 2008 microchip technology inc. special microcontroller features: ? enhanced flash program memory: - 10,000 erase/write cycle (min.) for industrial temperature range, 100k (typical) ? data eeprom memory: - 100,000 erase/write cycle (min.) for industrial temperature range, 1m (typical) ? self-reprogrammable under software control ? power-on reset (por), power-up timer (pwrt) and oscillator start-up timer (ost) ? flexible watchdog timer (wdt) with on-chip low-power rc oscillator for reliable operation ? fail-safe clock monitor operation detects clock failure and switches to on-chip low-power rc oscillator ? programmable code protection ? in-circuit serial programming? (icsp?) ? selectable power management modes: - sleep, idle and alternate clock modes cmos technology: ? low-power, high-speed flash technology ? wide operating voltage range (2.5v to 5.5v) ? industrial and extended temperature ranges ? low power consumption dspic30f motor control and power conversion family device pins program mem. bytes/ instructions sram bytes eeprom bytes timer 16-bit input cap output comp/std pwm motor control pwm a/d 10-bit 1 msps quad enc uart spi i 2 c tm dspic30f3010 28 24k/8k 1024 1024 5 4 2 6 ch 6 ch yes 1 1 1 dspic30f3011 40/44 24k/8k 1024 1024 5 4 4 6 ch 9 ch yes 2 1 1
? 2008 microchip technology inc. ds70141e-page 3 dspic30f3010/3011 pin diagrams an7/rb7 an6/ocfa/rb6 rf0 rf1 oc3/rd2 emuc2/oc1/ic1/int1/rd0 an8/rb8 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 dspic30f3011 mclr v dd v ss emud2/oc2/ic2/int2/rd1 emuc1/sosco/t1ck/u1arx/cn0/rc14 emud1/sosci/t2ck/u1atx/cn1/rc13 osc2/clko/rc15 osc1/clki pwm1l/re0 pwm1h/re1 pwm2l/re2 pwm2h/re3 pwm3h/re5 av dd av ss oc4/rd3 v ss v dd sck1/rf6 pgc/emuc/u1rx/sdi1/sda/rf2 pgd/emud/u1tx/sdo1/scl/rf3 pwm3l/re4 v dd u2rx/cn17/rf4 u2tx/cn18/rf5 an4/qea/ic7/cn6/rb4 an2/ss1 /cn4/rb2 emuc3/an1/v ref -/cn3/rb1 emud3/an0/v ref +/cn2/rb0 an5/qeb/ic8/cn7/rb5 flta /int0/re8 v ss an3/indx/cn5/rb3 40-pin pdip 10 11 2 3 4 5 6 1 18 19 20 21 22 12 13 14 15 38 8 7 44 43 42 41 40 39 16 17 29 30 31 32 33 23 24 25 26 27 28 36 34 35 9 37 pgd/emud/u1tx/sdo1/scl/rf3 sck1/rf6 emuc2/oc1/ic1/int1/rd0 oc3/rd2 v dd emuc1/sosco/t1ck/u1arx/cn0/rc14 nc v ss oc4/rd3 emud2/oc2/ic2/int2/rd1 flta /int0/re8 an3/indx/cn5/rb3 an2/ss1 /cn4/rb2 emuc3/an1/v ref -/cn3/rb1 emud3/an0/v ref +/cn2/rb0 mclr nc av dd av ss pwm1l/re0 pwm1h/re1 pwm2h/re3 pwm3l/re4 pwm3h/re5 v dd v ss rf0 rf1 u2rx/cn17/rf4 u2tx/cn18/rf5 pgc/emuc/u1rx/sdi1/sda/rf2 an4/qea/ic7/cn6/rb4 an5/qeb/ic8/cn7/rb5 an6/ocfa/rb6 an7/rb7 an8/rb8 nc v dd v ss osc1/clki osc2/clko/rc15 emud1/sosci/t2ck/u1atx/cn1/rc13 44-pin tqfp dspic30f3011 pwm2l/re2 nc
dspic30f3010/3011 ds70141e-page 4 ? 2008 microchip technology inc. pin diagrams (continued) 44-pin qfn 44 43 42 41 40 39 38 37 36 35 14 15 16 17 18 19 20 21 3 30 29 28 27 26 25 24 23 4 5 7 8 9 10 11 1 2 32 31 dspic30f3011 pwm2h/re3 pwm3l/re4 pwm3h/re5 v dd v dd rf0 rf1 u2rx/cn17/rf4 u2tx/cn18/rf5 pgc/emuc/u1rx/sdi1/sda/rf2 an3/indx/cn5/rb3 an2/ss1 /cn4/rb2 emuc3/an1/v ref -/cn3/rb1 emud3/an0/v ref +/cn2/rb0 mclr av dd pwm1l/re0 pwm1h/re1 pwm2l/re2 an4/qea/ic7/cn6/rb4 an5/qeb/ic8/cn7/rb5 an6/ocfa/rb6 an7/rb7 an8/rb8 v dd v ss osc1/clki osc2/clko/rc15 pgd/emud/u1tx/sdo1/scl/rf3 sck1/rf6 emuc2/oc1/ic1/int1/rd0 oc3/rd2 v dd emuc1/sosco/t1ck/u1arx/cn0/rc14 oc4/rd3 emud2/oc2/ic2/int2/rd1 flta /int0/re8 6 22 33 34 v ss av ss v dd v ss emud1/sosci/t2ck/u1atx/cn1/rc13 v ss nc 12 13
? 2008 microchip technology inc. ds70141e-page 5 dspic30f3010/3011 pin diagrams (continued) dspic30f3010 mclr pwm1l/re0 pwm1h/re1 pwm2l/re2 pwm2h/re3 pwm3l/re4 pwm3h/re5 v ss v dd emud3/an0/v ref +/cn2/rb0 emuc3/an1/v ref -/cn3/rb1 av dd av ss an2/ss1 /cn4/rb2 emud2/oc2/ic2/int2/rd1 emuc2/oc1/ic1/int1/rd0 emuc1/sosco/t1ck/u1arx/cn0/rc14 emud1/sosci/t2ck/u1atx/cn1/rc13 v ss osc2/clko/rc15 osc1/clki v dd flta /int0/sck1/ocfa/re8 pgc/emuc/u1rx/sdi1/sda/rf2 pgd/emud/u1tx/sdo1/scl/rf3 an5/qeb/ic8/cn7/rb5 an4/qea/ic7/cn6/rb4 an3/indx/cn5/rb3 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 28-pin spdip 28-pin soic 44-pin qfn 44 43 42 41 40 39 38 37 36 35 14 15 16 17 18 19 20 21 3 30 29 28 27 26 25 24 23 4 5 7 8 9 10 11 1 2 32 31 dspic30f3010 pwm2h/re3 pwm3l/re4 pwm3h/re5 v dd v dd nc nc nc nc pgc/emuc/u1rx/sdi1/sda/rf2 an3/indx/cn5/rb3 an2/ss1 /cn4/rb2 emuc3/an1/v ref -/cn3/rb1 emud3/an0/v ref +/cn2/rb0 mclr av dd pwm1l/re0 pwm1h/re1 pwm2l/re2 an4/qea/ic7/cn6/rb4 an5/qeb/ic8/cn7/rb5 nc nc nc v dd v ss osc1/clki osc2/clko/rc15 pgd/emud/u1tx/sdo1/scl/rf3 flta/int0/sck1\ocfa/re8 emuc2/oc1/ic1/int1/rd0 nc v dd emuc1/sosco/t1ck/u1arx/cn0/rc14 nc emud2/oc2/ic2/int2/rd1 v dd 6 22 33 34 v ss av ss v dd v ss emud1/sosci/t2ck/u1atx/cn1/rc13 v ss nc 12 13
dspic30f3010/3011 ds70141e-page 6 ? 2008 microchip technology inc. table of contents 1.0 device overview ............................................................................................................. ............................................................. 7 2.0 cpu architecture overview................................................................................................... ..................................................... 15 3.0 memory organization ......................................................................................................... ........................................................ 23 4.0 address generator units ..................................................................................................... ....................................................... 35 5.0 interrupts .................................................................................................................. .................................................................. 41 6.0 flash program memory........................................................................................................ ...................................................... 47 7.0 data eeprom memory .......................................................................................................... ................................................... 53 8.0 i/o ports ................................................................................................................... .................................................................. 59 9.0 timer1 module ............................................................................................................... ............................................................ 65 10.0 timer2/3 module ............................................................................................................ ............................................................ 69 11.0 timer4/5 module ........................................................................................................... ............................................................ 75 12.0 input capture module ....................................................................................................... .......................................................... 79 13.0 output compare module ...................................................................................................... ...................................................... 83 14.0 quadrature encoder interface (qei) module .................................................................................. ........................................... 87 15.0 motor control pwm module ................................................................................................... .................................................... 93 16.0 spi module ................................................................................................................. .............................................................. 105 17.0 i2c? module ................................................................................................................ ........................................................... 109 18.0 universal asynchronous receiver transmitter (uart) module .................................................................. ............................ 117 19.0 10-bit high-speed analog-to-digital converter (adc) module ................................................................. ............................... 125 20.0 system integration ......................................................................................................... .......................................................... 137 21.0 instruction set summary .................................................................................................... ...................................................... 151 22.0 development support........................................................................................................ ....................................................... 159 23.0 electrical characteristics ................................................................................................. ......................................................... 163 24.0 packaging information...................................................................................................... ........................................................ 201 index .......................................................................................................................... ....................................................................... 215 to our valued customers it is our intention to provide our valued customers with the be st documentation possible to ensure successful use of your micro chip products. to this end, we will continue to improve our publications to better suit your needs. our publications will be refined and enhanced as new volumes and updates are introduced. if you have any questions or comments regardi ng this publication, please contact the marketing communications department via e-mail at docerrors@microchip.com or fax the reader response form in the back of this data sheet to (480) 792-4150. we welcome your feedback. most current data sheet to obtain the most up-to-date version of this data s heet, please register at our worldwide web site at: http://www.microchip.com you can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page . the last character of the literature number is the vers ion number, (e.g., ds30000a is version a of document ds30000). errata an errata sheet, describing minor operational differences fr om the data sheet and recommended workarounds, may exist for curren t devices. as device/documentation issues become known to us, we will publish an errata sheet. the errata will specify the revisi on of silicon and revision of document to which it applies. to determine if an errata sheet exists for a particular device, please check with one of the following: ? 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? 2008 microchip technology inc. ds70141e-page 7 dspic30f3010/3011 1.0 device overview this document contains device-specific information for the dspic30f3010/3011 device. the dspic30f devices contain extensive digital signal processor (dsp) functionality within a high-performance 16-bit microcontroller (mcu) architecture. figure 1-1 and figure 1-2 show device block diagrams for the dspic30f3011 and dspic30f3010 devices. note: this data sheet summarizes features of this group of dspic30f devices and is not intended to be a complete reference source. for more information on the cpu, peripherals, register descriptions and gen- eral device functionality, refer to the ? dspic30f family reference manual? (ds70046). for more information on the device instruction set and programming, refer to the ? dspic30f/33f programmer?s reference manual? (ds70157).
dspic30f3010/3011 ds70141e-page 8 ? 2008 microchip technology inc. figure 1-1: dspic30f 3011 block diagram an8/rb8 power-up timer oscillator start-up timer por/bor reset watchdog timer instruction decode and control osc1/clki mclr v dd , v ss an4/qea/ic7/cn6/rb4 uart1, spi motor control pwm timing generation an5/qeb/ic8/cn7/rb5 16 pch pcl program counter alu<16> 16 address latch program memory (24 kbytes) data latch 24 24 24 24 x data bus ir i 2 c? qei an6/ocfa/rb6 an7/rb7 pcu pwm1l/re0 pwm1h/re1 pwm2l/re2 pwm2h/re3 pwm3l/re4 10-bit adc timers pwm3h/re5 flta /int0/re8 u2tx/cn18/rf5 sck1/rf6 input capture module output compare module emuc1/sosco/t1ck/u1arx/cn0/rc14 emud1/sosci/t2ck/u1atx/cn1/rc13 portb rf0 rf1 pgc/emuc/u1rx/sdi1/sda/rf2 pgd/emud/u1tx/sdo1/scl/rf3 portf portd 16 16 16 16 x 16 w reg array divide unit engine dsp decode rom latch 16 y data bus effective address x ragu x wagu y agu emud3/an0/v ref +/cn2/rb0 emuc3/an1/v ref -/cn3/rb1 an2/ss1 /cn4/rb2 an3/indx/cn5/rb3 osc2/clko/rc15 u2rx/cn17/rf4 av dd , av ss uart2 16 16 16 16 16 portc porte 16 16 16 16 8 interrupt controller psv & table data access control block stack control logic loop control logic data latch data latch y data (4 kbytes) ram x data (4 kbytes) ram address latch address latch control signals to various blocks emuc2/oc1/ic1/int1/rd0 emud2/oc2/ic2/int2/rd1 oc3/rd2 oc4/rd3 16 data eeprom (1 kbyte) 16
? 2008 microchip technology inc. ds70141e-page 9 dspic30f3010/3011 figure 1-2: dspic30f 3010 block diagram instruction decode and control osc1/clki mclr v dd , v ss an4/qea/ic7/cn6/rb4 uart spi motor control pwm timing generation an5/qeb/ic8/cn7/rb5 16 pch pcl program counter alu<16> 16 address latch program memory (24 kbytes) data latch 24 24 24 24 x data bus ir i 2 c? qei pcu pwm1l/re0 pwm1h/re1 pwm2l/re2 pwm2h/re3 pwm3l/re4 10-bit adc timers pwm3h/re5 flta /int0/sck1/ocfa/re8 input capture module output compare module emuc1/sosco/t1ck/u1arx/cn0/rc14 emud1/sosci/t2ck/u1atx/cn1/rc13 portb pgc/emuc/u1rx/sdi1/sda/rf2 pgd/emud/u1tx/sdo1/scl/rf3 portf portd 16 16 16 16 x 16 w reg array divide unit engine dsp decode rom latch 16 y data bus effective address x ragu x wagu y agu emud3/an0/v ref +/cn2/rb0 emuc3/an1/v ref -/cn3/rb1 an2/ss1 /cn4/rb2 an3/indx/cn5/rb3 osc2/clko/rc15 av dd , av ss 16 16 16 16 16 portc porte 16 16 16 16 8 interrupt controller psv & table data access control block stack control logic loop control logic data latch data latch y data (4 kbytes) ram x data (4 kbytes) ram address latch address latch control signals to various blocks emuc2/oc1/ic1/int1/rd0 emud2/oc2/ic2/int2/rd1 16 data eeprom (1 kbyte) 16 power-up timer oscillator start-up timer por/bor reset watchdog timer
dspic30f3010/3011 ds70141e-page 10 ? 2008 microchip technology inc. table 1-1 provides a brief description of the device i/o pinout and the functions that are multiplexed to a port pin. multiple functions may exist on one port pin. when multiplexing occurs, the peripheral module?s functional requirements may force an override of the data direction of the port pin. table 1-1: dspic30f3011 i/o pin descriptions pin name pin type buffer type description an0-an8 i analog analog input channels. an0 and an1 are also used for device programming data and clock inputs, respectively. av dd p p positive supply for analog module. av ss p p ground reference for analog module. clki clko i o st/cmos ? external clock source input. always associated with osc1 pin function. oscillator crystal output. connects to crystal or resonator in crystal oscillator mode. optionally functions as clko in rc and ec modes. always associated with osc2 pin function. cn0-cn7 cn17-cn18 i st input change notification inputs. can be software programmed for internal weak pull-ups on all inputs. emud emuc emud1 emuc1 emud2 emuc2 emud3 emuc3 i/o i/o i/o i/o i/o i/o i/o i/o st st st st st st st st icd primary communication channel data input/output pin. icd primary communication channel clock input/output pin. icd secondary communication channel data input/output pin. icd secondary communication channel clock input/output pin. icd tertiary communication channel data input/output pin. icd tertiary communication channel clock input/output pin. icd quaternary communication channel data input/output pin. icd quaternary communication channel clock input/output pin. ic1, ic2, ic7, ic8 i st capture inputs 1, 2, 7 and 8. indx qea qeb i i i st st st quadrature encoder index pulse input. quadrature encoder phase a input in qei mode. auxiliary timer external clock/gate input in timer mode. quadrature encoder phase a input in qei mode. auxiliary timer external clock/gate input in timer mode. int0 int1 int2 i i i st st st external interrupt 0. external interrupt 1. external interrupt 2. flta pwm1l pwm1h pwm2l pwm2h pwm3l pwm3h i o o o o o o st ? ? ? ? ? ? pwm fault a input. pwm 1 low output. pwm 1 high output. pwm 2 low output. pwm 2 high output. pwm 3 low output. pwm 3 high output. mclr i/p st master clear (reset) input or programming voltage input. this pin is an active low reset to the device. ocfa oc1-oc4 i o st ? compare fault a input (for compare channels 1, 2, 3 and 4). compare outputs 1 through 4. legend: cmos = cmos compatible input or output analog = analog input st = schmitt trigger input with cmos levels o = output i = input p = power
? 2008 microchip technology inc. ds70141e-page 11 dspic30f3010/3011 osc1 osc2 i i/o st/cmos ? oscillator crystal input. st buffer when configured in rc mode; cmos otherwise. oscillator crystal output. connects to crystal or resonator in crystal oscillator mode. optionally functions as clko in rc and ec modes. pgd pgc i/o i st st in-circuit serial programming? data input/output pin. in-circuit serial programming clock input pin. rb0-rb8 i/o st portb is a bidirectional i/o port. rc13-rc15 i/o st portc is a bidirectional i/o port. rd0-rd3 i/o st portd is a bidirectional i/o port. re0-re5, re8 i/o st porte is a bidirectional i/o port. rf0-rf6 i/o st portf is a bidirectional i/o port. sck1 sdi1 sdo1 ss1 i/o i o i st st ? st synchronous serial clock input/output for spi #1. spi #1 data in. spi #1 data out. spi #1 slave synchronization. scl sda i/o i/o st st synchronous serial clock input/output for i 2 c?. synchronous serial data input/output for i 2 c. sosco sosci o i ? st/cmos 32 khz low-power oscillator crystal output. 32 khz low-power oscillator crystal input. st buffer when configured in rc mode; cmos otherwise. t1ck t2ck i i st st timer1 external clock input. timer2 external clock input. u1rx u1tx u1arx u1atx u2rx u2tx i o i o i o st ? st ? st ? uart1 receive. uart1 transmit. uart1 alternate receive. uart1 alternate transmit. uart2 receive. uart2 transmit. v dd p ? positive supply for logic and i/o pins. v ss p ? ground reference for logic and i/o pins. v ref + i analog analog voltage reference (high) input. v ref - i analog analog voltage reference (low) input. table 1-1: dspic30f3011 i/o pin descriptions (continued) pin name pin type buffer type description legend: cmos = cmos compatible input or output analog = analog input st = schmitt trigger input with cmos levels o = output i = input p = power
dspic30f3010/3011 ds70141e-page 12 ? 2008 microchip technology inc. table 1-2 provides a brief description of the device i/o pinout and the functions that are multiplexed to a port pin. multiple functions may exist on one port pin. when multiplexing occurs, the peripheral module?s functional requirements may force an override of the data direction of the port pin. table 1-2: dspic30f3010 i/o pin descriptions pin name pin type buffer type description an0-an5 i analog analog input channels. an0 and an1 are also used for device programming data and clock inputs, respectively. av dd p p positive supply for analog module. av ss p p ground reference for analog module. clki clko i o st/cmos ? external clock source input. always associated with osc1 pin function. oscillator crystal output. connects to crystal or resonator in crystal oscillator mode. optionally functions as clko in rc and ec modes. always associated with osc2 pin function. cn0-cn7 i st input change notification inputs. can be software programmed for internal weak pull-ups on all inputs. emud emuc emud1 emuc1 emud2 emuc2 emud3 emuc3 i/o i/o i/o i/o i/o i/o i/o i/o st st st st st st st st icd primary communication channel data input/output pin. icd primary communication channel clock input/output pin. icd secondary communication channel data input/output pin. icd secondary communication channel clock input/output pin. icd tertiary communication channel data input/output pin. icd tertiary communication channel clock input/output pin. icd quaternary communication channel data input/output pin. icd quaternary communication channel clock input/output pin. ic1, ic2, ic7, ic8 i st capture inputs 1, 2, 7 and 8. indx qea qeb i i i st st st quadrature encoder index pulse input. quadrature encoder phase a input in qei mode. auxiliary timer external clock/gate input in timer mode. quadrature encoder phase a input in qei mode. auxiliary timer external clock/gate input in timer mode. int0 int1 int2 i i i st st st external interrupt 0. external interrupt 1. external interrupt 2. flta pwm1l pwm1h pwm2l pwm2h pwm3l pwm3h i o o o o o o st ? ? ? ? ? ? pwm fault a input. pwm 1 low output. pwm 1 high output. pwm 2 low output. pwm 2 high output. pwm 3 low output. pwm 3 high output. mclr i/p st master clear (reset) input or programming voltage input. this pin is an active low reset to the device. ocfa oc1, oc2 i o st ? compare fault a input (for compare channels 1, 2, 3 and 4). compare outputs 1 and 2. legend: cmos = cmos compatible input or output analog = analog input st = schmitt trigger input with cmos levels o = output i = input p = power
? 2008 microchip technology inc. ds70141e-page 13 dspic30f3010/3011 osc1 osc2 i i/o st/cmos ? oscillator crystal input. st buffer when configured in rc mode; cmos otherwise. oscillator crystal output. connects to crystal or resonator in crystal oscillator mode. optionally functions as clko in rc and ec modes. pgd pgc i/o i st st in-circuit serial programming? data input/output pin. in-circuit serial programming clock input pin. rb0-rb5 i/o st portb is a bidirectional i/o port. rc13-rc15 8i/o 8st portc is a bidirectional i/o port. rd0-rd1 i/o st portd is a bidirectional i/o port. re0-re5, re8 i/o st porte is a bidirectional i/o port. rf2-rf3 i/o st portf is a bidirectional i/o port. sck1 sdi1 sdo1 i/o i o st st ? synchronous serial clock input/output for spi #1. spi #1 data in. spi #1 data out. scl sda i/o i/o st st synchronous serial clock input/output for i 2 c?. synchronous serial data input/output for i 2 c. sosco sosci o i ? st/cmos 32 khz low-power oscillator crystal output. 32 khz low-power oscillator crystal input. st buffer when configured in rc mode; cmos otherwise. t1ck t2ck i i st st timer1 external clock input. timer2 external clock input. u1rx u1tx u1arx u1atx i o i o st ? st ? uart1 receive. uart1 transmit. uart1 alternate receive. uart1 alternate transmit. v dd p ? positive supply for logic and i/o pins. v ss p ? ground reference for logic and i/o pins. v ref + i analog analog voltage reference (high) input. v ref - i analog analog voltage reference (low) input. table 1-2: dspic30f3010 i/o pin descriptions (continued) pin name pin type buffer type description legend: cmos = cmos compatible input or output analog = analog input st = schmitt trigger input with cmos levels o = output i = input p = power
dspic30f3010/3011 ds70141e-page 14 ? 2008 microchip technology inc. notes:
? 2008 microchip technology inc. ds70141e-page 15 dspic30f3010/3011 2.0 cpu architecture overview 2.1 core overview the core has a 24-bit instruction word. the program counter (pc) is 23 bits wide with the least significant bit (lsb) always clear (see section 3.1 ?program address space? ), and the most significant bit (msb) is ignored during normal program execution, except for certain specialized instructions. thus, the pc can address up to 4m instruction words of user program space. an instruction prefetch mechanism is used to help maintain throughput. program loop constructs, free from loop count management overhead, are sup- ported using the do and repeat instructions, both of which are interruptible at any point. the working register array consists of 16x16-bit regis- ters, each of which can act as data, address or offset registers. one working register (w15) operates as a software stack pointer (sp) for interrupts and calls. the data space is 64 kbytes (32k words) and is split into two blocks, referred to as x and y data memory. each block has its own independent address generation unit (agu). most instructions operate solely through the x memory agu, which provides the appearance of a single unified data space. the multiply-accumulate ( mac ) class of dual source dsp instructions operate through both the x and y agus, splitting the data address space into two parts (see section 3.2 ?data address space? ). the x and y data space boundary is device specific and cannot be altered by the user. each data word consists of 2 bytes, and most instructions can address data either as words or bytes. there are two methods of accessing data stored in program memory: ? the upper 32 kbytes of data space memory can be mapped into the lower half (user space) of pro- gram space at any 16k program word boundary, defined by the 8-bit program space visibility page (psvpag) register. this lets any instruction access program space as if it were data space, with a limitation that the access requires an addi- tional cycle. moreover, only the lower 16 bits of each instruction word can be accessed using this method. ? linear indirect access of 32k word pages within program space is also possible using any working register, via table read and write instructions. table read and write instructions can be used to access all 24 bits of an instruction word. overhead-free circular buffers (modulo addressing) are supported in both x and y address spaces. this is primarily intended to remove the loop overhead for dsp algorithms. the x agu also supports bit-reversed addressing on destination effective addresses, to greatly simplify input or output data reordering for radix-2 fft algorithms. refer to section 4.0 ?address generator units? for details on modulo and bit-reversed addressing. the core supports inherent (no operand), relative, lit- eral, memory direct, register direct, register indirect, register offset and literal offset addressing modes. instructions are associated with predefined addressing modes, depending upon their functional requirements. for most instructions, the core is capable of executing a data (or program data) memory read, a working reg- ister (data) read, a data memory write and a program (instruction) memory read per instruction cycle. as a result, 3 operand instructions are supported, allowing c = a + b operations to be executed in a single cycle. a dsp engine has been included to significantly enhance the core arithmetic capability and throughput. it features a high-speed 17-bit by 17-bit multiplier, a 40-bit alu, two 40-bit saturating accumulators and a 40-bit bidirectional barrel shifter. data in the accumula- tor or any working register can be shifted up to 16 bits right or 16 bits left in a single cycle. the dsp instruc- tions operate seamlessly with all other instructions and have been designed for optimal real-time performance. the mac class of instructions can concurrently fetch two data operands from memory, while multiplying two w registers. to enable this concurrent fetching of data operands, the data space has been split for these instructions and linear for all others. this has been achieved in a transparent and flexible manner, by dedicating certain working registers to each address space for the mac class of instructions. the core does not support a multi-stage instruction pipeline. however, a single stage instruction prefetch mechanism is used, which accesses and partially decodes instructions a cycle ahead of execution, in order to maximize available execution time. most instructions execute in a single cycle, with certain exceptions. the core features a vectored exception processing structure for traps and interrupts, with 62 independent vectors. the exceptions consist of up to 8 traps (of which 4 are reserved) and 54 interrupts. each interrupt is prioritized based on a user assigned priority between 1 and 7 (1 being the lowest priority and 7 being the highest) in conjunction with a predetermined ?natural order?. traps have fixed priorities, ranging from 8 to 15. note: this data sheet summarizes features of this group of dspic30f devices and is not intended to be a complete reference source. for more information on the cpu, peripherals, register descriptions and gen- eral device functionality, refer to the ? dspic30f family reference manual? (ds70046). for more information on the device instruction set and programming, refer to the ? dspic30f/33f programmer?s reference manual? (ds70157).
dspic30f3010/3011 ds70141e-page 16 ? 2008 microchip technology inc. 2.2 programmer?s model the programmer?s model is shown in figure 2-1 and consists of 16x16-bit working registers (w0 through w15), 2x40-bit accumulators (acca and accb), status register (sr), data table page register (tblpag), program space visibility page register (psvpag), do and repeat registers (dostart, doend, dcount and rcount) and program coun- ter (pc). the working registers can act as data, address or offset registers. all registers are memory mapped. w0 acts as the w register for file register addressing. some of these registers have a shadow register asso- ciated with each of them, as shown in figure 2-1. the shadow register is used as a temporary holding regis- ter and can transfer its contents to or from its host reg- ister upon the occurrence of an event. none of the shadow registers are accessible directly. the following rules apply for transfer of registers into and out of shadows. ? push.s and pop.s w0, w1, w2, w3, sr (dc, n, ov, z and c bits only) are transferred. ? do instruction dostart, doend, dcount shadows are pushed on loop start, and popped on loop end. when a byte operation is performed on a working reg- ister, only the least significant byte (lsb) of the target register is affected. however, a benefit of memory mapped working registers is that both the least and most significant bytes can be manipulated through byte-wide data memory space accesses. 2.2.1 software stack pointer/ frame pointer the dspic ? dsc devices contain a software stack. w15 is the dedicated software stack pointer, and will be automatically modified by exception processing and subroutine calls and returns. however, w15 can be ref- erenced by any instruction in the same manner as all other w registers. this simplifies the reading, writing and manipulation of the stack pointer (e.g., creating stack frames). w15 is initialized to 0x0800 during a reset. the user may reprogram the sp during initialization to any location within data space. w14 has been dedicated as a stack frame pointer as defined by the lnk and ulnk instructions. however, w14 can be referenced by any instruction in the same manner as all other w registers. 2.2.2 status register the dspic dsc core has a 16-bit status register (sr), the lsb of which is referred to as the sr low byte (srl) and the msb as the sr high byte (srh). see figure 2-1 for sr layout. srl contains all the mcu alu operation status flags (including the z bit), as well as the cpu interrupt prior- ity level status bits, ipl<2:0>, and the repeat active status bit, ra. during exception processing, srl is concatenated with the msb of the pc to form a complete word value which is then stacked. the upper byte of the sr register contains the dsp adder/subtracter status bits, the do loop active bit (da) and the digit carry (dc) status bit. 2.2.3 program counter the program counter is 23 bits wide. bit 0 is always clear. therefore, the pc can address up to 4m instruction words. note: in order to protect against misaligned stack accesses, w15<0> is always clear.
? 2008 microchip technology inc. ds70141e-page 17 dspic30f3010/3011 figure 2-1: programmer?s model tabpag pc22 pc0 7 0 d0 d15 program counter data table page address status register working registers dsp operand registers w1 w2 w3 w4 w5 w6 w7 w8 w9 w10 w11 w12/dsp offset w13/dsp write back w14/frame pointer w15/stack pointer dsp address registers ad39 ad0 ad31 dsp accumulators acca accb p svp ag 0 program space visibility page address z 0 oa ob sa sb rcount 15 0 repeat loop counter dcount 15 0 do loop counter dostart 22 0 do loop start address ipl2 ipl1 splim stack pointer limit register ad15 srl push.s shadow do shadow oab sab 15 0 core configuration register legend corcon da dc ra n tblpag psvpag ipl0 ov w0/wreg srh do loop end address doend 22 c 7
dspic30f3010/3011 ds70141e-page 18 ? 2008 microchip technology inc. 2.3 divide support the dspic dsc devices feature a 16/16-bit signed fractional divide operation, as well as 32/16-bit and 16/ 16-bit signed and unsigned integer divide operations, in the form of single instruction iterative divides. the following instructions and data sizes are supported: 1. divf ? 16/16 signed fractional divide 2. div.sd ? 32/16 signed divide 3. div.ud ? 32/16 unsigned divide 4. div.sw ? 16/16 signed divide 5. div.uw ? 16/16 unsigned divide the divide instructions must be executed within a repeat loop. any other form of execution (e.g. a series of discrete divide instructions) will not function correctly because the instruction flow depends on rcount. the divide instruction does not automatically set up the rcount value, and it must, therefore, be explicitly and correctly specified in the repeat instruction, as shown in table 2-1 ( repeat will execute the target instruction {operand value + 1} times). the repeat loop count must be set up for 18 iterations of the div/divf instruc- tion. thus, a complete divide operation requires 19 cycles. table 2-1: divide instructions 2.4 dsp engine the dsp engine consists of a high-speed 17-bit x 17-bit multiplier, a barrel shifter, and a 40-bit adder/ subtracter (with two target accumulators, round and saturation logic). the dspic30f devices have a single instruction flow which can execute either dsp or mcu instructions. many of the hardware resources are shared between the dsp and mcu instructions. for example, the instruction set has both dsp and mcu multiply instructions which use the same hardware multiplier. the dsp engine also has the capability to perform inherent accumulator-to-accumulator operations, which require no additional data. these instructions are add , sub and neg . the dsp engine has various options selected through various bits in the cpu core configuration register (corcon), as listed below: 1. fractional or integer dsp multiply (if). 2. signed or unsigned dsp multiply (us). 3. conventional or convergent rounding (rnd). 4. automatic saturation on/off for acca (sata). 5. automatic saturation on/off for accb (satb). 6. automatic saturation on/off for writes to data memory (satdw). 7. accumulator saturation mode selection (accsat). a block diagram of the dsp engine is shown in figure 2-2. note: the divide flow is interruptible. however, the user needs to save the context as appropriate. instruction function divf signed fractional divide: wm/wn w0; rem w1 div.sd signed divide: (wm + 1:wm)/wn w0; rem w1 div.sw signed divide: wm/wn w0; rem w1 div.ud unsigned divide: (wm + 1:wm)/wn w0; rem w1 div.uw unsigned divide: wm/wn w0; rem w1 table 2-2: dsp instruction summary instruction algebraic operation clr a = 0 ed a = (x ? y) 2 edac a = a + (x ? y) 2 mac a = a + (x * y) movsac no change in a mpy a = x * y mpy.n a = ? x * y msc a = a ? x * y
? 2008 microchip technology inc. ds70141e-page 19 dspic30f3010/3011 figure 2-2: dsp engine block diagram zero backfill sign-extend barrel shifter 40-bit accumulator a 40-bit accumulator b round logic x data bus to/from w array adder saturate negate 32 32 33 16 16 16 16 40 40 40 40 s a t u r a t e y data bus 40 carry/borrow out carry/borrow in 16 40 multiplier/scaler 17-bit
dspic30f3010/3011 ds70141e-page 20 ? 2008 microchip technology inc. 2.4.1 multiplier the 17x17-bit multiplier is capable of signed or unsigned operation and can multiplex its output using a scaler to support either 1.31 fractional (q31) or 32-bit integer results. unsigned operands are zero-extended into the 17th bit of the multiplier input value. signed operands are sign-extended into the 17th bit of the multiplier input value. the output of the 17x17-bit multiplier/scaler is a 33-bit value, which is sign- extended to 40 bits. integer data is inherently represented as a signed two?s complement value, where the msb is defined as a sign bit. generally speaking, the range of an n-bit two?s complement integer is -2 n-1 to 2 n-1 ? 1. for a 16-bit integer, the data range is -32768 (0x8000) to 32767 (0x7fff), including 0. for a 32-bit integer, the data range is -2,147,483,648 (0x8000 0000) to 2,147,483,645 (0x7fff ffff). when the multiplier is configured for fractional multipli- cation, the data is represented as a two?s complement fraction, where the msb is defined as a sign bit and the radix point is implied to lie just after the sign bit (qx format). the range of an n-bit two?s complement fraction with this implied radix point is -1.0 to (1-2 1-n ). for a 16-bit fraction, the q15 data range is -1.0 (0x8000) to 0.999969482 (0x7fff), including 0 and has a precision of 3.01518x10 -5 . in fractional mode, a 16x16 multiply operation generates a 1.31 product, which has a precision of 4.65661x10 -10 . the same multiplier is used to support the mcu multiply instructions, which includes integer 16-bit signed, unsigned and mixed sign multiplies. the mul instruction may be directed to use byte or word-sized operands. byte operands will direct a 16-bit result, and word operands will direct a 32-bit result to the specified register(s) in the w array. 2.4.2 data accumulators and adder/subtracter the data accumulator consists of a 40-bit adder/sub- tracter with automatic sign extension logic. it can select one of two accumulators (a or b) as its pre- accumulation source and post-accumulation destina- tion. for the add and lac instructions, the data to be accumulated or loaded can be optionally scaled via the barrel shifter, prior to accumulation. 2.4.2.1 adder/subtracter, overflow and saturation the adder/subtracter is a 40-bit adder with an optional zero input into one side and either true or complement data into the other input. in the case of addition, the carry/borrow input is active-high and the other input is true data (not complemented), whereas in the case of subtraction, the carry/borrow input is active-low and the other input is complemented. the adder/subtracter generates overflow status bits, sa/sb and oa/ob, which are latched and reflected in the status register. ? overflow from bit 39: this is a catastrophic overflow in which the sign of the accumulator is destroyed. ? overflow into guard bits 32 through 39: this is a recoverable overflow. this bit is set whenever all the guard bits are not identical to each other. the adder has an additional saturation block which controls accumulator data saturation, if selected. it uses the result of the adder, the overflow status bits described above, and the sata/b (corcon<7:6>) and accsat (corcon<4>) mode control bits to determine when and to what value to saturate. six status register bits have been provided to support saturation and overflow; they are: 1. oa: acca overflowed into guard bits 2. ob: accb overflowed into guard bits 3. sa: acca saturated (bit 31 overflow and saturation) or acca overflowed into guard bits and saturated (bit 39 overflow and saturation) 4. sb: accb saturated (bit 31 overflow and saturation) or accb overflowed into guard bits and saturated (bit 39 overflow and saturation) 5. oab: logical or of oa and ob 6. sab: logical or of sa and sb the oa and ob bits are modified each time data passes through the adder/subtracter. when set, they indicate that the most recent operation has overflowed into the accumulator guard bits (bits 32 through 39). the oa and ob bits can also optionally generate an arithmetic warn- ing trap when set and the corresponding overflow trap flag enable bit (ovate, ovbte) in the intcon1 regis- ter (refer to section 5.0 ?interrupts? ) is set. this allows the user to take immediate action, for example, to correct system gain.
? 2008 microchip technology inc. ds70141e-page 21 dspic30f3010/3011 the sa and sb bits are modified each time data passes through the adder/subtracter, but can only be cleared by the user. when set, they indicate that the accumulator has overflowed its maximum range (bit 31 for 32-bit saturation, or bit 39 for 40-bit saturation) and will be saturated (if saturation is enabled). when saturation is not enabled, sa and sb default to bit 39 overflow and thus indicate that a catastrophic overflow has occurred. if the covte bit in the intcon1 register is set, sa and sb bits will generate an arithmetic warning trap when saturation is disabled. the overflow and saturation status bits can optionally be viewed in the status register (sr) as the logical or of oa and ob (in bit oab) and the logical or of sa and sb (in bit sab). this allows programmers to check one bit in the status register to determine if either accumulator has overflowed, or one bit to determine if either accumulator has saturated. this would be useful for complex number arithmetic which typically uses both the accumulators. the device supports three saturation and overflow modes. 1. bit 39 overflow and saturation: when bit 39 overflow and saturation occurs, the saturation logic loads the maximally positive 9.31 (0x7fffffffff) or maximally negative 9.31 value (0x8000000000) into the target accumulator. the sa or sb bit is set and remains set until cleared by the user. this is referred to as ?super saturation? and provides protection against erroneous data or unexpected algorithm problems (e.g., gain calculations). 2. bit 31 overflow and saturation: when bit 31 overflow and saturation occurs, the saturation logic then loads the maximally positive 1.31 value (0x007fffffff) or maximally negative 1.31 value (0x0080000000) into the target accumulator. the sa or sb bit is set and remains set until cleared by the user. when this saturation mode is in effect, the guard bits are not used (so the oa, ob or oab bits are never set). 3. bit 39 catastrophic overflow the bit 39 overflow status bit from the adder is used to set the sa or sb bit, which remain set until cleared by the user. no saturation operation is performed and the accumulator is allowed to overflow (destroying its sign). if the covte bit in the intcon1 register is set, a catastrophic overflow can initiate a trap exception. 2.4.2.2 accumulator ?write back? the mac class of instructions (with the exception of mpy, mpy.n, ed and edac ) can optionally write a rounded version of the high word (bits 31 through 16) of the accumulator that is not targeted by the instruction into data space memory. the write is performed across the x bus into combined x and y address space. the following addressing modes are supported: 1. w13, register direct: the rounded contents of the non-target accumulator are written into w13 as a 1.15 fraction. 2. [w13]+=2, register indirect with post-increment: the rounded contents of the non-target accumu- lator are written into the address pointed to by w13 as a 1.15 fraction. w13 is then incremented by 2 (for a word write). 2.4.2.3 round logic the round logic is a combinational block, which per- forms a conventional (biased) or convergent (unbiased) round function during an accumulator write (store). the round mode is determined by the state of the rnd bit in the corcon register. it generates a 16-bit, 1.15 data value which is passed to the data space write saturation logic. if rounding is not indicated by the instruction, a truncated 1.15 data value is stored and the least significant word (lsw) is simply discarded. conventional rounding takes bit 15 of the accumulator, zero-extends it and adds it to the accxh word (bits 16 through 31 of the accumulator). if the accxl word (bits 0 through 15 of the accumulator) is between 0x8000 and 0xffff (0x8000 included), accxh is incremented. if accxl is between 0x0000 and 0x7fff, accxh is left unchanged. a consequence of this algorithm is that over a succession of random rounding operations, the value will tend to be biased slightly positive. convergent (or unbiased) rounding operates in the same manner as conventional rounding, except when accxl equals 0x8000. if this is the case, the lsb (bit 16 of the accumulator) of accxh is examined. if it is ? 1 ?, accxh is incremented. if it is ? 0 ?, accxh is not modified. assuming that bit 16 is effectively random in nature, this scheme will remove any rounding bias that may accumulate. the sac and sac.r instructions store either a trun- cated ( sac ) or rounded ( sac.r ) version of the contents of the target accumulator to data memory, via the x bus (subject to data saturation, see section 2.4.2.4 ?data space write saturation? ). note that for the mac class of instructions, the accumulator write-back operation will function in the same manner, addressing combined mcu (x and y) data space though the x bus. for this class of instructions, the data is always subject to rounding.
dspic30f3010/3011 ds70141e-page 22 ? 2008 microchip technology inc. 2.4.2.4 data space write saturation in addition to adder/subtracter saturation, writes to data space may also be saturated, but without affecting the contents of the source accumulator. the data space write saturation logic block accepts a 16-bit, 1.15 fractional value from the round logic block as its input, together with overflow status from the original source (accumulator) and the 16-bit round adder. these are combined and used to select the appropriate 1.15 fractional value as output to write to data space memory. if the satdw bit in the corcon register is set, data (after rounding or truncation) is tested for overflow and adjusted accordingly. for input data greater than 0x007fff, data written to memory is forced to the maximum positive 1.15 value, 0x7fff. for input data less than 0xff8000, data written to memory is forced to the maximum negative 1.15 value, 0x8000. the msb of the source (bit 39) is used to determine the sign of the operand being tested. if the satdw bit in the corcon register is not set, the input data is always passed through unmodified under all conditions. 2.4.3 barrel shifter the barrel shifter is capable of performing up to 16-bit arithmetic or logic right shifts, or up to 16-bit left shifts in a single cycle. the source can be either of the two dsp accumulators or the x bus (to support multi-bit shifts of register or memory data). the shifter requires a signed binary value to determine both the magnitude (number of bits) and direction of the shift operation. a positive value will shift the operand right. a negative value will shift the operand left. a value of ? 0 ? will not modify the operand. the barrel shifter is 40 bits wide, thereby obtaining a 40-bit result for dsp shift operations and a 16-bit result for mcu shift operations. data from the x bus is presented to the barrel shifter between bit positions 16 to 31 for right shifts, and bit positions 0 to 15 for left shifts.
? 2008 microchip technology inc. ds70141e-page 23 dspic30f3010/3011 3.0 memory organization 3.1 program address space the program address space is 4m instruction words. it is addressable by the 23-bit pc, table instruction effective address (ea) or data space ea, when program space is mapped into data space, as defined by table 3-1. note that the program space address is incremented by two between successive program words in order to provide compatibility with data space addressing. user program space access is restricted to the lower 4m instruction word address range (0x000000 to 0x7ffffe) for all accesses other than tblrd/tblwt , which use tblpag<7> to determine user or configura- tion space access. in table 3-1, read/write instructions, bit 23 allows access to the device id, the user id and the configuration bits; otherwise, bit 23 is always clear. figure 3-1: program space memory map for dspic30f3010/3011 note: this data sheet summarizes features of this group of dspic30f devices and is not intended to be a complete reference source. for more information on the cpu, peripherals, register descriptions and gen- eral device functionality, refer to the ? dspic30f family reference manual ? (ds70046). for more information on the device instruction set and programming, refer to the ? dspic30f/33f programmer?s reference manual? (ds70157). reset - target address user memory space 000000 00007e 000002 000080 device configuration user flash program memory 004000 003ffe configuration memory space data eeprom (8k instructions) (1 kbyte) 800000 f80000 registers f8000e f80010 devid (2) fefffe ff0000 fffffe reserved f7fffe reserved 7ffc00 7ffbfe (read 0?s) 8005fe 800600 unitid (32 instr.) 8005be 8005c0 reset - goto instruction 000004 reserved 7ffffe reserved 000100 0000fe 000084 alternate vector table reserved interrupt vector table vector tables
dspic30f3010/3011 ds70141e-page 24 ? 2008 microchip technology inc. table 3-1: program space address construction figure 3-2: data access from program space address generation access type access space program space address <23> <22:16> <15> <14:1> <0> instruction access user 0 pc<22:1> 0 tblrd/tblwt user (tblpag<7> = 0 ) tblpag<7:0> data ea <15:0> tblrd/tblwt configuration (tblpag<7> = 1 ) tblpag<7:0> data ea <15:0> program space visibility user 0 psvpag<7:0> data ea <14:0> 0 program counter 23 bits 1 psvpag reg 8 bits ea 15 bits program using select tblpag reg 8 bits ea 16 bits using byte 24-bit ea 0 0 1/0 select user/ configuration table instruction program space counter using space select note: program space visibility cannot be used to access bits<23:16> of a word in program memory. visibility
? 2008 microchip technology inc. ds70141e-page 25 dspic30f3010/3011 3.1.1 data access from program memory using table instructions this architecture fetches 24-bit wide program memory. consequently, instructions are always aligned. how- ever, as the architecture is modified harvard, data can also be present in program space. there are two methods by which program space can be accessed: via special table instructions, or through the remapping of a 16k word program space page into the upper half of data space (see section 3.1.2 ?data access from program memory using program space visibility? ). the tblrdl and tblwtl instruc- tions offer a direct method of reading or writing the lsw of any address within program space, without going through data space. the tblrdh and tblwth instruc- tions are the only method whereby the upper 8 bits of a program space word can be accessed as data. the pc is incremented by two for each successive 24-bit program word. this allows program memory addresses to directly map to data space addresses. program memory can thus be regarded as two 16-bit word-wide address spaces, residing side by side, each with the same address range. tblrdl and tblwtl access the space which contains the lsw, and tblrdh and tblwth access the space which contains the msb. figure 3-2 shows how the ea is created for table oper- ations and data space accesses (psv = 1 ). here, p<23:0> refers to a program space word, whereas d<15:0> refers to a data space word. a set of table instructions are provided to move byte or word-sized data to and from program space. 1. tblrdl: table read low word: read the lsw of the program address; p<15:0> maps to d<15:0>. byte: read one of the lsbs of the program address; p<7:0> maps to the destination byte when byte select = 0 ; p<15:8> maps to the destination byte when byte select = 1 . 2. tblwtl: table write low (refer to section 6.0 ?flash program memory? for details on flash programming). 3. tblrdh: table read high word: read the msw of the program address; p<23:16> maps to d<7:0>; d<15:8> will always be = 0 . byte: read one of the msbs of the program address; p<23:16> maps to the destination byte when byte select = 0 ; the destination byte will always be = 0 when byte select = 1 . 4. tblwth: table write high (refer to section 6.0 ?flash program memory? for details on flash programming). figure 3-3: program dat a table access (lsw) 0 8 16 pc address 0x000000 0x000002 0x000004 0x000006 23 00000000 00000000 00000000 00000000 program memory ?phantom? byte (read as ? 0 ?). tblrdl.w tblrdl.b (wn<0> = 1) tblrdl.b (wn<0> = 0)
dspic30f3010/3011 ds70141e-page 26 ? 2008 microchip technology inc. figure 3-4: program data table access (msb) 3.1.2 data access from program memory using program space visibility the upper 32 kbytes of data space may optionally be mapped into any 16k word program space page. this provides transparent access of stored constant data from x data space, without the need to use special instructions (i.e., tblrdl/h, tblwtl/h instructions). program space access through the data space occurs if the msb of the data space, ea, is set and program space visibility is enabled, by setting the psv bit in the core control register (corcon). the functions of corcon are discussed in section 2.4 ?dsp engine? . data accesses to this area add an additional cycle to the instruction being executed, since two program memory fetches are required. note that the upper half of addressable data space is always part of the x data space. therefore, when a dsp operation uses program space mapping to access this memory region, y data space should typically contain state (variable) data for dsp operations, whereas x data space should typically contain coefficient (constant) data. although each data space address, 0x8000 and higher, maps directly into a corresponding program memory address (see figure 3-5), only the lower 16 bits of the 24-bit program word are used to contain the data. the upper 8 bits should be programmed to force an illegal instruction to maintain machine robustness. refer to the ? dspic30f/33f programmer?s reference manual? (ds70157) for details on instruction encoding. note that by incrementing the pc by 2 for each program memory word, the 15 lsbs of data space addresses directly map to the 15 lsbs in the corresponding program space addresses. the remaining bits are provided by the program space visibility page register, psvpag<7:0>, as shown in figure 3-5. for instructions that use psv which are executed outside a repeat loop: ? the following instructions will require one instruc- tion cycle in addition to the specified execution time: - mac class of instructions with data operand prefetch - mov instructions - mov.d instructions ? all other instructions will require two instruction cycles in addition to the specified execution time of the instruction. for instructions that use psv which are executed inside a repeat loop: ? the following instances will require two instruction cycles in addition to the specified execution time of the instruction: - execution in the first iteration - execution in the last iteration - execution prior to exiting the loop due to an interrupt - execution upon re-entering the loop after an interrupt is serviced ? any other iteration of the repeat loop will allow the instruction, accessing data using psv, to execute in a single cycle. 0 8 16 pc address 0x000000 0x000002 0x000004 0x000006 23 00000000 00000000 00000000 00000000 program memory ?phantom? byte (read as ? 0 ?) tblrdh.w tblrdh.b (wn<0> = 1) tblrdh.b (wn<0> = 0) note: psv access is temporarily disabled during table reads/writes.
? 2008 microchip technology inc. ds70141e-page 27 dspic30f3010/3011 figure 3-5: data space window into program space operation 3.2 data address space the core has two data spaces. the data spaces can be considered either separate (for some dsp instruc- tions), or as one unified linear address range (for mcu instructions). the data spaces are accessed using two address generation units (agus) and separate data paths. 3.2.1 data space memory map the data space memory is split into two blocks, x and y data space. a key element of this architecture is that y space is a subset of x space, and is fully contained within x space. in order to provide an apparent linear addressing space, x and y spaces have contiguous addresses. when executing any instruction other than one of the mac class of instructions, the x block consists of the 64 kbyte data address space (including all y addresses). when executing one of the mac class of instructions, the x block consists of the 64 kbyte data address space excluding the y address block (for data reads only). in other words, all other instructions regard the entire data memory as one composite address space. the mac class instructions extract the y address space from data space and address it using eas sourced from w10 and w11. the remaining x data space is addressed using w8 and w9. both address spaces are concurrently accessed only with the mac class instructions. a data space memory map is shown in figure 3-6. figure 3-7 shows a graphical summary of how x and y data spaces are accessed for mcu and dsp instructions. 23 15 0 psvpag (1) 15 15 ea<15> = 0 ea<15> = 1 16 data space ea data space program space 8 15 23 0x0000 0x8000 0xffff 0x00 0x003ffe data read upper half of data space is mapped into program space note: psvpag is an 8-bit register, containing bits<22:15> of the program space address (i.e., it defines the page in program space to which the upper half of data space is being mapped). 0x001200 address concatenation bset corcon,#2 ; psv bit set mov #0x00, w0 ; set psvpag register mov w0, psvpag mov 0x9200, w0 ; access program memory location ; using a data space access 0x000100
dspic30f3010/3011 ds70141e-page 28 ? 2008 microchip technology inc. figure 3-6: dspic30f3010/3011 data space memory map 0x0000 0x07fe 0x09fe 0xfffe lsb address 16 bits lsb msb msb address 0x0001 0x07ff 0x09ff 0xffff 0x8001 0x8000 optionally mapped into program memory 0x0bff 0xbfe 0x0c00 0x0c01 0x0801 0x0800 0x0a01 0x0a00 near data 2 kbyte sfr space 1 kbyte sram space 3072 bytes space unimplemented (x) x data sfr space x data ram (x) y data ram (y)
? 2008 microchip technology inc. ds70141e-page 29 dspic30f3010/3011 figure 3-7: data space for mcu and dsp ( mac class) instructions example sfr space (y space) x space sfr space unused x space x space y space unused unused non- mac class ops (read/write) mac class ops read-only indirect ea using any w indirect ea using w10, w11indirect ea using w8, w9 mac class ops (write)
dspic30f3010/3011 ds70141e-page 30 ? 2008 microchip technology inc. 3.2.2 data spaces the x data space is used by all instructions and sup- ports all addressing modes. there are separate read and write data buses. the x read data bus is the return data path for all instructions that view data space as combined x and y address space. it is also the x address space data path for the dual operand read instructions ( mac class). the x write data bus is the only write path to data space for all instructions. the x data space also supports modulo addressing for all instructions, subject to addressing mode restric- tions. bit-reversed addressing is only supported for writes to x data space. the y data space is used in concert with the x data space by the mac class of instructions ( clr, ed, edac, mac, movsac, mpy, mpy.n and msc ) to provide two concurrent data read paths. no writes occur across the y bus. this class of instructions dedicates two w register pointers, w10 and w11, to always address y data space, independent of x data space, whereas w8 and w9 always address x data space. note that during accumulator write back, the data address space is considered a combination of x and y data spaces, so the write occurs across the x bus. consequently, the write can be to any address in the entire data space. the y data space can only be used for the data prefetch operation associated with the mac class of instructions. it also supports modulo addressing for automated circular buffers. of course, all other instruc- tions can access the y data address space through the x data path, as part of the composite linear space. the boundary between the x and y data spaces is defined as shown in figure 3-6 and is not user- programmable. should an ea point to data outside its own assigned address space, or to a location outside physical memory, an all zero word/byte will be returned. for example, although y address space is visible by all non- mac instructions using any addressing mode, an attempt by a mac instruction to fetch data from that space, using w8 or w9 (x space pointers), will return 0x0000. all effective addresses are 16 bits wide and point to bytes within the data space. therefore, the data space address range is 64 kbytes or 32k words. 3.2.3 data space width the core data width is 16 bits. all internal registers are organized as 16-bit wide words. data space memory is organized in byte addressable, 16-bit wide blocks. 3.2.4 data alignment to help maintain backward compatibility with pic ? mcu devices and improve data space memory usage efficiency, the dspic30f instruction set supports both word and byte operations. data is aligned in data mem- ory and registers as words, but all data space eas resolve to bytes. data byte reads will read the complete word, which contains the byte, using the lsb of any ea to determine which byte to select. the selected byte is placed onto the lsb of the x data path (no byte accesses are possible from the y data path as the mac class of instruction can only fetch words). that is, data memory and registers are organized as two parallel byte-wide entities with shared (word) address decode, but separate write lines. data byte writes only write to the corresponding side of the array or register which matches the byte address. as a consequence of this byte accessibility, all effective address calculations (including those generated by the dsp operations, which are restricted to word-sized data) are internally scaled to step through word-aligned memory. for example, the core would recognize that post-modified register indirect addressing mode, [ws++], will result in a value of ws + 1 for byte operations and ws + 2 for word operations. all word accesses must be aligned to an even address. misaligned word data fetches are not supported, so care must be taken when mixing byte and word opera- tions, or translating from 8-bit mcu code. should a mis- aligned read or write be attempted, an address error trap will be generated. if the error occurred on a read, the instruction underway is completed, whereas if it occurred on a write, the instruction will be executed but the write will not occur. in either case, a trap will then be executed, allowing the system and/or user to exam- ine the machine state prior to execution of the address fault. figure 3-8: data alignment table 3-2: effect of invalid memory accesses attempted operation data returned ea = an unimplemented address 0x0000 w8 or w9 used to access y data space in a mac instruction 0x0000 w10 or w11 used to access x data space in a mac instruction 0x0000 15 8 7 0 0001 0003 0005 0000 0002 0004 byte 1 byte 0 byte 3 byte 2 byte 5 byte 4 lsb msb
? 2008 microchip technology inc. ds70141e-page 31 dspic30f3010/3011 all byte loads into any w register are loaded into the lsb. the msb is not modified. a sign-extend ( se ) instruction is provided to allow users to translate 8-bit signed data to 16-bit signed values. alternatively, for 16-bit unsigned data, users can clear the msb of any w register by executing a zero-extend ( ze ) instruction on the appropriate address. although most instructions are capable of operating on word or byte data sizes, it should be noted that some instructions, including the dsp instructions, operate only on words. 3.2.5 near data space an 8 kbyte ?near? data space is reserved in x address memory space between 0x0000 and 0x1fff, which is directly addressable via a 13-bit absolute address field within all memory direct instructions. the remaining x address space and all of the y address space is addressable indirectly. additionally, the whole of x data space is addressable using mov instructions, which support memory direct addressing with a 16-bit address field. 3.2.6 software stack the dspic dsc device contains a software stack. w15 is used as the stack pointer. the stack pointer always points to the first available free word and grows from lower addresses towards higher addresses. it pre-decrements for stack pops and post-increments for stack pushes, as shown in figure 3-9. note that for a pc push during any call instruction, the msb of the pc is zero-extended before the push, ensuring that the msb is always clear. there is a stack pointer limit register (splim) associ- ated with the stack pointer. splim is uninitialized at reset. as is the case for the stack pointer, splim<0> is forced to ? 0 ?, because all stack operations must be word-aligned. whenever an effective address (ea) is generated using w15 as a source or destination pointer, the address thus generated is compared with the value in splim. if the contents of the stack pointer (w15) and the splim register are equal and a push operation is performed, a stack error trap will not occur. the stack error trap will occur on a subsequent push operation. thus, for example, if it is desirable to cause a stack error trap when the stack grows beyond address 0x2000 in ram, initialize the splim with the value, 0x1ffe. similarly, a stack pointer underflow (stack error) trap is generated when the stack pointer address is found to be less than 0x0800, thus preventing the stack from interfering with the special function register (sfr) space. a write to the splim register should not be immediately followed by an indirect read operation using w15. figure 3-9: call stack frame note: a pc push during exception processing will concatenate the srl register to the msb of the pc prior to the push. pc<15:0> 000000000 0 15 w15 (before call ) w15 (after call ) stack grows towards higher address push : [w15++] pop : [--w15] 0x0000 pc<22:16>
dspic30f3010/3011 ds70141e-page 32 ? 2008 microchip technology inc. table 3-3: core register map (1) sfr name address (home) bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 reset state w0 0000 w0/wreg 0000 0000 0000 0000 w1 0002 w1 0000 0000 0000 0000 w2 0004 w2 0000 0000 0000 0000 w3 0006 w3 0000 0000 0000 0000 w4 0008 w4 0000 0000 0000 0000 w5 000a w5 0000 0000 0000 0000 w6 000c w6 0000 0000 0000 0000 w7 000e w7 0000 0000 0000 0000 w8 0010 w8 0000 0000 0000 0000 w9 0012 w9 0000 0000 0000 0000 w10 0014 w10 0000 0000 0000 0000 w11 0016 w11 0000 0000 0000 0000 w12 0018 w12 0000 0000 0000 0000 w13 001a w13 0000 0000 0000 0000 w14 001c w14 0000 0000 0000 0000 w15 001e w15 0000 1000 0000 0000 splim 0020 splim 0000 0000 0000 0000 accal 0022 accal 0000 0000 0000 0000 accah 0024 accah 0000 0000 0000 0000 accau 0026 sign-extension (acca<39>) accau 0000 0000 0000 0000 accbl 0028 accbl 0000 0000 0000 0000 accbh 002a accbh 0000 0000 0000 0000 accbu 002c sign-extension (accb<39>) accbu 0000 0000 0000 0000 pcl 002e pcl 0000 0000 0000 0000 pch 0030 ? ? ? ? ? ? ? ? ?pch 0000 0000 0000 0000 tblpag 0032 ? ? ? ? ? ? ? ?tblpag 0000 0000 0000 0000 psvpag 0034 ? ? ? ? ? ? ? ?psvpag 0000 0000 0000 0000 rcount 0036 rcount uuuu uuuu uuuu uuuu dcount 0038 dcount uuuu uuuu uuuu uuuu dostartl 003a dostartl 0 uuuu uuuu uuuu uuu0 dostarth 003c ? ? ? ? ? ? ? ? ?dostarth 0000 0000 0uuu uuuu doendl 003e doendl 0 uuuu uuuu uuuu uuu0 doendh 0040 ? ? ? ? ? ? ? ? ? doendh 0000 0000 0uuu uuuu sr 0042 oa ob sa sb oab sab da dc ipl2 ipl1 ipl0 ra n ov z c 0000 0000 0000 0000 legend: u = uninitialized bit; ? = unimplemented bit, read as ? 0 ? note 1: refer to ? dspic30f family reference manual? (ds70046) for descriptions of register bit fields.
? 2008 microchip technology inc. ds70141e-page 33 dspic30f3010/3011 corcon 0044 ? ? ? us edt dl2 dl1 dl0 sata satb satdw accsat ipl3 psv rnd if 0000 0000 0010 0000 modcon 0046 xmoden ymoden ? ? bwm<3:0> ywm<3:0> xwm<3:0> 0000 0000 0000 0000 xmodsrt 0048 xs<15:1> 0 uuuu uuuu uuuu uuu0 xmodend 004a xe<15:1> 1 uuuu uuuu uuuu uuu1 ymodsrt 004c ys<15:1> 0 uuuu uuuu uuuu uuu0 ymodend 004e ye<15:1> 1 uuuu uuuu uuuu uuu1 xbrev 0050 bren xb<14:0> uuuu uuuu uuuu uuuu disicnt 0052 ? ? disicnt<13:0> 0000 0000 0000 0000 table 3-3: core register map (1) (continued) sfr name address (home) bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 reset state legend: u = uninitialized bit; ? = unimplemented bit, read as ? 0 ? note 1: refer to ? dspic30f family reference manual? (ds70046) for descriptions of register bit fields.
dspic30f3010/3011 ds70141e-page 34 ? 2008 microchip technology inc. notes:
? 2008 microchip technology inc. ds70141e-page 35 dspic30f3010/3011 4.0 address generator units the dspic dsc core contains two independent address generator units: the x agu and y agu. the y agu supports word-sized data reads for the dsp mac class of instructions only. the dspic dsc agus support three types of data addressing: ? linear addressing ? modulo (circular) addressing ? bit-reversed addressing linear and modulo data addressing modes can be applied to data space or program space. bit-reversed addressing is only applicable to data space addresses. 4.1 instruction addressing modes the addressing modes in table 4-1 form the basis of the addressing modes optimized to support the specific features of individual instructions. the addressing modes provided in the mac class of instructions are somewhat different from those in the other instruction types. 4.1.1 file register instructions most file register instructions use a 13-bit address field (f) to directly address data present in the first 8192 bytes of data memory (near data space). most file register instructions employ a working register, w0, which is denoted as wreg in these instructions. the destination is typically either the same file register, or wreg (with the exception of the mul instruction), which writes the result to a register or register pair. the mov instruction allows additional flexibility and can access the entire data space during file register operation. 4.1.2 mcu instructions the three-operand mcu instructions are of the form: operand 3 = operand 1 operand 2 where operand 1 is always a working register (i.e., the addressing mode can only be register direct), which is referred to as wb. operand 2 can be a w register, fetched from data memory, or a 5-bit literal. the result location can be either a w register or an address location. the following addressing modes are supported by mcu instructions: ? register direct ? register indirect ? register indirect post-modified ? register indirect pre-modified ? 5-bit or 10-bit literal table 4-1: fundamental addressing modes supported note: this data sheet summarizes features of this group of dspic30f devices and is not intended to be a complete reference source. for more information on the cpu, peripherals, register descriptions and gen- eral device functionality, refer to the ? dspic30f family reference manual? (ds70046). for more information on the device instruction set and programming, refer to the ? dspic30f/33f programmer?s reference manual? (ds70157). note: not all instructions support all the address- ing modes given above. individual instructions may support different subsets of these addressing modes. addressing mode description file register direct the address of the file register is specified explicitly. register direct the contents of a register are accessed directly. register indirect the contents of wn forms the ea. register indirect post-modified the contents of wn forms the ea. wn is post-modified (incremented or decremented) by a constant value. register indirect pre-modified wn is pre-modified (incremented or decremented) by a signed constant value to form the ea. register indirect with register offset the sum of wn and wb forms the ea. register indirect with literal offset the sum of wn and a literal forms the ea.
dspic30f3010/3011 ds70141e-page 36 ? 2008 microchip technology inc. 4.1.3 move and accumulator instructions move instructions and the dsp accumulator class of instructions provide a greater degree of addressing flexibility than other instructions. in addition to the addressing modes supported by most mcu instruc- tions, move and accumulator instructions also support register indirect with register offset addressing mode, also referred to as register indexed mode. in summary, the following addressing modes are supported by move and accumulator instructions: ? register direct ? register indirect ? register indirect post-modified ? register indirect pre-modified ? register indirect with register offset (indexed) ? register indirect with literal offset ? 8-bit literal ? 16-bit literal 4.1.4 mac instructions the dual source operand dsp instructions ( clr, ed, edac, mac, mpy, mpy.n, movsac and msc ), also referred to as mac instructions, utilize a simplified set of addressing modes to allow the user to effectively manipulate the data pointers through register indirect tables. the two source operand prefetch registers must be a member of the set {w8, w9, w10, w11}. for data reads, w8 and w9 will always be directed to the x ragu and w10 and w11 will always be directed to the y agu. the effective addresses generated (before and after modification) must, therefore, be valid addresses within x data space for w8 and w9 and y data space for w10 and w11. in summary, the following addressing modes are supported by the mac class of instructions: ? register indirect ? register indirect post-modified by 2 ? register indirect post-modified by 4 ? register indirect post-modified by 6 ? register indirect with register offset (indexed) 4.1.5 other instructions besides the various addressing modes outlined above, some instructions use literal constants of various sizes. for example, bra (branch) instructions use 16-bit signed literals to specify the branch destination directly, whereas the disi instruction uses a 14-bit unsigned literal field. in some instructions, such as add acc , the source of an operand or result is implied by the opcode itself. certain operations, such as nop , do not have any operands. 4.2 modulo addressing modulo addressing is a method of providing an auto- mated means to support circular data buffers using hardware. the objective is to remove the need for soft- ware to perform data address boundary checks when executing tightly looped code, as is typical in many dsp algorithms. modulo addressing can operate in either data or program space (since the data pointer mechanism is essentially the same for both). one circular buffer can be supported in each of the x (which also provides the pointers into program space) and y data spaces. modulo addressing can operate on any w register pointer. however, it is not advisable to use w14 or w15 for modulo addressing, since these two registers are used as the stack frame pointer and stack pointer, respectively. in general, any particular circular buffer can only be configured to operate in one direction, as there are certain restrictions on the buffer start address (for incrementing buffers) or end address (for decrementing buffers) based upon the direction of the buffer. the only exception to the usage restrictions is for buffers which have a power-of-2 length. as these buffers satisfy the start and end address criteria, they may operate in a bidirectional mode, (i.e., address boundary checks will be performed on both the lower and upper address boundaries). note: for the mov instructions, the addressing mode specified in the instruction can differ for the source and destination ea. how- ever, the 4-bit wb (register offset) field is shared between both source and destination (but typically only used by one). note: not all instructions support all the address- ing modes given above. individual instructions may support different subsets of these addressing modes. note: register indirect with register offset addressing is only available for w9 (in x space) and w11 (in y space).
? 2008 microchip technology inc. ds70141e-page 37 dspic30f3010/3011 4.2.1 start and end address the modulo addressing scheme requires that a starting and an end address be specified and loaded into the 16-bit modulo buffer address registers: xmodsrt, xmodend, ymodsrt and ymodend (see table 3-3). the length of a circular buffer is not directly specified. it is determined by the difference between the corresponding start and end addresses. the maximum possible length of the circular buffer is 32k words (64 kbytes). 4.2.2 w address register selection the modulo and bit-reversed addressing control register modcon<15:0> contains enable flags, as well as a w register field to specify the w address registers. the xwm and ywm fields select which registers will operate with modulo addressing. if xwm = 15, x ragu and x wagu modulo addressing are disabled. similarly, if ywm = 15, y agu modulo addressing is disabled. the x address space pointer w register (xwm), to which modulo addressing is to be applied, is stored in modcon<3:0> (see table 3-3). modulo addressing is enabled for x data space when xwm is set to any value other than 15 and the xmoden bit is set at modcon<15>. the y address space pointer w register (ywm), to which modulo addressing is to be applied, is stored in modcon<7:4>. modulo addressing is enabled for y data space when ywm is set to any value other than 15 and the ymoden bit is set at modcon<14>. figure 4-1: modulo addressing operation example note: y-space modulo addressing ea calcula- tions assume word-sized data (lsb of every ea is always clear). 0x1100 0x1163 start addr = 0x1100 end addr = 0x1163 length = 0x0032 words byte address mov #0x1100,w0 mov w0, xmodsrt ;set modulo start address mov #0x1163,w0 mov w0,modend ;set modulo end address mov #0x8001,w0 mov w0,modcon ;enable w1, x agu for modulo mov #0x0000,w0 ;w0 holds buffer fill value mov #0x1110,w1 ;point w1 to buffer do again,#0x31 ;fill the 50 buffer locations mov w0, [w1++] ;fill the next location again: inc w0,w0 ;increment the fill value
dspic30f3010/3011 ds70141e-page 38 ? 2008 microchip technology inc. 4.2.3 modulo addressing applicability modulo addressing can be applied to the effective address (ea) calculation associated with any w regis- ter. it is important to realize that the address boundar- ies check for addresses less than or greater than the upper (for incrementing buffers) and lower (for decre- menting buffers) boundary addresses (not just equal to). address changes may, therefore, jump beyond boundaries and still be adjusted correctly. 4.3 bit-reversed addressing bit-reversed addressing is intended to simplify data re-ordering for radix-2 fft algorithms. it is supported by the x agu for data writes only. the modifier, which may be a constant value or register contents, is regarded as having its bit order reversed. the address source and destination are kept in normal order. thus, the only operand requiring reversal is the modifier. 4.3.1 bit-reversed addressing implementation bit-reversed addressing is enabled when: 1. bwm (w register selection) in the modcon register is any value other than 15 (the stack can not be accessed using bit-reversed addressing) and 2. the bren bit is set in the xbrev register and 3. the addressing mode used is register indirect with pre-increment or post-increment. if the length of a bit-reversed buffer is m = 2 n bytes, then the last ?n? bits of the data buffer start address must be zeros. xb<14:0> is the bit-reversed address modifier or ?pivot point? which is typically a constant. in the case of an fft computation, its value is equal to half of the fft data buffer size. when enabled, bit-reversed addressing will only be executed for register indirect with pre-increment or post-increment addressing and word-sized data writes. it will not function for any other addressing mode or for byte-sized data, and normal addresses will be generated instead. when bit-reversed addressing is active, the w address pointer will always be added to the address modifier (xb) and the offset associated with the register indirect addressing mode will be ignored. in addition, as word-sized data is a requirement, the lsb of the ea is ignored (and always clear). if bit-reversed addressing has already been enabled by setting the bren (xbrev<15>) bit, then a write to the xbrev register should not be immediately followed by an indirect read operation using the w register that has been designated as the bit-reversed pointer. figure 4-2: bit-reversed address example note: the modulo corrected effective address is written back to the register only when pre- modify or post-modify addressing mode is used to compute the effective address. when an address offset (e.g., [w7 + w2]) is used, modulo addressing correction is performed, but the contents of the register remains unchanged. note: all bit-reversed ea calculations assume word-sized data (lsb of every ea is always clear). the xb value is scaled accordingly to generate compatible (byte) addresses. note: modulo addressing and bit-reversed addressing should not be enabled together. in the event that the user attempts to do this, bit-reversed address- ing will assume priority when active for the x wagu, and x wagu modulo address- ing will be disabled. however, modulo addressing will continue to function in the x ragu. b3 b2 b1 0 b2 b3 b4 0 bit locations swapped left-to-right around center of binary value bit-reversed address xb = 0x0008 for a 16-word bit-reversed buffer b7 b6 b5 b1 b7 b6 b5 b4 b11 b10 b9 b8 b11 b10 b9 b8 b15 b14 b13 b12 b15 b14 b13 b12 sequential address pivot point
? 2008 microchip technology inc. ds70141e-page 39 dspic30f3010/3011 table 4-2: bit-reversed address sequence (16-entry) table 4-3: bit-reversed address modifier values for xbrev register normal address bit-reversed address a3 a2 a1 a0 decimal a3 a2 a1 a0 decimal 0000 0 0000 0 0001 1 1000 8 0010 2 0100 4 0011 3 1100 12 0100 4 0010 2 0101 5 1010 10 0110 6 0110 6 0111 7 1110 14 1000 8 0001 1 1001 9 1001 9 1010 10 0101 5 1011 11 1101 13 1100 12 0011 3 1101 13 1011 11 1110 14 0111 7 1111 15 1111 15 buffer size (words) xb<14:0> bit-reversed address modifier value 512 0x0100 256 0x0080 128 0x0040 64 0x0020 32 0x0010 16 0x0008 80x0004 40x0002 20x0001
dspic30f3010/3011 ds70141e-page 40 ? 2008 microchip technology inc. notes:
? 2008 microchip technology inc. ds70141e-page 41 dspic30f3010/3011 5.0 interrupts the dspic30f3010/3011 has 29 interrupt sources and 4 processor exceptions (traps), which must be arbitrated based on a priority scheme. the cpu is responsible for reading the interrupt vector table (ivt) and transferring the address con- tained in the interrupt vector to the program counter. the interrupt vector is transferred from the program data bus into the program counter via a 24-bit wide multiplexer on the input of the program counter. the interrupt vector table (ivt) and alternate interrupt vector table (aivt) are placed near the beginning of program memory (0x000004). the ivt and aivt are shown in figure 5-1. the interrupt controller is responsible for pre- processing the interrupts and processor exceptions, prior to their being presented to the processor core. the peripheral interrupts and traps are enabled, prioritized and controlled using centralized special function registers (sfr): ? ifs0<15:0>, ifs1<15:0>, ifs2<15:0> all interrupt request flags are maintained in these three registers. the flags are set by their respec- tive peripherals or external signals, and they are cleared via software. ? iec0<15:0>, iec1<15:0>, iec2<15:0> all interrupt enable control bits are maintained in these three registers. these control bits are used to individually enable interrupts from the peripherals or external signals. ? ipc0<15:0>... ipc11<7:0> the user-assignable priority level associated with each of these interrupts is held centrally in these twelve registers. ? ipl<3:0> the current cpu priority level is explicitly stored in the ipl bits. ipl<3> is present in the corcon register, whereas ipl<2:0> are present in the status register (sr) in the processor core. ? intcon1<15:0>, intcon2<15:0> global interrupt control functions are derived from these two registers. intcon1 contains the control and status flags for the processor exceptions. the intcon2 register controls the external interrupt request signal behavior and the use of the alternate vector table. all interrupt sources can be user-assigned to one of 7 priority levels, 1 through 7, via the ipcx registers. each interrupt source is associated with an interrupt vector, as shown in table 5-1. levels 7 and 1 repre- sent the highest and lowest maskable priorities, respectively. if the nstdis bit (intcon1<15>) is set, nesting of interrupts is prevented. thus, if an interrupt is currently being serviced, processing of a new interrupt is prevented, even if the new interrupt is of higher priority than the one currently being serviced. certain interrupts have specialized control bits for features like edge or level triggered interrupts, inter- rupt-on-change, etc. control of these features remains within the peripheral module which generates the interrupt. the disi instruction can be used to disable the processing of interrupts of priorities 6 and lower for a certain number of instructions, during which the disi bit (intcon2<14>) remains set. when an interrupt is serviced, the pc is loaded with the address stored in the vector location in program memory that corresponds to the interrupt. there are 63 different vectors within the ivt (refer to figure 5-2). these vectors are contained in locations 0x000004 through 0x0000fe of program memory (refer to figure 5-2). these locations contain 24-bit addresses, and in order to preserve robustness, an address error trap will take place should the pc attempt to fetch any of these words during normal execution. this prevents execution of random data as a result of accidentally decrementing a pc into vector space, accidentally mapping a data space address into vector space or the pc rolling over to 0x000000 after reaching the end of implemented program memory space. execution of a goto instruction to this vector space will also generate an address error trap. note: this data sheet summarizes features of this group of dspic30f devices and is not intended to be a complete reference source. for more information on the cpu, peripherals, register descriptions and gen- eral device functionality, refer to the ? dspic30f family reference manual ? (ds70046). for more information on the device instruction set and programming, refer to the ? dspic30f/33f programmer?s reference manual? (ds70157). note: interrupt flag bits get set when an interrupt condition occurs, regardless of the state of its corresponding enable bit. user software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. note: assigning a priority level of 0 to an interrupt source is equivalent to disabling that interrupt. note: the ipl bits become read-only whenever the nstdis bit has been set to ? 1 ?.
dspic30f3010/3011 ds70141e-page 42 ? 2008 microchip technology inc. 5.1 interrupt priority the user-assignable interrupt priority (ip<2:0>) bits for each individual interrupt source are located in the 3 lsbs of each nibble, within the ipcx register(s). bit 3 of each nibble is not used and is read as a ? 0 ?. these bits define the priority level assigned to a particular interrupt by the user. since more than one interrupt request source may be assigned to a specific user-assigned priority level, a means is provided to assign priority within a given level. this method is called ?natural order priority?. natural order priority is determined by the position of an interrupt in the vector table, and only affects interrupt operation when multiple interrupts with the same user-assigned priority become pending at the same time. table 5-1 lists the interrupt numbers and interrupt sources for the dspic dsc devices and their associated vector numbers. the ability for the user to assign every interrupt to one of seven priority levels implies that the user can assign a very high overall priority level to an interrupt with a low natural order priority. for example, the pwm fault a interrupt can be given a priority of 7. the int0 (external interrupt 0) may be assigned to priority level 1, thus giving it a very low effective priority. table 5-1: interrupt vector table note: the user-assignable priority levels start at 0, as the lowest priority, and level 7, as the highest priority. note 1: the natural order priority scheme has 0 as the highest priority and 53 as the lowest priority. 2: the natural order priority number is the same as the int number. int number vector number interrupt source highest natural order priority 0 8 int0 ? external interrupt 0 1 9 ic1 ? input capture 1 2 10 oc1 ? output compare 1 3 11 t1 ? timer 1 4 12 ic2 ? input capture 2 5 13 oc2 ? output compare 2 6 14 t2 ? timer 2 7 15 t3 ? timer 3 8 16 spi #1 9 17 u1rx ? uart1 receiver 10 18 u1tx ? uart1 transmitter 11 19 adc ? adc convert done 12 20 nvm ? nvm write complete 13 21 si2c ? i 2 c? slave interrupt 14 22 mi2c ? i 2 c master interrupt 15 23 input change interrupt 16 24 int1 ? external interrupt 1 17 25 ic7 ? input capture 7 18 26 ic8 ? input capture 8 19 27 oc3 ? output compare 3 * 20 28 oc4 ? output compare 4 * 21 29 t4 ? timer 4 22 30 t5 ? timer 5 23 31 int2 ? external interrupt 2 24 32 u2rx ? uart2 receiver * 25 33 u2tx ? uart2 transmitter * 26 34 reserved 27 35 reserved 28 36 reserved 29 37 reserved 30 38 reserved 31 39 reserved 32 40 reserved 33 41 reserved 34 42 reserved 35 43 reserved 36 44 reserved 37 45 reserved 38 46 reserved 39 47 pwm ? pwm period match 40 48 qei ? qei interrupt 41 49 reserved 42 50 reserved 43 51 flta ? pwm fault a 44 52 reserved 45-53 53-61 reserved lowest natural order priority * available on dspic30f3011 only
? 2008 microchip technology inc. ds70141e-page 43 dspic30f3010/3011 5.2 reset sequence a reset is not a true exception, because the interrupt controller is not involved in the reset process. the processor initializes its registers in response to a reset, which forces the pc to zero. the processor then begins program execution at location 0x000000. a goto instruction is stored in the first program memory location, immediately followed by the address target for the goto instruction. the processor executes the goto to the specified address and then begins operation at the specified target (start) address. 5.2.1 reset sources there are 6 sources of error which will cause a device reset. ? watchdog time-out: the watchdog has timed out, indicating that the processor is no longer executing the correct flow of code. ? uninitialized w register trap: an attempt to use an uninitialized w register as an address pointer will cause a reset. ? illegal instruction trap: attempted execution of any unused opcodes will result in an illegal instruction trap. note that a fetch of an illegal instruction does not result in an illegal instruction trap if that instruction is flushed prior to execution due to a flow change. ? brown-out reset (bor): a momentary dip in the power supply to the device has been detected, which may result in malfunction. ? trap lockout: occurrence of multiple trap conditions simultaneously will cause a reset. 5.3 traps traps can be considered as non-maskable interrupts, indicating a software or hardware error, which adhere to a predefined priority as shown in figure 5-1. they are intended to provide the user a means to correct erroneous operation during debug and when operating within the application. note that many of these trap conditions can only be detected when they occur. consequently, the question- able instruction is allowed to complete prior to trap exception processing. if the user chooses to recover from the error, the result of the erroneous action that caused the trap may have to be corrected. there are 8 fixed priority levels for traps: level 8 through level 15, which implies that the ipl3 is always set during processing of a trap. if the user is not currently executing a trap, and he sets the ipl<3:0> bits to a value of ? 0111 ? (level 7), then all interrupts are disabled, but traps can still be processed. 5.3.1 trap sources the following traps are provided with increasing priority. however, since all traps can be nested, priority has little effect. math error trap: the math error trap executes under the following three circumstances: 1. should an attempt be made to divide by zero, the divide operation will be aborted on a cycle boundary and the trap taken. 2. if enabled, a math error trap will be taken when an arithmetic operation on either accumulator a or b causes an overflow from bit 31 and the accumulator guard bits are not utilized. 3. if enabled, a math error trap will be taken when an arithmetic operation on either accumulator a or b causes a catastrophic overflow from bit 39 and all saturation is disabled. 4. if the shift amount specified in a shift instruction is greater than the maximum allowed shift amount, a trap will occur. note: if the user does not intend to take correc- tive action in the event of a trap error condition, these vectors must be loaded with the address of a default handler that simply contains the reset instruction. if, on the other hand, one of the vectors containing an invalid address is called, an address error trap is generated.
dspic30f3010/3011 ds70141e-page 44 ? 2008 microchip technology inc. address error trap: this trap is initiated when any of the following circumstances occurs: 1. a misaligned data word access is attempted. 2. a data fetch from our unimplemented data memory location is attempted. 3. a data access of an unimplemented program memory location is attempted. 4. an instruction fetch from vector space is attempted. 5. execution of a ? bra #litera l? instruction or a ? goto #literal ? instruction, where literal is an unimplemented program memory address. 6. executing instructions after modifying the pc to point to unimplemented program memory addresses. the pc may be modified by loading a value into the stack and executing a return instruction. stack error trap: this trap is initiated under the following conditions: 1. the stack pointer is loaded with a value which is greater than the (user-programmable) limit value written into the splim register (stack overflow). 2. the stack pointer is loaded with a value which is less than 0x0800 (simple stack underflow). oscillator fail trap: this trap is initiated if the external oscillator fails and operation becomes reliant on an internal rc backup. 5.3.2 hard and soft traps it is possible that multiple traps can become active within the same cycle (e.g., a misaligned word stack write to an overflowed address). in such a case, the fixed priority shown in figure 5-2 is implemented, which may require the user to check if other traps are pending, in order to completely correct the fault. ?soft? traps include exceptions of priority level 8 through level 11, inclusive. the arithmetic error trap (level 11) falls into this category of traps. ?hard? traps include exceptions of priority level 12 through level 15, inclusive. the address error (level 12), stack error (level 13) and oscillator error (level 14) traps fall into this category. each hard trap that occurs must be acknowledged before code execution of any type may continue. if a lower priority hard trap occurs while a higher priority trap is pending, acknowledged, or is being processed, a hard trap conflict will occur. the device is automatically reset in a hard trap conflict condition. the trapr status bit (rcon<15>) is set when the reset occurs, so that the condition may be detected in software. figure 5-1: trap vectors note: in the mac class of instructions, wherein the data space is split into x and y data space, unimplemented x space includes all of y space, and unimplemented y space includes all of x space. address error trap vector oscillator fail trap vector stack error trap vector reserved vector math error trap vector reserved oscillator fail trap vector address error trap vector reserved vector reserved vector interrupt 0 vector interrupt 1 vector ? ? ? interrupt 52 vector interrupt 53 vector math error trap vector decreasing priority 0x000000 0x000014 reserved stack error trap vector reserved vector reserved vector interrupt 0 vector interrupt 1 vector ? ? ? interrupt 52 vector interrupt 53 vector ivt aivt 0x000080 0x00007e 0x0000fe reserved 0x000094 reset ? goto instruction reset ? goto address 0x000002 reserved 0x000082 0x000084 0x000004 reserved vector
? 2008 microchip technology inc. ds70141e-page 45 dspic30f3010/3011 5.4 interrupt sequence all interrupt event flags are sampled in the beginning of each instruction cycle by the ifsx registers. a pending interrupt request (irq) is indicated by the flag bit being equal to a ? 1 ? in an ifsx register. the irq will cause an interrupt to occur if the corresponding bit in the interrupt enable (iecx) register is set. for the remainder of the instruction cycle, the priorities of all pending interrupt requests are evaluated. if there is a pending irq with a priority level greater than the current processor priority level in the ipl bits, the processor will be interrupted. the processor then stacks the current program counter and the low byte of the processor status register (srl), as shown in figure 5-2. the low byte of the status register contains the processor priority level at the time, prior to the beginning of the interrupt cycle. the processor then loads the priority level for this inter- rupt into the status register. this action will disable all lower priority interrupts until the completion of the interrupt service routine (isr). figure 5-2: interrupt stack frame the retfie (return from interrupt) instruction will unstack the program counter and status registers to return the processor to its state prior to the interrupt sequence. 5.5 alternate vector table in program memory, the interrupt vector table (ivt) is followed by the alternate interrupt vector table (aivt), as shown in figure 5-1. access to the alternate vector table is provided by the altivt bit in the intcon2 register. if the altivt bit is set, all interrupt and exception processes use the alternate vectors instead of the default vectors. the alternate vectors are organized the same as the default vectors. the aivt supports emulation and debugging efforts by providing a means to switch between an application and a support environment without requiring the interrupt vectors to be reprogrammed. this feature also enables switching between applications for evaluation of different software algorithms at run time. if the aivt is not required, the program memory allocated to the aivt may be used for other purposes. aivt is not a protected section and may be freely programmed by the user. 5.6 fast context saving a context saving option is available using shadow registers. shadow registers are provided for the dc, n, ov, z and c bits in sr, and the registers, w0 through w3. the shadows are only one level deep. the shadow registers are accessible using the push.s and pop.s instructions only. when the processor vectors to an interrupt, the push.s instruction can be used to store the current value of the aforementioned registers into their respective shadow registers. if an isr of a certain priority uses the push.s and pop.s instructions for fast context saving, then a higher priority isr should not include the same instructions. users must save the key registers in software during a lower priority interrupt if the higher priority isr uses fast context saving. 5.7 external interrupt requests the dspic30f3010/3011 interrupt controller supports three external interrupt request signals, int0-int2. these inputs are edge sensitive; they require a low-to- high or a high-to-low transition to generate an interrupt request. the intcon2 register has five bits, int0ep- int4ep, that select the polarity of the edge detection circuitry. 5.8 wake-up from sleep and idle the interrupt controller may be used to wake-up the processor from either sleep or idle modes if sleep or idle mode is active when the interrupt is generated. if an enabled interrupt request of sufficient priority is received by the interrupt controller, then the standard interrupt request is presented to the processor. at the same time, the processor will wake-up from sleep or idle and begin execution of the interrupt service routine needed to process the interrupt request. note 1: the user can always lower the priority level by writing a new value into sr. the interrupt service routine must clear the interrupt flag bits in the ifsx register before lowering the processor interrupt priority, in order to avoid recursive interrupts. 2: the ipl3 bit (corcon<3>) is always clear when interrupts are being processed. it is set only during execution of traps. 0 15 w15 (before call ) w15 (after call ) stack grows towards higher address push : [w15++] pop : [--w15] 0x0000 pc<15:0> srl ipl3 pc<22:16>
dspic30f3010/3011 ds70141e-page 46 ? 2008 microchip technology inc. table 5-2: interrupt controller register map (1) sfr name adr bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 reset state intcon1 0080 nstdis ? ? ? ? ovate ovbte covte ? ? ? matherr addrerr stkerr oscfail ? 0000 0000 0000 0000 intcon2 0082 altivt disi ? ? ? ? ? ? ? ? ? ? ? int2ep int1ep int0ep 0000 0000 0000 0000 ifs0 0084 cnif mi2cif si2cif nvmif adif u1txif u1rxif spi1if t3if t2if oc2if ic2if t1if oc1if ic1if int0if 0000 0000 0000 0000 ifs1 0086 ? ? ? ? ? ? u2txif u2rxif int2if t5if t4if oc4if oc3if ic8if ic7if int1if 0000 0000 0000 0000 ifs2 0088 ? ? ? ?fltaif ? ? qeiif pwmif ? ? ? ? ? ? ? 0000 0000 0000 0000 iec0 008c cnie mi2cie si2cie nvmie adie u1txie u1rxie spi1ie t3ie t2ie oc2ie ic2ie t1ie oc1ie ic1ie int0ie 0000 0000 0000 0000 iec1 008e ? ? ? ? ? ? u2txie u2rxie int2ie t5ie t4ie oc4ie oc3ie ic8ie ic7ie int1ie 0000 0000 0000 0000 iec2 0090 ? ? ? ?fltaie ? ? qeiie pwmie ? ? ? ? ? ? ? 0000 0000 0000 0000 ipc0 0094 ? t1ip<2:0> ?oc1ip<2:0> ? ic1ip<2:0> ? int0ip<2:0> 0100 0100 0100 0100 ipc1 0096 ? t31p<2:0> ? t2ip<2:0> ? oc2ip<2:0> ? ic2ip<2:0> 0100 0100 0100 0100 ipc2 0098 ?adip<2:0> ? u1txip<2:0> ? u1rxip<2:0> ? spi1ip<2:0> 0100 0100 0100 0100 ipc3 009a ? cnip<2:0> ?mi2cip<2:0> ? si2cip<2:0> ? nvmip<2:0> 0100 0100 0100 0100 ipc4 009c ?oc3ip<2:0> ?ic8ip<2:0> ? ic7ip<2:0> ? int1ip<2:0> 0100 0100 0100 0100 ipc5 009e ? int2ip<2:0> ? t5ip<2:0> ? t4ip<2:0> ? oc4ip<2:0> 0100 0100 0100 0100 ipc6 00a0 ? ? ? ? ? ? ? ? ? u2txip<2:0> ? u2rxip<2:0> 0100 0000 0100 0100 ipc7 00a2 ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? 0000 0000 0000 0000 ipc8 00a4 ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? 0000 0000 0000 0000 ipc9 00a6 ?pwmip<2:0> ? ? ? ? ? int41ip<2:0> ? int3ip<2:0> 0100 0000 0100 0100 ipc10 00a8 ? fltaip<2:0> ? ? ? ? ? ? ? ? ? qeiip<2:0> 0100 0000 0000 0100 ipc11 00aa ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? 0000 0000 0000 0000 legend: ? = unimplemented, read as ? 0 ? note 1: refer to ? dspic30f family reference manual? (ds70046) for descriptions of register bit fields.
? 2008 microchip technology inc. ds70141e-page 47 dspic30f3010/3011 6.0 flash program memory the dspic30f family of devices contains internal program flash memory for executing user code. there are two methods by which the user can program this memory: 1. in-circuit serial programming? (icsp?) capabilities 2. run-time self-programming (rtsp) 6.1 in-circuit serial programming (icsp) dspic30f devices can be serially programmed while in the end application circuit. this is simply done with two lines for programming clock and programming data (which are named pgc and pgd, respectively), and three other lines for power (v dd ), ground (v ss ) and master clear (mclr ). this allows customers to manu- facture boards with unprogrammed devices, and then program the microcontroller just before shipping the product. this also allows the most recent firmware or a custom firmware to be programmed. 6.2 run-time self-programming (rtsp) rtsp is accomplished using tblrd (table read) and tblwt (table write) instructions. with rtsp, the user may erase program memory, 32 instructions (96 bytes) at a time and can write program memory data, 32 instructions (96 bytes) at a time. 6.3 table instruction operation summary the tblrdl and the tblwtl instructions are used to read or write to bits<15:0> of program memory. tblrdl and tblwtl can access program memory in word or byte mode. the tblrdh and tblwth instructions are used to read or write to bits<23:16> of program memory. tblrdh and tblwth can access program memory in word or byte mode. a 24-bit program memory address is formed using bits<7:0> of the tblpag register and the effective address (ea) from a w regist er specified in the table instruction, as shown in figure 6-1. figure 6-1: addressing for table and nvm registers note: this data sheet summarizes features of this group of dspic30f devices and is not intended to be a complete reference source. for more information on the cpu, peripherals, register descriptions and gen- eral device functionality, refer to the ? dspic30f family reference manual ? (ds70046). for more information on the device instruction set and programming, refer to the ? dspic30f/33f programmer?s reference manual? (ds70157). 0 program counter 24 bits nvmadru reg 8 bits 16 bits program using tblpag reg 8 bits working reg ea 16 bits using byte 24-bit ea 1/0 0 1/0 select ta b l e instruction nvmadr addressing counter using nvmadr reg ea user/configuration space select
dspic30f3010/3011 ds70141e-page 48 ? 2008 microchip technology inc. 6.4 rtsp operation the dspic30f flash program memory is organized into rows and panels. each row consists of 32 instruc- tions or 96 bytes. each panel consists of 128 rows or 4k x 24 instructions. rtsp allows the user to erase one row (32 instructions) at a time and to program 32 instructions at one time. each panel of program memory contains write latches that hold 32 instructions of programming data. prior to the actual programming operation, the write data must be loaded into the panel write latches. the data to be programmed into the panel is loaded in sequential order into the write latches; instruction 0 , instruction 1 , etc. the addresses loaded must always be from an even group of 32 boundary. the basic sequence for rtsp programming is to set up a table pointer, then do a series of tblwt instructions to load the write latches. programming is performed by setting the special bits in the nvmcon register. 32 tblwtl and four tblwth instructions are required to load the 32 instructions. all of the table write operations are single-word writes (2 instruction cycles), because only the table latches are written. after the latches are written, a programming operation needs to be initiated to program the data. the flash program memory is readable, writable and erasable during normal operation over the entire v dd range. 6.5 rtsp control registers the four sfrs used to read and write the program flash memory are: ?nvmcon ? nvmadr ? nvmadru ? nvmkey 6.5.1 nvmcon register the nvmcon register controls which blocks are to be erased, which memory type is to be programmed and the start of the programming cycle. 6.5.2 nvmadr register the nvmadr register is used to hold the lower two bytes of the effective address. the nvmadr register captures the ea<15:0> of the last table instruction that has been executed and selects the row to write. 6.5.3 nvmadru register the nvmadru register is used to hold the upper byte of the effective address. the nvmadru register captures the ea<23:16> of the last table instruction that has been executed. 6.5.4 nvmkey register nvmkey is a write-only register that is used for write protection. to start a programming or erase sequence, the user must consecutively write 0x55 and 0xaa to the nvmkey register. refer to section 6.6 ?programming operations? for further details. note: the user can also directly write to the nvmadr and nvmadru registers to specify a program memory address for erasing or programming.
? 2008 microchip technology inc. ds70141e-page 49 dspic30f3010/3011 6.6 programming operations a complete programming sequence is necessary for programming or erasing the internal flash in rtsp mode. a programming operation is nominally 2 msec in duration and the processor stalls (waits) until the oper- ation is finished. setting the wr bit (nvmcon<15>) starts the operation, and the wr bit is automatically cleared when the operation is finished. 6.6.1 programming algorithm for program flash the user can erase or program one row of program flash memory at a time. the general process is: 1. read one row of program flash (32 instruction words) and store into data ram as a data ?image?. 2. update the data image with the desired new data. 3. erase program flash row. a) set up nvmcon register for multi-word, program flash, erase and set wren bit. b) write address of row to be erased into nvmadru/nvmdr. c) write ? 0x55 ? to nvmkey. d) write ? 0xaa ? to nvmkey. e) set the wr bit. this will begin erase cycle. f) cpu will stall for the duration of the erase cycle. g) the wr bit is cleared when erase cycle ends. 4. write 32 instruction words of data from data ram ?image? into the program flash write latches. 5. program 32 instruction words into program flash. a) set up nvmcon register for multi-word, program flash, program and set wren bit. b) write ? 0x55 ? to nvmkey. c) write ? 0xaa ? to nvmkey. d) set the wr bit. this will begin program cycle. e) cpu will stall for duration of the program cycle. f) the wr bit is cleared by the hardware when program cycle ends. 6. repeat steps 1 through 5 as needed to program desired amount of program flash memory. 6.6.2 erasing a row of program memory example 6-1 shows a code sequence that can be used to erase a row (32 instructions) of program memory. example 6-1: erasing a row of program memory ; setup nvmcon for erase operation, multi word write ; program memory selected, and writes enabled mov #0x4041,w0 ; mov w0 , nvmcon ; initialize nvmcon sfr ; init pointer to row to be erased mov #tblpage(prog_addr),w0 ; mov w0 , nvmadru ; initialize pm page boundary sfr mov #tbloffset(prog_addr),w0 ; initialize in-page ea[15:0] pointer mov w0, nvmadr ; initialize nvmadr sfr disi #5 ; block all interrupts with priority <7 ; for next 5 instructions mov #0x55,w0 mov w0 , nvmkey ; write the 0x55 key mov #0xaa,w1 ; mov w1 , nvmkey ; write the 0xaa key bset nvmcon,#wr ; start the erase sequence nop ; insert two nops after the erase nop ; command is asserted
dspic30f3010/3011 ds70141e-page 50 ? 2008 microchip technology inc. 6.6.3 loading write latches example 6-2 shows a sequence of instructions that can be used to load the 96 bytes of write latches. 32 tblwtl and 32 tblwth instructions are needed to load the write latches selected by the table pointer. example 6-2: loading write latches 6.6.4 initiating the programming sequence for protection, the write initiate sequence for nvmkey must be used to allow any erase or program operation to proceed. after the programming command has been executed, the user must wait for the programming time until programming is complete. the two instructions following the start of the programming sequence should be nop s. example 6-3: initiating a programming sequence ; set up a pointer to the first program memory location to be written ; program memory selected, and writes enabled mov #0x0000,w0 ; mov w0 , tblpag ; initialize pm page boundary sfr mov #0x6000,w0 ; an example program memory address ; perform the tblwt instructions to write the latches ; 0th_program_word mov #low_word_0,w2 ; mov #high_byte_0,w3 ; tblwtl w2 , [w0] ; write pm low word into program latch tblwth w3 , [w0++] ; write pm high byte into program latch ; 1st_program_word mov #low_word_1,w2 ; mov #high_byte_1,w3 ; tblwtl w2 , [w0] ; write pm low word into program latch tblwth w3 , [w0++] ; write pm high byte into program latch ; 2nd_program_word mov #low_word_2,w2 ; mov #high_byte_2,w3 ; tblwtl w2 , [w0] ; write pm low word into program latch tblwth w3 , [w0++] ; write pm high byte into program latch ? ? ? ; 31st_program_word mov #low_word_31,w2 ; mov #high_byte_31,w3 ; tblwtl w2 , [w0] ; write pm low word into program latch tblwth w3 , [w0++] ; write pm high byte into program latch note: in example 6-2, the contents of the upper byte of w3 have no effect. disi #5 ; block all interrupts with priority <7 ; for next 5 instructions mov #0x55,w0 mov w0 , nvmkey ; write the 0x55 key mov #0xaa,w1 ; mov w1 , nvmkey ; write the 0xaa key bset nvmcon,#wr ; start the erase sequence nop ; insert two nops after the erase nop ; command is asserted
? 2008 microchip technology inc. ds70141e-page 51 dspic30f3010/3011 table 6-1: nvm register map (1) file name addr. bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 all resets nvmcon 0760 wr wren wrerr ? ? ? ? ? ?progop<6:0> 0000 0000 0000 0000 nvmadr 0762 nvmadr<15:0> uuuu uuuu uuuu uuuu nvmadru 0764 ? ? ? ? ? ? ? ? ? nvmadr<22:16> 0000 0000 uuuu uuuu nvmkey 0766 ? ? ? ? ? ? ? ? nvmkey<7:0> 0000 0000 0000 0000 legend: u = uninitialized bit; ? = unimplemented bit, read as ? 0 ? note 1: refer to ? dspic30f family reference manual? (ds70046) for descriptions of register bit fields.
dspic30f3010/3011 ds70141e-page 52 ? 2008 microchip technology inc. notes:
? 2008 microchip technology inc. ds70141e-page 53 dspic30f3010/3011 7.0 data eeprom memory the data eeprom memory is readable and writable during normal operation over the entire v dd range. the data eeprom memory is directly mapped in the program memory address space. the four sfrs used to read and write the program flash memory are used to access data eeprom memory as well. as described in section 4.0 ?address generator units? , these registers are: ?nvmcon ? nvmadr ? nvmadru ? nvmkey the eeprom data memory allows read and write of single words and 16-word blocks. when interfacing to data memory, nvmadr, in conjunction with the nvmadru register, is used to address the eeprom location being accessed. tblrdl and tblwtl instruc- tions are used to read and write data eeprom. the dspic30f3010/3011 devices have 1 kbyte (512 words) of data eeprom, with an address range from 0x7ffc00 to 0x7ffffe. a word write operation should be preceded by an erase of the corresponding memory location(s). the write typically requires 2 ms to complete, but the write time will vary with voltage and temperature. a program or erase operation on the data eeprom does not stop the instruction flow. the user is respon- sible for waiting for the appropriate duration of time before initiating another data eeprom write/erase operation. attempting to read the data eeprom while a programming or erase operation is in progress results in unspecified data. control bit, wr, initiates write operations, similar to program flash writes. this bit cannot be cleared, only set, in software. this bit is cleared in hardware at the completion of the write operation. the inability to clear the wr bit in software prevents the accidental or premature termination of a write operation. the wren bit, when set, will allow a write operation. on power-up, the wren bit is clear. the wrerr bit is set when a write operation is interrupted by a mclr reset, or a wdt time-out reset, during normal oper- ation. in these situations, following reset, the user can check the wrerr bit and rewrite the location. the address register, nvmadr, remains unchanged. 7.1 reading the data eeprom a tblrd instruction reads a word at the current program word address. this example uses w0 as a pointer to data eeprom. the result is placed in register w4, as shown in example 7-1. example 7-1: data eeprom read note: this data sheet summarizes features of this group of dspic30f devices and is not intended to be a complete reference source. for more information on the cpu, peripherals, register descriptions and gen- eral device functionality, refer to the ? dspic30f family reference manual ? (ds70046). for more information on the device instruction set and programming, refer to the ? dspic30f/33f programmer?s reference manual? (ds70157). note: interrupt flag bit, nvmif in the ifs0 register, is set when the write is complete. it must be cleared in software. mov #low_addr_word,w0 ; init pointer mov #high_addr_word,w1 mov w1 , tblpag tblrdl [ w0 ], w4 ; read data eeprom
dspic30f3010/3011 ds70141e-page 54 ? 2008 microchip technology inc. 7.2 erasing data eeprom 7.2.1 erasing a block of data eeprom in order to erase a block of data eeprom, the nvmadru and nvmadr registers must initially point to the block of memory to be erased. configure nvmcon for erasing a block of data eeprom, and set the erase and wren bits in the nvmcon reg- ister. setting the wr bit initiates the erase, as shown in example 7-2. example 7-2: data eeprom block erase 7.2.2 erasing a word of data eeprom the tblpag and nvmadr registers must point to the block. select erase a block of data flash, and set the erase and wren bits in the nvmcon register. setting the wr bit initiates the erase, as shown in example 7-3. example 7-3: data eeprom word erase ; select data eeprom block, erase, wren bits mov #0x4045,w0 mov w0 , nvmcon ; initialize nvmcon sfr ; start erase cycle by setting wr after writing key sequence disi #5 ; block all interrupts with priority <7 ; for next 5 instructions mov #0x55,w0 ; mov w0 , nvmkey ; write the 0x55 key mov #0xaa,w1 ; mov w1 , nvmkey ; write the 0xaa key bset nvmcon,#wr ; initiate erase sequence nop nop ; erase cycle will complete in 2ms. cpu is not stalled for the data erase cycle ; user can poll wr bit, use nvmif or timer irq to determine erasure complete ; select data eeprom word, erase, wren bits mov #0x4044,w0 mov w0 , nvmcon ; start erase cycle by setting wr after writing key sequence disi #5 ; block all interrupts with priority <7 ; for next 5 instructions mov #0x55,w0 ; mov w0 , nvmkey ; write the 0x55 key mov #0xaa,w1 ; mov w1 , nvmkey ; write the 0xaa key bset nvmcon,#wr ; initiate erase sequence nop nop ; erase cycle will complete in 2ms. cpu is not stalled for the data erase cycle ; user can poll wr bit, use nvmif or timer irq to determine erasure complete
? 2008 microchip technology inc. ds70141e-page 55 dspic30f3010/3011 7.3 writing to the data eeprom to write an eeprom data location, the following sequence must be followed: 1. erase data eeprom word. a) select the word, data eeprom, erase and set wren bit in the nvmcon register. b) write the address of word to be erased into the nvmadru/nvmadr. c) enable the nvm interrupt (optional). d) write 0x55 to nvmkey. e) write 0xaa to nvmkey. f) set the wr bit. this will begin the erase cycle. g) either poll the nvmif bit or wait for the nvmif interrupt. h) the wr bit is cleared when the erase cycle ends. 2. write the data word into the data eeprom write latches. 3. program 1 data word into the data eeprom. a) select the word, data eeprom, program and set the wren bit in the nvmcon register. b) enable the nvm write done interrupt (optional). c) write 0x55 to nvmkey. d) write 0xaa to nvmkey. e) set the wr bit. this will begin the program cycle. f) either poll the nvmif bit or wait for the nvm interrupt. g) the wr bit is cleared when the write cycle ends. the write will not initiate if the above sequence is not exactly followed (write 0x55 to nvmkey, write 0xaa to nvmcon, then set wr bit) for each word. it is strongly recommended that interrupts be disabled during this code segment. additionally, the wren bit in nvmcon must be set to enable writes. this mechanism prevents accidental writes to data eeprom due to unexpected code execution. the wren bit should be kept clear at all times, except when updating the eeprom. the wren bit is not cleared by hardware. after a write sequence has been initiated, clearing the wren bit will not affect the current write cycle. the wr bit will be inhibited from being set unless the wren bit is set. the wren bit must be set on a previous instruc- tion. both wr and wren cannot be set with the same instruction. at the completion of the write cycle, the wr bit is cleared in hardware and the nonvolatile memory write complete interrupt flag bit (nvmif) is set. the user may either enable this interrupt, or poll this bit. nvmif must be cleared by software. 7.3.1 writing a word of data eeprom once the user has erased the word to be programmed, then a table write instruction is used to write one write latch, as shown in example 7-4. example 7-4: data eeprom word write ; point to data memory mov #low_addr_word,w0 ; init pointer mov #high_addr_word,w1 mov w1 , tblpag mov #low(word),w2 ; get data tblwtl w2 , [ w0] ; write data ; the nvmadr captures last table access address ; select data eeprom for 1 word op mov #0x4004,w0 mov w0 , nvmcon ; operate key to allow write operation disi #5 ; block all interrupts with priority <7 ; for next 5 instructions mov #0x55,w0 mov w0 , nvmkey ; write the 0x55 key mov #0xaa,w1 mov w1 , nvmkey ; write the 0xaa key bset nvmcon,#wr ; initiate program sequence nop nop ; write cycle will complete in 2ms. cpu is not stalled for the data write cycle ; user can poll wr bit, use nvmif or timer irq to determine write complete
dspic30f3010/3011 ds70141e-page 56 ? 2008 microchip technology inc. 7.3.2 writing a block of data eeprom to write a block of data eeprom, write to all sixteen latches first, then set the nvmcon register and program the block. example 7-5: data eeprom block write mov #low_addr_word,w0 ; init pointer mov #high_addr_word,w1 mov w1 , tblpag mov #data1,w2 ; get 1st data tblwtl w2 , [ w0]++ ; write data mov #data2,w2 ; get 2nd data tblwtl w2 , [ w0]++ ; write data mov #data3,w2 ; get 3rd data tblwtl w2 , [ w0]++ ; write data mov #data4,w2 ; get 4th data tblwtl w2 , [ w0]++ ; write data mov #data5,w2 ; get 5th data tblwtl w2 , [ w0]++ ; write data mov #data6,w2 ; get 6th data tblwtl w2 , [ w0]++ ; write data mov #data7,w2 ; get 7th data tblwtl w2 , [ w0]++ ; write data mov #data8,w2 ; get 8th data tblwtl w2 , [ w0]++ ; write data mov #data9,w2 ; get 9th data tblwtl w2 , [ w0]++ ; write data mov #data10,w2 ; get 10th data tblwtl w2 , [ w0]++ ; write data mov #data11,w2 ; get 11th data tblwtl w2 , [ w0]++ ; write data mov #data12,w2 ; get 12th data tblwtl w2 , [ w0]++ ; write data mov #data13,w2 ; get 13th data tblwtl w2 , [ w0]++ ; write data mov #data14,w2 ; get 14th data tblwtl w2 , [ w0]++ ; write data mov #data15,w2 ; get 15th data tblwtl w2 , [ w0]++ ; write data mov #data16,w2 ; get 16th data tblwtl w2 , [ w0]++ ; write data. the nvmadr captures last table access address. mov #0x400a,w0 ; select data eeprom for multi word op mov w0 , nvmcon ; operate key to allow program operation disi #5 ; block all interrupts with priority <7 ; for next 5 instructions mov #0x55,w0 mov w0 , nvmkey ; write the 0x55 key mov #0xaa,w1 mov w1 , nvmkey ; write the 0xaa key bset nvmcon,#wr ; start write cycle nop nop
? 2008 microchip technology inc. ds70141e-page 57 dspic30f3010/3011 7.4 write verify depending on the application, good programming practice may dictate that the value written to the memory should be verified against the original value. this should be used in applications where excessive writes can stress bits near the specification limit. 7.5 protection against spurious write there are conditions when the device may not want to write to the data eeprom memory. to protect against spurious eeprom writes, various mechanisms have been built-in. on power-up, the wren bit is cleared; also, the power-up timer prevents eeprom write. the write initiate sequence, and the wren bit together, help prevent an accidental write during brown-out, power glitch or software malfunction.
dspic30f3010/3011 ds70141e-page 58 ? 2008 microchip technology inc. notes:
? 2008 microchip technology inc. ds70141e-page 59 dspic30f3010/3011 8.0 i/o ports all of the device pins (except v dd , v ss , mclr and osc1/clki) are shared between the peripherals and the parallel i/o ports. all i/o input ports feature schmitt trigger inputs for improved noise immunity. 8.1 parallel i/o (pio) ports when a peripheral is enabled and the peripheral is actively driving an associated pin, the use of the pin as a general purpose output pin is disabled. the i/o pin may be read, but the output driver for the parallel port bit will be disabled. if a peripheral is enabled, but the peripheral is not actively driving a pin, that pin may be driven by a port. all port pins have three registers directly associated with the operation of the port pin. the data direction register (trisx) determines whether the pin is an input or an output. if the data direction bit is a ? 1 ?, then the pin is an input. all port pins are defined as inputs after a reset. reads from the latch (latx), read the latch. writes to the latch, write the latch (latx). reads from the port (portx), read the port pins, and writes to the port pins, write the latch (latx). any bit and its associated data and control registers that are not valid for a particular device will be disabled. that means the corresponding latx and trisx registers and the port pin will read as zeros. when a pin is shared with another peripheral or func- tion that is defined as an input only, it is nevertheless regarded as a dedicated port because there is no other competing source of outputs. an example is the int4 pin. the format of the registers for portx is shown in table 8-1. the trisx register controls the direction of the pins. the latx register supplies data to the outputs and is readable/writable. reading the portx register yields the state of the input pins, while writing the portx register modifies the contents of the latx register. a parallel i/o (pio) port that shares a pin with a periph- eral is, in general, subservient to the peripheral. the peripheral?s output buffer data and control signals are provided to a pair of multiplexers. the multiplexers select whether the peripheral or the associated port has ownership of the output data and control signals of the i/o pad cell. figure 8-2 shows how ports are shared with other peripherals, and the associated i/o cell (pad) to which they are connected. table 8-1 shows the formats of the registers for the shared ports, portb through portf. figure 8-1: block diagram of a dedicated port structure note: this data sheet summarizes features of this group of dspic30f devices and is not intended to be a complete reference source. for more information on the cpu, peripherals, register descriptions and gen- eral device functionality, refer to the ? dspic30f family reference manual ? (ds70046). q d ck wr lat + tris latch i/o pad wr port data bus q d ck data latch read lat read port read tris wr tris i/o cell dedicated port module
dspic30f3010/3011 ds70141e-page 60 ? 2008 microchip technology inc. figure 8-2: block diagram of a shared port structure 8.2 configuring analog port pins the use of the adpcfg and tris registers control the operation of the a/d port pins. the port pins that are desired as analog inputs must have their correspond- ing tris bit set (input). if the tris bit is cleared (output), the digital output level (v oh or v ol ) will be converted. when reading the port register, all pins configured as analog input channel will read as cleared (a low level). pins configured as digital inputs will not convert an analog input. analog levels on any pin that is defined as a digital input (including the anx pins), may cause the input buffer to consume current that exceeds the device specifications. 8.2.1 i/o port write/read timing one instruction cycle is required between a port direction change or port write operation and a read operation of the same port. typically this instruction would be a nop . example 8-1: port write/read example q d ck wr lat + tris latch i/o pad wr port data bus q d ck data latch read lat read port read tris 1 0 1 0 wr tris peripheral output data peripheral input data i/o cell peripheral module peripheral output enable pio module output multiplexers input data peripheral module enable output enable output data mov 0xff00, w0 ; configure portb<15:8> ; as inputs mov w0, trisbb ; and portb<7:0> as outputs nop ; delay 1 cycle btss portb, #13 ; next instruction
? 2008 microchip technology inc. ds70141e-page 61 dspic30f3010/3011 table 8-1: dspic30f3011 port register map (1) sfr name addr. bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 reset state trisb 02c6 ? ? ? ? ? ? ? trisb8 trisb7 trisb6 trisb5 trisb4 trisb3 trisb2 trisb1 trisb0 0000 0001 1111 1111 portb 02c8 ? ? ? ? ? ? ? rb8 rb7 rb6 rb5 rb4 rb3 rb2 rb1 rb0 0000 0000 0000 0000 latb 02ca ? ? ? ? ? ? ? latb8 latb7 latb6 latb5 latb4 latb3 latb2 latb1 latb0 0000 0000 0000 0000 trisc 02cc trisc15 trisc14 trisc13 ? ? ? ? ? ? ? ? ? ? ? ? ? 1110 0000 0000 0000 portc 02ce rc15 rc14 rc13 ? ? ? ? ? ? ? ? ? ? ? ? ? 0000 0000 0000 0000 latc 02d0 latc15 latc14 latc13 ? ? ? ? ? ? ? ? ? ? ? ? ? 0000 0000 0000 0000 trisd 02d2 ? ? ? ? ? ? ? ? ? ? ? ? trisd3 trisd2 trisd1 trisd0 0000 0000 0000 1111 portd 02d4 ? ? ? ? ? ? ? ? ? ? ? ? rd3 rd2 rd1 rd0 0000 0000 0000 0000 latd 02d6 ? ? ? ? ? ? ? ? ? ? ? ? latd3 latd2 latd1 latd0 0000 0000 0000 0000 trise 02d8 ? ? ? ? ? ? ?trise8 ? ? trise5 trise4 trise3 trise2 trise1 trise0 0000 0001 0011 1111 porte 02da ? ? ? ? ? ? ?re8 ? ? re5 re4 re3 re2 re1 re0 0000 0000 0000 0000 late 02dc ? ? ? ? ? ? ?late8 ? ? late5 late4 late3 late2 late1 late0 0000 0000 0000 0000 trisf 02de ? ? ? ? ? ? ? ? ? trisf6 trisf5 trisf4 tri sf3 trisf2 trisf1 trisf0 0000 0000 0111 1111 portf 02e0 ? ? ? ? ? ? ? ? ? rf6 rf5 rf4 rf3 rf2 rf1 rf0 0000 0000 0000 0000 latf 02e2 ? ? ? ? ? ? ? ? ? latf6 latf5 latf4 latf3 latf2 latf1 latf0 0000 0000 0000 0000 legend: ? = unimplemented bit, read as ? 0 ? note 1: refer to ? dspic30f family reference manual? (ds70046) for descriptions of register bit fields. not all peripherals, and therefore their bit positions, are available on th is device.
dspic30f3010/3011 ds70141e-page 62 ? 2008 microchip technology inc. table 8-2: dspic30f3010 port register map (1) sfr name addr. bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 reset state trisb 02c6 ? ? ? ? ? ? ? ? ? ? trisb5 trisb4 trisb3 trisb2 trisb1 trisb0 0000 0000 0011 1111 portb 02c8 ? ? ? ? ? ? ? ? ? ? rb5 rb4 rb3 rb2 rb1 rb0 0000 0000 0000 0000 latb 02cb ? ? ? ? ? ? ? ? ? ? latb5 latb4 latb3 latb2 latb1 latb0 0000 0000 0000 0000 trisc 02cc trisc15 trisc14 trisc13 ? ? ? ? ? ? ? ? ? ? ? ? ? 1110 0000 0000 0000 portc 02ce rc15 rc14 rc13 ? ? ? ? ? ? ? ? ? ? ? ? ? 0000 0000 0000 0000 latc 02d0 latc15 latc14 latc13 ? ? ? ? ? ? ? ? ? ? ? ? ? 0000 0000 0000 0000 trisd 02d2 ? ? ? ? ? ? ? ? ? ? ? ? ? ? trisd1 trisd0 0000 0000 0000 0011 portd 02d4 ? ? ? ? ? ? ? ? ? ? ? ? ? ? rd1 rd0 0000 0000 0000 0000 latd 02d6 ? ? ? ? ? ? ? ? ? ? ? ? ? ?latd1latd0 0000 0000 0000 0000 trise 02d8 ? ? ? ? ? ? ?trise8 ? ? trise5 trise4 trise3 trise2 trise1 trise0 0000 0001 0011 1111 porte 02da ? ? ? ? ? ? ?re8 ? ? re5 re4 re3 re2 re1 re0 0000 0000 0000 0000 late 02dc ? ? ? ? ? ? ?late8 ? ? late5 late4 late3 late2 late1 late0 0000 0000 0000 0000 trisf 02ee ? ? ? ? ? ? ? ? ? ? ? ? trisf3 trisf2 ? ? 0000 0000 0000 1100 portf 02e0 ? ? ? ? ? ? ? ? ? ? ? ?rf3rf2 ? ? 0000 0000 0000 0000 latf 02e2 ? ? ? ? ? ? ? ? ? ? ? ? latf3 latf2 ? ? 0000 0000 0000 0000 legend: ? = unimplemented bit, read as ? 0 ? note 1: refer to ? dspic30f family reference manual? (ds70046) for descriptions of register bit fields. not all peripherals, and therefore their bit positions, are available on th is device.
? 2008 microchip technology inc. ds70141e-page 63 dspic30f3010/3011 8.3 input change notification module the input change notification module provides the dspic30f devices the ability to generate interrupt requests to the processor in response to a change-of- state (cos) on selected input pins. this module is capable of detecting input change-of-states, even in sleep mode, when the clocks are disabled. there are 10 external signals (cn0 through cn7, cn17 and cn18) that may be selected (enabled) for generating an interrupt request on a change-of-state. please refer to the pin diagrams for cn pin locations. table 8-3: input change notificat ion register map (bits 7-0) (1) sfr name addr. bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 reset state cnen1 00c0 cn7ie cn6ie cn5ie cn4ie cn3ie cn2ie cn1ie cn0ie 0000 0000 0000 0000 cnpu1 00c4 cn7pue cn6pue cn5pue cn4pue cn3pue cn2pue cn1pue cn0pue 0000 0000 0000 0000 note 1: refer to ? dspic30f family reference manual? (ds70046) for descriptions of register bit fields.
dspic30f3010/3011 ds70141e-page 64 ? 2008 microchip technology inc. notes:
? 2008 microchip technology inc. ds70141e-page 65 dspic30f3010/3011 9.0 timer1 module this section describes the 16-bit general purpose timer1 module and associated operational modes. figure 9-1 depicts the simplified block diagram of the 16-bit timer1 module. the following sections provide a detailed description, including setup and control registers along with associ- ated block diagrams for the operational modes of the timers. the timer1 module is a 16-bit timer which can serve as the time counter for the real-time clock (rtc), or oper- ate as a free-running interval timer/counter. the 16-bit timer has the following modes: ? 16-bit timer ? 16-bit synchronous counter ? 16-bit asynchronous counter further, the following operational characteristics are supported: ? timer gate operation ? selectable prescaler settings ? timer operation during cpu idle and sleep modes ? interrupt on 16-bit period register match or falling edge of external gate signal these operating modes are determined by setting the appropriate bit(s) in the 16-bit sfr, t1con. figure 9-1 presents a block diagram of the 16-bit timer module. 16-bit timer mode: in the 16-bit timer mode, the timer increments on every instruction cycle up to a match value, preloaded into the period register, pr1, then resets to ? 0 ? and continues to count. when the cpu goes into the idle mode, the timer will stop incrementing unless the tsidl (t1con<13>) bit = 0 . if tsidl = 1 , the timer module logic will resume the incrementing sequence upon termination of the cpu idle mode. 16-bit synchronous counter mode: in the 16-bit synchronous counter mode, the timer increments on the rising edge of the applied external clock signal, which is synchronized with the internal phase clocks. the timer counts up to a match value preloaded in pr1, then resets to ? 0 ? and continues. when the cpu goes into the idle mode, the timer will stop incrementing, unless the respective tsidl bit = 0 . if tsidl = 1 , the timer module logic will resume the incrementing sequence upon termination of the cpu idle mode. 16-bit asynchronous counter mode: in the 16-bit asynchronous counter mode, the timer increments on every rising edge of the applied external clock signal. the timer counts up to a match value preloaded in pr1, then resets to ? 0 ? and continues. when the timer is configured for the asynchronous mode of operation and the cpu goes into the idle mode, the timer will stop incrementing if tsidl = 1 . note: this data sheet summarizes features of this group of dspic30f devices and is not intended to be a complete reference source. for more information on the cpu, peripherals, register descriptions and gen- eral device functionality, refer to the ? dspic30f family reference manual? (ds70046). note: timer1 is a ?type a? timer. please refer to the specifications for a type a timer in sec- tion 23.0 ?electrical characteristics? of this document.
dspic30f3010/3011 ds70141e-page 66 ? 2008 microchip technology inc. figure 9-1: 16-bit timer1 mo dule block diagram (type a timer) 9.1 timer gate operation the 16-bit timer can be placed in the gated time accumulation mode. this mode allows the internal t cy to increment the respective timer when the gate input signal (t1ck pin) is asserted high. control bit, tgate (t1con<6>), must be set to enable this mode. the timer must be enabled (ton = 1 ) and the timer clock source set to internal (tcs = 0 ). when the cpu goes into the idle mode, the timer will stop incrementing unless tsidl = 0 . if tsidl = 1 , the timer will resume the incrementing sequence upon termination of the cpu idle mode. 9.2 timer prescaler the input clock (f osc /4 or external clock) to the 16-bit timer has a prescale option of 1:1, 1:8, 1:64 and 1:256, selected by control bits, tckps<1:0> (t1con<5:4>). the prescaler counter is cleared when any of the following occurs: ? a write to the tmr1 register ? clearing of the ton bit (t1con<15>) ? device reset such as por and bor however, if the timer is disabled (ton = 0 ), then the timer prescaler cannot be reset since the prescaler clock is halted. tmr1 is not cleared when t1con is written. it is cleared by writing to the tmr1 register. 9.3 timer operation during sleep mode during cpu sleep mode, the timer will operate if: ? the timer module is enabled (ton = 1 ) and ? the timer clock source is selected as external (tcs = 1 ) and ? the tsync bit (t1con<2>) is asserted to a logic ? 0 ?, which defines the external clock source as asynchronous when all three conditions are true, the timer will continue to count up to the period register and be reset to 0x0000. when a match between the timer and the period register occurs, an interrupt can be generated, if the respective timer interrupt enable bit is asserted. ton sync sosci sosco/ pr1 t1if equal comparator x 16 tmr1 reset lposcen event flag 1 0 tsync q qd ck tgate tckps<1:0> prescaler 1, 8, 64, 256 2 tgate t cy 1 0 t1ck tcs 1 x 0 1 tgate 0 0 gate sync
? 2008 microchip technology inc. ds70141e-page 67 dspic30f3010/3011 9.4 timer interrupt the 16-bit timer has the ability to generate an interrupt on period match. when the timer count matches the period register, the t1if bit is asserted and an interrupt will be generated, if enabled. the t1if bit must be cleared in software. the timer interrupt flag, t1if, is located in the ifs0 control register in the interrupt controller. when the gated time accumulation mode is enabled, an interrupt will also be generated on the falling edge of the gate signal (at the end of the accumulation cycle). enabling an interrupt is accomplished via the respective timer interrupt enable bit, t1ie. the timer interrupt enable bit is located in the iec0 control register in the interrupt controller. 9.5 real-time clock timer1, when operating in real-time clock (rtc) mode, provides time-of-day and event time-stamping capabilities. key operational features of the rtc are: ? operation from 32 khz lp oscillator ? 8-bit prescaler ? low power ? real-time clock interrupts these operating modes are determined by setting the appropriate bit(s) in the t1con control register figure 9-2: recommended components for timer1 lp oscillator rtc 9.5.1 rtc oscillator operation when the ton = 1 , tcs = 1 and tgate = 0 , the timer increments on the rising edge of the 32 khz lp oscilla- tor output signal, up to the value specified in the period register, and is then reset to ? 0 ?. the tsync bit must be asserted to a logic ? 0 ? (asynchronous mode) for correct operation. enabling lposcen (osccon<1>) will disable the normal timer and counter modes and enable a timer carry-out wake-up event. when the cpu enters sleep mode, the rtc will continue to operate, provided the 32 khz external crystal oscillator is active and the control bits have not been changed. the tsidl bit should be cleared to ? 0 ? in order for rtc to continue operation in idle mode. 9.5.2 rtc interrupts when an interrupt event occurs, the respective interrupt flag, t1if, is asserted and an interrupt will be generated, if enabled. the t1if bit must be cleared in software. the respective timer interrupt flag, t1if, is located in the ifs0 register in the interrupt controller. enabling an interrupt is accomplished via the respective timer interrupt enable bit, t1ie. the timer interrupt enable bit is located in the iec0 control register in the interrupt controller. sosci sosco r c1 c2 dspic30fxxxx 32.768 khz xtal c1 = c2 = 18 pf; r = 100k
dspic30f3010/3011 ds70141e-page 68 ? 2008 microchip technology inc. table 9-1: timer1 register map (1) sfr name addr. bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 reset state tmr1 0100 timer1 register uuuu uuuu uuuu uuuu pr1 0102 period register 1 1111 1111 1111 1111 t1con 0104 ton ?tsidl ? ? ? ? ? ? tgate tckps1 tckps0 ?tsynctcs ? 0000 0000 0000 0000 legend: u = uninitialized bit; ? = unimplemented bit, read as ? 0 ? note 1: refer to ? dspic30f family reference manual? (ds70046) for descriptions of register bit fields.
? 2008 microchip technology inc. ds70141e-page 69 dspic30f3010/3011 10.0 timer2/3 module this section describes the 32-bit general purpose timer module (timer2/3) and associated operational modes. figure 10-1 depicts the simplified block diagram of the 32-bit timer2/3 module. figure 10-2 and figure 10-3 show timer2/3 configured as two independent 16-bit timers; timer2 and timer3, respectively. the timer2/3 module is a 32-bit timer, which can be configured as two 16-bit timers, with selectable operat- ing modes. these timers are utilized by other peripheral modules such as: ? input capture ? output compare/simple pwm the following sections provide a detailed description, including setup and control registers, along with associated block diagrams for the operational modes of the timers. the 32-bit timer has the following modes: ? two independent 16-bit timers (timer2 and timer3) with all 16-bit operating modes (except asynchronous counter mode) ? single 32-bit timer operation ? single 32-bit synchronous counter further, the following operational characteristics are supported: ? adc event trigger ? timer gate operation ? selectable prescaler settings ? timer operation during idle and sleep modes ? interrupt on a 32-bit period register match these operating modes are determined by setting the appropriate bit(s) in the 16-bit t2con and t3con sfrs. for 32-bit timer/counter operation, timer2 is the lsw and timer3 is the msw of the 32-bit timer. 16-bit mode: in the 16-bit mode, timer2 and timer3 can be configured as two independent 16-bit timers. each timer can be set up in either 16-bit timer mode or 16-bit synchronous counter mode. see section 9.0 ?timer1 module? for details on these two operating modes. the only functional difference between timer2 and timer3 is that timer2 provides synchronization of the clock prescaler output. this is useful for high-frequency external clock inputs. 32-bit timer mode: in the 32-bit timer mode, the timer increments on every instruction cycle up to a match value, preloads into the combined 32-bit period register, pr3/pr2, then resets to ? 0 ? and continues to count. for synchronous 32-bit reads of the timer2/timer3 pair, reading the lsw (tmr2 register) will cause the msw to be read and latched into a 16-bit holding register, termed tmr3hld. for synchronous 32-bit writes, the holding register (tmr3hld) must first be written to. when followed by a write to the tmr2 register, the contents of tmr3hld will be transferred and latched into the msb of the 32-bit timer (tmr3). 32-bit synchronous counter mode: in the 32-bit synchronous counter mode, the timer increments on the rising edge of the applied external clock signal, which is synchronized with the internal phase clocks. the timer counts up to a match value preloaded in the combined 32-bit period register, pr3/pr2, then resets to ? 0 ? and continues. when the timer is configured for the synchronous counter mode of operation and the cpu goes into the idle mode, the timer will stop incrementing unless the tsidl (t2con<13>) bit = 0 . if tsidl = 1 , the timer module logic will resume the incrementing sequence upon termination of the cpu idle mode. note: this data sheet summarizes features of this group of dspic30f devices and is not intended to be a complete reference source. for more information on the cpu, peripherals, register descriptions and gen- eral device functionality, refer to the ? dspic30f family reference manual? (ds70046). note: timer2 is a ?type b? timer and timer3 is a ?type c? timer. please refer to the appropriate timer type in section 23.0 ?electrical characteristics? of this document. note: for 32-bit timer operation, t3con control bits are ignored. only t2con control bits are used for setup and control. timer2 clock and gate inputs are utilized for the 32-bit timer module, but an interrupt is generated with the timer3 interrupt flag (t3if) and the interrupt is enabled with the timer3 interrupt enable bit (t3ie).
dspic30f3010/3011 ds70141e-page 70 ? 2008 microchip technology inc. figure 10-1: 32-bit timer2/3 block diagram tmr3 tmr2 t3if equal comparator x 32 pr3 pr2 reset lsb msb event flag note: timer configuration bit, t32 t2con(<3>), must be set to ? 1 ? for a 32-bit timer/counter operation. all control bits are respective to the t2con register. data bus<15:0> tmr3hld read tmr2 write tmr2 16 16 16 q qd ck tgate(t2con<6>) (t2con<6>) tgate 0 1 ton tckps<1:0> prescaler 1, 8, 64, 256 2 t cy tcs 1 x 0 1 tgate 0 0 gate t2ck sync adc event trigger sync
? 2008 microchip technology inc. ds70141e-page 71 dspic30f3010/3011 figure 10-2: 16-bit timer2 block diagram (type b timer) figure 10-3: 16-bit timer3 block diagram (type c timer) ton sync pr2 t2if equal comparator x 16 tmr2 reset event flag q qd ck tgate tckps<1:0> prescaler 1, 8, 64, 256 2 tgate t cy 1 0 tcs 1 x 0 1 tgate 0 0 gate t2ck sync ton pr3 t3if equal comparator x 16 tmr3 reset event flag q qd ck tgate tckps<1:0> prescaler 1, 8, 64, 256 2 tgate t cy 1 0 tcs 1 x 0 1 tgate 0 0 adc event trigger sync note: the dspic30f3010/3011 devices do not have external pin inputs to timer3. in these devices, the following modes should not be used: 1. tcs = 1 2. tcs = 0 and tgate = 1 (gated time accumulation)
dspic30f3010/3011 ds70141e-page 72 ? 2008 microchip technology inc. 10.1 timer gate operation the 32-bit timer can be placed in the gated time accumulation mode. this mode allows the internal t cy to increment the respective timer when the gate input signal (t2ck pin) is asserted high. control bit, tgate (t2con<6>), must be set to enable this mode. when in this mode, timer2 is the originating clock source. the tgate setting is ignored for timer3. the timer must be enabled (ton = 1 ) and the timer clock source set to internal (tcs = 0 ). the falling edge of the external signal terminates the count operation, but does not reset the timer. the user must reset the timer in order to start counting from zero. 10.2 adc event trigger when a match occurs between the 32-bit timer (tmr3/ tmr2) and the 32-bit combined period register (pr3/ pr2), a special adc trigger event signal is generated by timer3. 10.3 timer prescaler the input clock (f osc /4 or external clock) to the timer has a prescale option of 1:1, 1:8, 1:64 and 1:256, selected by control bits, tckps<1:0> (t2con<5:4> and t3con<5:4>). for the 32-bit timer operation, the originating clock source is timer2. the prescaler operation for timer3 is not applicable in this mode. the prescaler counter is cleared when any of the following occurs: ? a write to the tmr2/tmr3 register ? clearing either of the ton (t2con<15> or t3con<15>) bits to ? 0 ? ? device reset such as por and bor however, if the timer is disabled (ton = 0 ), then the timer2 prescaler cannot be reset, since the prescaler clock is halted. tmr2/tmr3 is not cleared when t2con/t3con is written. 10.4 timer operation during sleep mode during cpu sleep mode, the timer will not operate, because the internal clocks are disabled. 10.5 timer interrupt the 32-bit timer module can generate an interrupt-on- period match, or on the falling edge of the external gate signal. when the 32-bit timer count matches the respective 32-bit period register, or the falling edge of the external ?gate? signal is detected, the t3if bit (ifs0<7>) is asserted and an interrupt will be gener- ated if enabled. in this mode, the t3if interrupt flag is used as the source of the interrupt. the t3if bit must be cleared in software. enabling an interrupt is accomplished via the respective timer interrupt enable bit, t3ie (iec0<7>).
? 2008 microchip technology inc. ds70141e-page 73 dspic30f3010/3011 table 10-1: timer2/3 register map (1) sfr name addr. bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 reset state tmr2 0106 timer2 register uuuu uuuu uuuu uuuu tmr3hld 0108 timer3 holding register (for 32-bit timer operations only) uuuu uuuu uuuu uuuu tmr3 010a timer3 register uuuu uuuu uuuu uuuu pr2 010c period register 2 1111 1111 1111 1111 pr3 010e period register 3 1111 1111 1111 1111 t2con 0110 ton ?tsidl ? ? ? ? ? ? tgate tckps1 tckps0 t32 ?tcs ? 0000 0000 0000 0000 t3con 0112 ton ?tsidl ? ? ? ? ? ? tgate tckps1 tckps0 ? ?tcs ? 0000 0000 0000 0000 legend: u = uninitialized bit; ? = unimplemented bit, read as ? 0 ? note 1: refer to ? dspic30f family reference manual? (ds70046) for descriptions of register bit fields.
dspic30f3010/3011 ds70141e-page 74 ? 2008 microchip technology inc. notes:
? 2008 microchip technology inc. ds70141e-page 75 dspic30f3010/3011 11.0 timer4/5 module this section describes the second 32-bit general purpose timer module (timer4/5) and associated operational modes. figure 11-1 depicts the simplified block diagram of the 32-bit timer4/5 module. figure 11-2 and figure 11-3 show timer4/5 configured as two independent 16-bit timers, timer4 and timer5, respectively. the timer4/5 module is similar in operation to the timer 2/3 module. however, there are some differences, which are as follows: ? the timer4/5 module does not support the adc event trigger feature ? timer4/5 can not be utilized by other peripheral modules such as input capture and output compare the operating modes of the timer4/5 module are determined by setting the appropriate bit(s) in the 16-bit t4con and t5con sfrs. for 32-bit timer/counter operation, timer4 is the lsw and timer5 is the msw of the 32-bit timer. figure 11-1: 32-bit timer4/5 block diagram note: this data sheet summarizes features of this group of dspic30f devices and is not intended to be a complete reference source. for more information on the cpu, peripherals, register descriptions and gen- eral device functionality, refer to the ? dspic30f family reference manual? (ds70046). note: timer4 is a ?type b? timer and timer5 is a ?type c? timer. please refer to the appropriate timer type in section 23.0 ?electrical characteristics? of this document. note: for 32-bit timer operation, t5con control bits are ignored. only t4con control bits are used for setup and control. timer4 clock and gate inputs are utilized for the 32-bit timer module, but an interrupt is generated with the timer5 interrupt flag (t5if) and the interrupt is enabled with the timer5 interrupt enable bit (t5ie). tmr5 tmr4 t5if equal comparator x 32 pr5 pr4 reset lsb msb event flag note: timer configuration bit, t32 t4con(<3>), must be set to ? 1 ? for a 32-bit timer/counter operation. all control bits are respective to the t4con register. the dspic30f3010/3011 devices do not hav e external pin inputs to timer4 or timer5. in these devices, the following modes should not be used: 1. tcs = 1 2. tcs = 0 and tgate = 1 (gated time accumulation) data bus<15:0> tmr5hld read tmr4 write tmr4 16 16 16 q qd ck tgate(t4con<6>) (t4con<6>) tgate 0 1 ton tckps<1:0> prescaler 1, 8, 64, 256 2 t cy tcs 1 x 0 1 tgate 0 0 gate sync sync
dspic30f3010/3011 ds70141e-page 76 ? 2008 microchip technology inc. figure 11-2: 16-bit timer4 block diagram (type b timer) ton sync pr4 t4if equal comparator x 16 tmr4 reset event flag q qd ck tgate tckps<1:0> prescaler 1, 8, 64, 256 2 tgate t cy 1 0 tcs 1 x 0 1 tgate 0 0 gate sync note: the dspic30f3010/3011 devices do not have external pi n inputs to timer4 or timer5. in these devices, the following modes should not be used: 1. tcs = 1 2. tcs = 0 and tgate = 1 (gated time accumulation)
? 2008 microchip technology inc. ds70141e-page 77 dspic30f3010/3011 figure 11-3: 16-bit timer5 block diagram (type c timer) ton pr5 t5if equal comparator x 16 tmr5 reset event flag q qd ck tgate tckps<1:0> prescaler 1, 8, 64, 256 2 tgate t cy 1 0 tcs 1 x 0 1 tgate 0 0 adc event trigger sync note: the dspic30f3010/3011 devices do not have external pin inputs to timer4 or timer5. in these devices, the following modes should not be used: 1. tcs = 1 2. tcs = 0 and tgate = 1 (gated time accumulation)
dspic30f3010/3011 ds70141e-page 78 ? 2008 microchip technology inc. table 11-1: timer4/5 register map (1) sfr name addr. bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 reset state tmr4 0114 timer4 register uuuu uuuu uuuu uuuu tmr5hld 0116 timer5 holding register (for 32-bit operations only) uuuu uuuu uuuu uuuu tmr5 0118 timer5 register uuuu uuuu uuuu uuuu pr4 011a period register 4 1111 1111 1111 1111 pr5 011c period register 5 1111 1111 1111 1111 t4con 011e ton ?tsidl ? ? ? ? ? ? tgate tckps1 tckps0 t45 ?tcs ? 0000 0000 0000 0000 t5con 0120 ton ?tsidl ? ? ? ? ? ? tgate tckps1 tckps0 ? ?tcs ? 0000 0000 0000 0000 legend: u = uninitialized bit; ? = unimplemented bit, read as ? 0 ? note 1: refer to ? dspic30f family reference manual? (ds70046) for descriptions of register bit fields.
? 2008 microchip technology inc. ds70141e-page 79 dspic30f3010/3011 12.0 input capture module this section describes the input capture module and associated operational modes. the features provided by this module are useful in applications requiring frequency (period) and pulse measurement. figure 12-1 depicts a block diagram of the input capture module. input capture is useful for such modes as: ? frequency/period/pulse measurements ? additional sources of external interrupts the key operational features of the input capture module are: ? simple capture event mode ? timer2 and timer3 mode selection ? interrupt on input capture event these operating modes are determined by setting the appropriate bits in the icxcon register (where x = 1,2,...,n). figure 12-1: input capture mode block diagram note: this data sheet summarizes features of this group of dspic30f devices and is not intended to be a complete reference source. for more information on the cpu, peripherals, register descriptions and gen- eral device functionality, refer to the ? dspic30f family reference manual? (ds70046). note: the dspic30f3010/3011 devices have four capture channels. the channels are designated ic1, ic 2, ic7 and ic8 to maintain software compatibility with other dspic30f devices. icxbuf prescaler icx icm<2:0> mode select 3 note: where ?x? is shown, reference is m ade to the registers or bits associated to the respective input capture channels, 1 through n. 10 set flag pin icxif ictmr t2_cnt t3_cnt edge detection logic clock synchronizer 1, 4, 16 from general purpose timer module 16 16 fifo r/w logic ici<1:0> icbne, icov icxcon interrupt logic set flag icxif data bus
dspic30f3010/3011 ds70141e-page 80 ? 2008 microchip technology inc. 12.1 simple capture event mode the simple capture events in the dspic30f product family are: ? capture every falling edge ? capture every rising edge ? capture every 4th rising edge ? capture every 16th rising edge ? capture every rising and falling edge these simple input capture modes are configured by setting the appropriate bits, icm<2:0> (icxcon<2:0>). 12.1.1 capture prescaler there are four input capture prescaler settings, speci- fied by bits, icm<2:0> (icxcon<2:0>). whenever the capture channel is turned off, the prescaler counter will be cleared. in addition, any reset will clear the prescaler counter. 12.1.2 capture buffer operation each capture channel has an associated fifo buffer, which is four 16-bit words deep. there are two status flags, which provide status on the fifo buffer: ? icbne ? input capture buffer not empty ? icov ? input capture overflow the icbne will be set on the first input capture event and remain set until all capture events have been read from the fifo. as each word is read from the fifo, the remaining words are advanced by one position within the buffer. in the event that the fifo is full with four capture events and a fifth capture event occurs prior to a read of the fifo, an overflow condition will occur and the icov bit will be set to a logic ? 1 ?. the fifth capture event is lost and is not stored in the fifo. no additional events will be captured till all four events have been read from the buffer. if a fifo read is performed after the last read and no new capture event has been received, the read will yield indeterminate results. 12.1.3 timer2 and timer3 selection mode each capture channel can select between one of two timers for the time base, timer2 or timer3. selection of the timer resource is accomplished through sfr bit, ictmr (icxcon<7>). timer3 is the default timer resource available for the input capture module. 12.1.4 hall sensor mode when the input capture module is set for capture on every edge, rising and falling, icm<2:0> = 001 , the following operations are performed by the input capture logic: ? the input capture interrupt flag is set on every edge, rising and falling. ? the interrupt on capture mode setting bits, ici<1:0>, is ignored, since every capture generates an interrupt. ? a capture overflow condition is not generated in this mode. 12.2 input capture operation during sleep and idle modes an input capture event will generate a device wake-up or interrupt, if enabled, if the device is in cpu idle or sleep mode. independent of the timer being enabled, the input capture module will wake-up from the cpu sleep or idle mode when a capture event occurs if icm<2:0> = 111 and the interrupt enable bit is asserted. the same wake- up can generate an interrupt if the conditions for processing the interrupt have been satisfied. the wake- up feature is useful as a method of adding extra external pin interrupts. 12.2.1 input capture in cpu sleep mode cpu sleep mode allows input capture module opera- tion with reduced functionality. in the cpu sleep mode, the ici<1:0> bits are not applicable, and the input capture module can only function as an external interrupt source. the capture module must be configured for interrupt only on the rising edge (icm<2:0> = 111 ) in order for the input capture module to be used while the device is in sleep mode. the prescale settings of 4:1 or 16:1 are not applicable in this mode.
? 2008 microchip technology inc. ds70141e-page 81 dspic30f3010/3011 12.2.2 input capture in cpu idle mode cpu idle mode allows input capture module operation with full functionality. in the cpu idle mode, the inter- rupt mode selected by the ici<1:0> bits is applicable, as well as the 4:1 and 16:1 capture prescale settings, which are defined by control bits, icm<2:0>. this mode requires the selected timer to be enabled. moreover, the icsidl bit must be asserted to a logic ? 0 ?. if the input capture module is defined as icm<2:0> = 111 in cpu idle mode, the input capture pin will serve only as an external interrupt pin. 12.3 input capture interrupts the input capture channels have the ability to generate an interrupt based upon the selected number of capture events. the selection number is set by control bits, ici<1:0> (icxcon<6:5>). each channel provides an interrupt flag (icxif) bit. the respective capture channel interrupt flag is located in the corresponding ifsx register. enabling an interrupt is accomplished via the respec- tive input capture channel interrupt enable (icxie) bit. the capture interrupt enable bit is located in the corresponding iec control register.
dspic30f3010/3011 ds70141e-page 82 ? 2008 microchip technology inc. table 12-1: input capture register map (1) sfr name addr. bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 reset state ic1buf 0140 input 1 capture register uuuu uuuu uuuu uuuu ic1con 0142 ? ?icsidl ? ? ? ? ? ictmr ici<1:0> icov icbne icm<2:0> 0000 0000 0000 0000 ic2buf 0144 input 2 capture register uuuu uuuu uuuu uuuu ic2con 0146 ? ?icsidl ? ? ? ? ? ictmr ici<1:0> icov icbne icm<2:0> 0000 0000 0000 0000 ic7buf 0158 input 7 capture register uuuu uuuu uuuu uuuu ic7con 015a ? ?icsidl ? ? ? ? ? ictmr ici<1:0> icov icbne icm<2:0> 0000 0000 0000 0000 ic8buf 015c input 8 capture register uuuu uuuu uuuu uuuu ic8con 015e ? ?icsidl ? ? ? ? ? ictmr ici<1:0> icov icbne icm<2:0> 0000 0000 0000 0000 legend: u = uninitialized bit; ? = unimplemented bit, read as ? 0 ? note 1: refer to ? dspic30f family reference manual? (ds70046) for descriptions of register bit fields.
? 2008 microchip technology inc. ds70141e-page 83 dspic30f3010/3011 13.0 output compare module this section describes the output compare module and associated operational modes. the features provided by this module are useful in applications requiring operational modes such as: ? generation of variable width output pulses ? power factor correction figure 13-1 depicts a block diagram of the output compare module. the key operational features of the output compare module include: ? timer2 and timer3 selection mode ? simple output compare match mode ? dual output compare match mode ? simple pwm mode ? output compare during sleep and idle modes ? interrupt on output compare/pwm event these operating modes are determined by setting the appropriate bits in the 16-bit ocxcon sfr (where x = 1,2,3,...,n). the dspic30f3010/3011 devices have 4/2 compare channels, respectively. ocxrs and ocxr in the figure represent the dual compare registers. in the dual compare mode, the ocxr register is used for the first compare and ocxrs is used for the second compare. figure 13-1: output comp are mode block diagram note: this data sheet summarizes features of this group of dspic30f devices and is not intended to be a complete reference source. for more information on the cpu, peripherals, register descriptions and gen- eral device functionality, refer to the ? dspic30f family reference manual ? (ds70046). ocxr comparator output logic q s r ocm<2:0> output enable ocx set flag bit ocxif ocxrs mode select 3 note: where ?x? is shown, reference is made to the register s associated with the respective output compare channels, 1 through n. ocfa octsel 0 1 t2p2_match tmr2<15:0 tmr3<15:0> t3p3_match from gp timer module (for x = 1, 2, 3 or 4) 0 1
dspic30f3010/3011 ds70141e-page 84 ? 2008 microchip technology inc. 13.1 timer2 and timer3 selection mode each output compare channel can select between one of two 16-bit timers: timer2 or timer3. the selection of the timers is controlled by the octsel bit (ocxcon<3>). timer2 is the default timer resource for the output compare module. 13.2 simple output compare match mode when control bits, ocm<2:0> (ocxcon<2:0>) = 001 , 010 or 011 , the selected output compare channel is configured for one of three simple output compare match modes: ? compare forces i/o pin low ? compare forces i/o pin high ? compare toggles i/o pin the ocxr register is used in these modes. the ocxr register is loaded with a value and is compared to the selected incrementing timer count. when a compare occurs, one of these compare match modes occurs. if the counter resets to zero before reaching the value in ocxr, the state of the ocx pin remains unchanged. 13.3 dual output compare match mode when control bits, ocm<2:0> (ocxcon<2:0>) = 100 or 101 , the selected output compare channel is config- ured for one of two dual output compare modes, which are: ? single output pulse mode ? continuous output pulse mode 13.3.1 single pulse mode for the user to configure the module for the generation of a single output pulse, the following steps are required (assuming timer is off): ? determine instruction cycle time, t cy . ? calculate desired pulse width value based on t cy . ? calculate time to start pulse from timer start value of 0x0000. ? write pulse-width start and stop times into ocxr and ocxrs compare registers (x denotes channel 1, 2, ...,n). ? set timer period register to value equal to, or greater than, value in ocxrs compare register. ? set ocm<2:0> = 100 . ? enable timer, ton (txcon<15>) = 1 . to initiate another single pulse, issue another write to set ocm<2:0> = 100 . 13.3.2 continuous pulse mode for the user to configure the module for the generation of a continuous stream of output pulses, the following steps are required: ? determine instruction cycle time, t cy . ? calculate desired pulse value based on t cy . ? calculate timer to start pulse-width from timer start value of 0x0000. ? write pulse-width start and stop times into ocxr and ocxrs (x denotes channel 1, 2, ...,n) compare registers, respectively. ? set timer period register to value equal to, or greater than, value in ocxrs compare register. ? set ocm<2:0> = 101 . ? enable timer, ton (txcon<15>) = 1 . 13.4 simple pwm mode when control bits, ocm<2:0> (ocxcon<2:0>) = 110 or 111 , the selected output compare channel is config- ured for the pwm mode of operation. when configured for the pwm mode of operation, ocxr is the main latch (read-only) and ocxrs is the secondary latch. this enables glitchless pwm transitions. the user must perform the following steps in order to configure the output compare module for pwm operation: 1. set the pwm period by writing to the appropriate period register. 2. set the pwm duty cycle by writing to the ocxrs register. 3. configure the output compare module for pwm operation. 4. set the tmrx prescale value and enable the timer, ton (txcon<15>) = 1 . 13.4.1 input pin fault protection for pwm when control bits, ocm<2:0> (ocxcon<2:0>) = 111 , the selected output compare channel is again config- ured for the pwm mode of operation, with the addi- tional feature of input fault protection. while in this mode, if a logic ? 0 ? is detected on the ocfa/b pin, the respective pwm output pin is placed in the high- impedance input state. the ocflt bit (ocxcon<4>) indicates whether a fault condition has occurred. this state will be maintained until both of the following events have occurred: ? the external fault condition has been removed. ? the pwm mode has been re-enabled by writing to the appropriate control bits.
? 2008 microchip technology inc. ds70141e-page 85 dspic30f3010/3011 13.4.2 pwm period the pwm period is specified by writing to the prx register. the pwm period can be calculated using equation 13-1. equation 13-1: pwm period pwm frequency is defined as 1/[pwm period]. when the selected tmrx is equal to its respective period register, prx, the following four events occur on the next increment cycle: ? tmrx is cleared. ? the ocx pin is set. - exception 1: if pwm duty cycle is 0x0000, the ocx pin will remain low. - exception 2: if duty cycle is greater than prx, the pin will remain high. ? the pwm duty cycle is latched from ocxrs into ocxr. ? the corresponding timer interrupt flag is set. see figure 13-1 for key pwm period comparisons. timer3 is referred to in the figure for clarity. figure 13-1: pwm output timing 13.5 output compare operation during cpu sleep mode when the cpu enters the sleep mode, all internal clocks are stopped. therefore, when the cpu enters the sleep state, the output compare channel will drive the pin to the active state that was observed prior to entering the cpu sleep state. for example, if the pin was high when the cpu entered the sleep state, the pin will remain high. like- wise, if the pin was low when the cpu entered the sleep state, the pin will remain low. in either case, the output compare module will resume operation when the device wakes up. 13.6 output compare operation during cpu idle mode when the cpu enters the idle mode, the output compare module can operate with full functionality. the output compare channel will operate during the cpu idle mode if the ocsidl bit (ocxcon<13>) is at logic ? 0 ? and the selected time base (timer2 or timer3) is enabled and the tsidl bit of the selected timer is set to logic ? 0 ?. 13.7 output compare interrupts the output compare channels have the ability to generate an interrupt on a compare match for whichever match mode has been selected. for all modes except the pwm mode, when a compare event occurs, the respective interrupt flag (ocxif) is asserted and an interrupt will be generated, if enabled. the ocxif bit is located in the corresponding ifs register, and must be cleared in software. the interrupt is enabled via the respective compare interrupt enable (ocxie) bit, located in the corresponding iec register. for the pwm mode, when an event occurs, the respec- tive timer interrupt flag (t2if or t3if) is asserted and an interrupt will be generated, if enabled. the txif bit is located in the ifs0 register, and must be cleared in software. the interrupt is enabled via the respective timer interrupt enable bit (t2ie or t3ie), located in the iec0 register. the output compare interrupt flag is never set during the pwm mode of operation. pwm period = [(prx) + 1] ? 4 ? t osc ? (tmrx prescale value) period duty cycle tmr3 = duty cycle (ocxr) tmr3 = duty cycle (ocxr) tmr3 = pr3 t3if = 1 (interrupt flag) ocxr = ocxrs tmr3 = pr3 (interrupt flag) ocxr = ocxrs t3if = 1
dspic30f3010/3011 ds70141e-page 86 ? 2008 microchip technology inc. table 13-1: output compare register map (1) sfr name addr. bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 reset state oc1rs 0180 output compare 1 secondary register 0000 0000 0000 0000 oc1r 0182 output compare 1 main register 0000 0000 0000 0000 oc1con 0184 ? ?ocsidl ? ? ? ? ? ? ? ? ocflt octsel ocm<2:0> 0000 0000 0000 0000 oc2rs 0186 output compare 2 secondary register 0000 0000 0000 0000 oc2r 0188 output compare 2 main register 0000 0000 0000 0000 oc2con 018a ? ?ocsidl ? ? ? ? ? ? ? ? ocflt octsel ocm<2:0> 0000 0000 0000 0000 oc3rs (2) 018c output compare 3 secondary register 0000 0000 0000 0000 oc3r (2) 018e output compare 3 main register 0000 0000 0000 0000 oc3con (2) 0190 ? ?ocsidl ? ? ? ? ? ? ? ? ocflt octsel ocm<2:0> 0000 0000 0000 0000 oc4rs (2) 0192 output compare 4 secondary register 0000 0000 0000 0000 oc4r (2) 0194 output compare 4 main register 0000 0000 0000 0000 oc4con (2) 0196 ? ?ocsidl ? ? ? ? ? ? ? ? ocflt octsel ocm<2:0> 0000 0000 0000 0000 legend: ? = unimplemented bit, read as ? 0 ? note 1: refer to ? dspic30f family reference manual? (ds70046) for descriptions of register bit fields. 2: these registers are not available on dspic30f3010 devices.
? 2008 microchip technology inc. ds70141e-page 87 dspic30f3010/3011 14.0 quadrature encoder interface (qei) module this section describes the quadrature encoder interface (qei) module and associated operational modes. the qei module provides the interface to incremental encoders for obtaining mechanical position data. the operational features of the qei include: ? three input channels for two phase signals and index pulse ? 16-bit up/down position counter ? count direction status ? position measurement (x2 and x4) mode ? programmable digital noise filters on inputs ? alternate 16-bit timer/counter mode ? quadrature encoder interface interrupts these operating modes are determined by setting the appropriate bits qeim<2:0> (qeicon<10:8>). figure 14-1 depicts the quadrature encoder interface block diagram. figure 14-1: quadrature encoder interface block diagram note: this data sheet summarizes features of this group of dspic30f devices and is not intended to be a complete reference source. for more information on the cpu, peripherals, register descriptions and gen- eral device functionality, refer to the ? dspic30f family reference manual? (ds70046). 16-bit up/down counter comparator/ max count register quadrature programmable digital filter qea programmable digital filter indx up/down (1) 3 encoder programmable digital filter qeb interface logic qeim<2:0> mode select 3 (poscnt) (maxcnt) qeiif event flag reset equal 2 t cy 1 0 tqcs tqckps<1:0> 2 1, 8, 64, 256 prescaler q q d ck tqgate qeim<2:0> synchronize det 1 0 sleep input 0 1 updn_src qeicon<11> zero detect note 1: in dspic30f3010/3011, the updn pin is not available. up/down logic bit can still be polled by software.
dspic30f3010/3011 ds70141e-page 88 ? 2008 microchip technology inc. 14.1 quadrature encoder interface logic a typical incremental (a.k.a. optical) encoder has three outputs: phase a, phase b and an index pulse. these signals are useful and often required in position and speed control of acim and sr motors. the two channels, phase a (qea) and phase b (qeb), have a unique relationship. if phase a leads phase b, then the direction (of the motor) is deemed positive or forward. if phase a lags phase b, then the direction (of the motor) is deemed negative or reverse. a third channel, termed index pulse, occurs once per revolution and is used as a reference to establish an absolute position. the index pulse coincides with phase a and phase b, both low. 14.2 16-bit up/down position counter mode the 16-bit up/down counter counts up or down on every count pulse, which is generated by the difference of the phase a and phase b input signals. the counter acts as an integrator, whose count value is proportional to position. the direction of the count is determined by the updn signal, which is generated by the quadrature encoder interface logic. 14.2.1 position counter error checking position count error checking in the qei is provided for and indicated by the cnterr bit (qeicon<15>). the error checking only applies when the position counter is configured for reset on the index pulse modes (qeim<2:0> = 110 or 100 ). in these modes, the contents of the poscnt register are compared with the values (0xffff or maxcnt + 1 , depending on direction). if these values are detected, an error condi- tion is generated by setting the cnterr bit and a qei count error interrupt is generated. the qei count error interrupt can be disabled by setting the ceid bit (dfltcon<8>). the position counter continues to count encoder edges after an error has been detected. the poscnt register continues to count up/down until a natural rollover/underflow. no interrupt is generated for the natural rollover/underflow event. the cnterr bit is a read/write bit and reset in software by the user. 14.2.2 position counter reset the position counter reset enable bit, posres (qei<2>), controls whether the position counter is reset when the index pulse is detected. this bit is only applicable when qeim<2:0> = 100 or 110 . if the posres bit is set to ? 1 ?, then the position counter is reset when the index pulse is detected. if the posres bit is set to ? 0 ?, then the position counter is not reset when the index pulse is detected. the position counter will continue counting up or down, and will be reset on the rollover or underflow condition. when selecting the indx signal to reset the position counter (poscnt), the user has to specify the states on qea and qeb input pins. these states have to be matched in order for a reset to occur. these states are selected by the imv<1:0> bits in the dfltcon register. the imv<1:0> (index match value) bits allow the user to specify the state of the qea and qeb input pins during an index pulse when the poscnt register is to be reset. in x4 quadrature count mode: imv1 = required state of phase b input signal for match on index pulse imv0 = required state of phase a input signal for match on index pulse in x2 quadrature count mode: imv1 = selects phase input signal for index state match ( 0 = phase a, 1 = phase b) imv0 = required state of the selected phase input signal for match on index pulse the interrupt is still generated on the detection of the index pulse and not on the position counter overflow/ underflow. 14.2.3 count direction status as mentioned in the previous section, the qei logic generates an updn signal based upon the relationship between phase a and phase b. in addition to the out- put pin, the state of this internal updn signal is supplied to a sfr bit, updn (qeicon<11>), as a read-only bit. note: qei pins are multiplexed with analog inputs. the user must insure that all qei associ- ated pins are set as digital inputs in the adpcfg register.
? 2008 microchip technology inc. ds70141e-page 89 dspic30f3010/3011 14.3 position measurement mode there are two measurement modes which are sup- ported and are termed x2 and x4. these modes are selected by the qeim<2:0> mode select bits located in sfr, qeicon<10:8>. when control bits, qeim<2:0> = 100 or 101 , the x2 measurement mode is selected and the qei logic only looks at the phase a input for the position counter increment rate. every rising and falling edge of the phase a signal causes the position counter to be incre- mented or decremented. the phase b signal is still utilized for the determination of the counter direction, just as in the x4 measurement mode. within the x2 measurement mode, there are two variations of how the position counter is reset: 1. position counter reset by detection of index pulse, qeim<2:0> = 100 . 2. position counter reset by match with maxcnt, qeim<2:0> = 101 . when control bits, qeim<2:0> = 110 or 111 , the x4 measurement mode is selected and the qei logic looks at both edges of the phase a and phase b input signals. every edge of both signals causes the position counter to increment or decrement. within the x4 measurement mode, there are two variations of how the position counter is reset: 1. position counter reset by detection of index pulse, qeim<2:0> = 110 . 2. position counter reset by match with maxcnt, qeim<2:0> = 111 . the x4 measurement mode provides for finer resolu- tion data (more position counts) for determining motor position. 14.4 programmable digital noise filters the digital noise filter section is responsible for reject- ing noise on the incoming capture or quadrature signals. schmitt trigger inputs and a three-clock cycle delay filter combine to reject low level noise and large, short duration noise spikes that typically occur in noise prone applications, such as a motor system. the filter ensures that the filtered output signal is not permitted to change until a stable value has been registered for three consecutive clock cycles. for the qea, qeb and indx pins, the clock divide frequency for the digital filter is programmed by bits, qeck<2:0> (dfltcon<6:4>), and are derived from the base instruction cycle, t cy . to enable the filter output for channels, qea, qeb and indx, the qeout bit must be ? 1 ?. the filter network for all channels is disabled on por and bor. 14.5 alternate 16-bit timer/counter when the qei module is not configured for the qei mode, qeim<2:0> = 001 , the module can be config- ured as a simple 16-bit timer/counter. the setup and control of the auxiliary timer is accomplished through the qeicon sfr register. this timer functions identi- cally to timer1. the qea pin is used as the timer clock input. when configured as a timer, the poscnt register serves as the timer count register and the maxcnt register serves as the period register. when a timer/ period register match occurs, the qei interrupt flag will be asserted. the only exception between the general purpose timers and this timer is the added feature of external up/down input select. when the updn pin is asserted high, the timer will increment up. when the updn pin is asserted low, the timer will be decremented. the updn control/status bit (qeicon<11>) can be used to select the count direction state of the timer register. when updn = 1 , the timer will count up. when updn = 0 , the timer will count down. in addition, control bit, updn_src (qeicon<0>), determines whether the timer count direction state is based on the logic state written into the updn control/ status bit (qeicon<11>), or the qeb pin state. when updn_src = 1 , the timer count direction is controlled from the qeb pin. likewise, when updn_src = 0 , the timer count direction is controlled by the updn bit. 14.6 qei module operation during cpu sleep mode 14.6.1 qei operation during cpu sleep mode the qei module will be halted during the cpu sleep mode. 14.6.2 timer operation during cpu sleep mode during cpu sleep mode, the timer will not operate, because the internal clocks are disabled. note: changing the operational mode (i.e., from qei to timer or vice versa), will not affect the timer/position count register contents. note: this timer does not support the external asynchronous counter mode of operation. if using an external clock source, the clock will automatically be synchronized to the internal instruction cycle.
dspic30f3010/3011 ds70141e-page 90 ? 2008 microchip technology inc. 14.7 qei module operation during cpu idle mode since the qei module can function as a quadrature encoder interface, or as a 16-bit timer, the following section describes operation of the module in both modes. 14.7.1 qei operation during cpu idle mode when the cpu is placed in the idle mode, the qei module will operate if the qeisidl bit (qeicon<13>) = 0 . this bit defaults to a logic ? 0 ? upon executing por and bor. for halting the qei module during the cpu idle mode, qeisidl should be set to ? 1 ?. 14.7.2 timer operation during cpu idle mode when the cpu is placed in the idle mode and the qei module is configured in the 16-bit timer mode, the 16-bit timer will operate if the qeisidl bit (qei- con<13>) = 0 . this bit defaults to a logic ? 0 ? upon executing por and bor. for halting the timer module during the cpu idle mode, qeisidl should be set to ? 1 ?. if the qeisidl bit is cleared, the timer will function normally as if the cpu idle mode had not been entered. 14.8 quadrature encoder interface interrupts the quadrature encoder interface has the ability to generate an interrupt on occurrence of the following events: ? interrupt on 16-bit up/down position counter rollover/underflow ? detection of qualified index pulse, or if cnterr bit is set ? timer period match event (overflow/underflow) ? gate accumulation event the qei interrupt flag bit, qeiif, is asserted upon occurrence of any of the above events. the qeiif bit must be cleared in software. qeiif is located in the ifs2 register. enabling an interrupt is accomplished via the respec- tive enable bit, qeiie. the qeiie bit is located in the iec2 register.
? 2008 microchip technology inc. ds70141e-page 91 dspic30f3010/3011 table 14-1: qei register map (1) sfr name addr. bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 reset state qeicon 0122 cnterr ? qeisidl indx updn qeim2 qeim1 qeim0 swpab ? tqgate tqckps1 tqckps0 posres tqcs updn_src 0000 0000 0000 0000 dfltcon 0124 ? ? ? ? ? imv1 imv0 ceid qeout qeck2 qeck1 qeck0 ? ? ? ? 0000 0000 0000 0000 poscnt 0126 position counter<15:0> 0000 0000 0000 0000 maxcnt 0128 maximun count<15:0> 1111 1111 1111 1111 adpcfg 02a8 ? ? ? ? ? ? ? pcfg8 pcfg7 pcfg6 pcfg5 pcfg4 pcfg3 pcfg2 pcfg1 pcfg0 0000 0000 0000 0000 legend: ? = unimplemented bit, read as ? 0 ? note 1: refer to ? dspic30f family reference manual? (ds70046) for descriptions of register bit fields.
dspic30f3010/3011 ds70141e-page 92 ? 2008 microchip technology inc. notes:
? 2008 microchip technology inc. ds70141e-page 93 dspic30f3010/3011 15.0 motor control pwm module this module simplifies the task of generating multiple, synchronized pulse-width modulated (pwm) outputs. in particular, the following power and motion control applications are supported by the pwm module: ? three-phase ac induction motor ? switched reluctance (sr) motor ? brushless dc (bldc) motor ? uninterruptible power supply (ups) the pwm module has the following features: ? 6 pwm i/o pins with 3 duty cycle generators ? up to 16-bit resolution ? ?on-the-fly? pwm frequency changes ? edge and center-aligned output modes ? single pulse generation mode ? interrupt support for asymmetrical updates in center-aligned mode ? output override control for electrically commutative motor (ecm) operation ? ?special event? comparator for scheduling other peripheral events ? fault pins to optionally drive each of the pwm output pins to a defined state this module contains 3 duty cycle generators, numbered 1 through 3. the module has 6 pwm output pins, numbered pwm1h/pwm1l through pwm3h/ pwm3l. the six i/o pins are grouped into high/low numbered pairs, denoted by the suffix h or l, respectively. for complementary loads, the low pwm pins are always the complement of the corresponding high i/o pins. the pwm module allows several modes of operation which are beneficial for specific power control applications. note: this data sheet summarizes features of this group of dspic30f devices and is not intended to be a complete reference source. for more information on the cpu, peripherals, register descriptions and gen- eral device functionality, refer to the ? dspic30f family reference manual? (ds70046).
dspic30f3010/3011 ds70141e-page 94 ? 2008 microchip technology inc. figure 15-1: pwm mo dule block diagram pdc3 pdc3 buffer pwmcon1 ptper buffer pwmcon2 ptper ptmr comparator comparator channel 3 dead-time generator and ptcon sevtcmp comparator special event trigger ovdcon pwm enable and mode sfrs pwm manual control sfr channel 2 dead-time generator and channel 1 dead-time generator and pwm generator #2 pwm generator #1 pwm generator #3 sevtdir ptdir dtcon1 dead-time control sfrs special event postscaler pwm1l pwm1h pwm2l pwm2h note: details of pwm generator #1 and #2 not shown for clarity. 16-bit data bus pwm3l pwm3h fltacon fault pin control sfrs pwm time base output driver block flta override logic override logic override logic
? 2008 microchip technology inc. ds70141e-page 95 dspic30f3010/3011 15.1 pwm time base the pwm time base is provided by a 15-bit timer with a prescaler and postscaler. the time base is accessible via the ptmr sfr. ptdir (ptmr<15>) is a read-only status bit that indicates the present count direction of the pwm time base. if ptdir is cleared, ptmr is counting upwards. if ptdir is set, ptmr is counting downwards. the pwm time base is configured via the ptcon sfr. the time base is enabled/disabled by setting/clearing the pten bit in the ptcon sfr. ptmr is not cleared when the pten bit is cleared in software. the ptper sfr sets the counting period for ptmr. the user must write a 15-bit value to ptper<14:0>. when the value in ptmr<14:0> matches the value in ptper<14:0>, the time base will either reset to 0, or reverse the count direction on the next occurring clock cycle. the action taken depends on the operating mode of the time base. the pwm time base can be configured for four different modes of operation: ? free-running mode ? single-shot mode ? continuous up/down count mode ? continuous up/down count mode with interrupts for double updates these four modes are selected by the ptmod<1:0> bits in the ptcon sfr. the continuous up/down count modes support center-aligned pwm generation. the single-shot mode allows the pwm module to sup- port pulse control of certain electronically commutative motors (ecms). the interrupt signals generated by the pwm time base depend on the mode selection bits (ptmod<1:0>) and the postscaler bits (ptops<3:0>) in the ptcon sfr. 15.1.1 free-running mode in the free-running mode, the pwm time base counts upwards until the value in the time base period register (ptper) is matched. the ptmr register is reset on the following input clock edge and the time base will continue to count upwards as long as the pten bit remains set. when the pwm time base is in the free-running mode (ptmod<1:0> = 00 ), an interrupt event is generated each time a match with the ptper register occurs and the ptmr register is reset to zero. the postscaler selection bits may be used in this mode of the timer to reduce the frequency of the interrupt events. 15.1.2 single-shot mode in the single-shot mode, the pwm time base begins counting upwards when the pten bit is set. when the value in the ptmr register matches the ptper regis- ter, the ptmr register will be reset on the following input clock edge and the pten bit will be cleared by the hardware to halt the time base. when the pwm time base is in the single-shot mode (ptmod<1:0> = 01 ), an interrupt event is generated when a match with the ptper register occurs, the ptmr register is reset to zero on the following input clock edge, and the pten bit is cleared. the postscaler selection bits have no effect in this mode of the timer . 15.1.3 continuous up/down count modes in the continuous up/down count modes, the pwm time base counts upwards until the value in the ptper register is matched. the timer will begin counting downwards on the following input clock edge. the ptdir bit in the ptcon sfr is read-only and indicates the counting direction. the ptdir bit is set when the timer counts downwards. in the continuous up/down count mode (ptmod<1:0> = 10 ), an interrupt event is generated each time the value of the ptmr register becomes zero and the pwm time base begins to count upwards. the postscaler selection bits may be used in this mode of the timer to reduce the frequency of the interrupt events. note: if the period register is set to 0x0000, the timer will stop counting, and the interrupt and the special event trigger will not be generated, even if the special event value is also 0x0000. the module will not update the period register if it is already at 0x0000; therefore, the user must disable the module in order to update the period register.
dspic30f3010/3011 ds70141e-page 96 ? 2008 microchip technology inc. 15.1.4 double-update mode in the double-update mode (ptmod<1:0> = 11 ), an interrupt event is generated each time the ptmr regis- ter is equal to zero, as well as each time a period match occurs. the postscaler selection bits have no effect in this mode of the timer. the double-update mode provides two additional functions to the user. first, the control loop bandwidth is doubled because the pwm duty cycles can be updated, twice per period. second, asymmetrical center-aligned pwm waveforms can be generated, which are useful for minimizing output waveform distortion in certain motor control applications. 15.1.5 pwm time base prescaler the input clock to ptmr (f osc /4), has prescaler options of 1:1, 1:4, 1:16, or 1:64, selected by control bits, ptckps<1:0> in the ptcon sfr. the prescaler counter is cleared when any of the following occurs: ? a write to the ptmr register ? a write to the ptcon register ? any device reset the ptmr register is not cleared when ptcon is written. 15.1.6 pwm time base postscaler the match output of ptmr can optionally be post- scaled through a 4-bit postscaler (which gives a 1:1 to 1:16 scaling). the postscaler counter is cleared when any of the following occurs: ? a write to the ptmr register ? a write to the ptcon register ? any device reset the ptmr register is not cleared when ptcon is written. 15.2 pwm period ptper is a 15-bit register and is used to set the counting period for the pwm time base. ptper is a double- buffered register. the ptper buffer contents are loaded into the ptper register at the following instances: ?free -r unning and single -s hot modes: when the ptmr register is reset to zero after a match with the ptper register. ? continuous up/down count m odes : when the ptmr register is zero. the value held in the ptper buffer is automatically loaded into the ptper register when the pwm time base is disabled (pten = 0 ). the pwm period can be determined using equation 15-1: equation 15-1: pwm period (free-running mode) if the pwm time base is configured for one of the continuous up/down count modes, the pwm period is given by equation 15-2. equation 15-2: pwm period (up/down counting mode) the maximum resolution (in bits) for a given device oscillator and pwm frequency can be determined using equation 15-3: equation 15-3: pwm resolution note: programming a value of 0x0001 in the period register could generate a continu- ous interrupt pulse, and hence, must be avoided. t pwm = t cy ? (ptper + 1) (ptmr prescale value) t pwm = 2 ? t cy ? (ptper + 0.75) (ptmr prescale value) resolution = log (2 ? t pwm / t cy ) log (2)
? 2008 microchip technology inc. ds70141e-page 97 dspic30f3010/3011 15.3 edge-aligned pwm edge-aligned pwm signals are produced by the module when the pwm time base is in the free-running or single-shot mode. for edge-aligned pwm outputs, the output has a period specified by the value in ptper and a duty cycle specified by the appropriate duty cycle register (see figure 15-2). the pwm output is driven active at the beginning of the period (ptmr = 0 ) and is driven inactive when the value in the duty cycle register matches ptmr. if the value in a particular duty cycle register is zero, then the output on the corresponding pwm pin will be inactive for the entire pwm period. in addition, the out- put on the pwm pin will be active for the entire pwm period if the value in the duty cycle register is greater than the value held in the ptper register. figure 15-2: edge-aligned pwm 15.4 center-aligned pwm center-aligned pwm signals are produced by the module when the pwm time base is configured in a continuous up/down count mode (see figure 15-3). the pwm compare output is driven to the active state when the value of the duty cycle register matches the value of ptmr and the pwm time base is counting downwards (ptdir = 1 ). the pwm compare output is driven to the inactive state when the pwm time base is counting upwards (ptdir = 0 ) and the value in the ptmr register matches the duty cycle value. if the value in a particular duty cycle register is zero, then the output on the corresponding pwm pin will be inactive for the entire pwm period. in addition, the out- put on the pwm pin will be active for the entire pwm period if the value in the duty cycle register is equal to the value held in the ptper register. figure 15-3: center-aligned pwm 15.5 pwm duty cycle comparison units there are three 16-bit special function registers (pdc1, pdc2 and pdc3) used to specify duty cycle values for the pwm module. the value in each duty cycle register determines the amount of time that the pwm output is in the active state. the duty cycle registers are 16 bits wide. the lsb of a duty cycle register determines whether the pwm edge occurs in the beginning. thus, the pwm resolution is effectively doubled. 15.5.1 duty cycle register buffers the three pwm duty cycle registers are double- buffered to allow glitchless updates of the pwm outputs. for each duty cycle, there is a duty cycle reg- ister that is accessible by the user and a second duty cycle register that holds the actual compare value used in the present pwm period. for edge-aligned pwm output, a new duty cycle value will be updated whenever a match with the ptper register occurs and ptmr is reset. the contents of the duty cycle buffers are automatically loaded into the duty cycle registers when the pwm time base is disabled (pten = 0 ) and the udis bit is cleared in pwmcon2. when the pwm time base is in the continuous up/ down count mode, new duty cycle values are updated when the value of the ptmr register is zero and the pwm time base begins to count upwards. the contents of the duty cycle buffers are automatically loaded into the duty cycle registers when the pwm time base is disabled (pten = 0 ). period duty cycle 0 ptper ptmr value new duty cycle latched 0 ptper ptmr value period period/2 duty cycle
dspic30f3010/3011 ds70141e-page 98 ? 2008 microchip technology inc. when the pwm time base is in the continuous up/ down count mode with double updates, new duty cycle values are updated when the value of the ptmr regis- ter is zero, and when the value of the ptmr register matches the value in the ptper register. the contents of the duty cycle buffers are automatically loaded into the duty cycle registers when the pwm time base is disabled (pten = 0 ). 15.6 complementary pwm operation in the complementary mode of operation, each pair of pwm outputs is obtained by a complementary pwm signal. a dead time may be optionally inserted during device switching, when both outputs are inactive for a short period (refer to section 15.7 ?dead-time generators? ). in complementary mode, the duty cycle comparison units are assigned to the pwm outputs as follows: ? pdc1 register controls pwm1h/pwm1l outputs ? pdc2 register controls pwm2h/pwm2l outputs ? pdc3 register controls pwm3h/pwm3l outputs the complementary mode is selected for each pwm i/o pin pair by clearing the appropriate pmodx bit in the pwmcon1 sfr. the pwm i/o pins are set to complementary mode by default upon a device reset. 15.7 dead-time generators dead-time generation may be provided when any of the pwm i/o pin pairs are operating in the complementary output mode. the pwm outputs use push-pull drive cir- cuits. due to the inability of the power output devices to switch instantaneously, some amount of time must be provided between the turn-off event of one pwm output in a complementary pair and the turn-on event of the other transistor. the pwm module allows two different dead times to be programmed. these two dead times may be used in one of two methods described below to increase user flexibility: ? the pwm output signals can be optimized for different turn-off times in the high side and low side transistors in a complementary pair of transistors. the first dead time is inserted between the turn-off event of the lower transistor of the complementary pair and the turn-on event of the upper transistor. the second dead time is inserted between the turn-off event of the upper transistor and the turn-on event of the lower transistor. ? the two dead times can be assigned to individual pwm i/o pin pairs. this operating mode allows the pwm module to drive different transistor/load combinations with each complementary pwm i/o pin pair. 15.7.1 dead-time generators each complementary output pair for the pwm module has a 6-bit down counter that is used to produce the dead-time insertion. as shown in figure 15-4, each dead-time unit has a rising and falling edge detector connected to the duty cycle comparison output. 15.7.2 dead-time ranges the amount of dead time provided by the dead-time unit is selected by specifying the input clock prescaler value and a 6-bit unsigned value. four input clock prescaler selections have been pro- vided to allow a suitable range of dead time, based on the device operating frequency. the dead-time clock prescaler values are selected using the dtaps<1:0> control bits in the dtcon1 sfr. one of four clock prescaler options (t cy , 2 t cy , 4 t cy or 8 t cy ) may be selected. after the prescaler value is selected, the dead time is adjusted by loading 6-bit unsigned values into the dtcon1 sfr. the dead-time unit prescaler is cleared on the following events: ? on a load of the down timer due to a duty cycle comparison edge event. ? on a write to the dtcon1 register. ? on any device reset. note: the user should not modify the dtcon1 value while the pwm module is operating (pten = 1 ). unexpected results may occur.
? 2008 microchip technology inc. ds70141e-page 99 dspic30f3010/3011 figure 15-4: dead-time timing diagram duty cycle generator pwmxh pwmxl dead time dead time
dspic30f3010/3011 ds70141e-page 100 ? 2008 microchip technology inc. 15.8 independent pwm output an independent pwm output mode is required for driving certain types of loads. a particular pwm output pair is in the independent output mode when the corresponding pmod bit in the pwmcon1 register is set. no dead-time control is implemented between adjacent pwm i/o pins when the module is operating in the independent mode and both i/o pins are allowed to be active simultaneously. in the independent mode, each duty cycle generator is connected to both of the pwm i/o pins in an output pair. by using the associated duty cycle register and the appropriate bits in the ovdcon register, the user may select the following signal output options for each pwm i/o pin operating in the independent mode: ? i/o pin outputs pwm signal ? i/o pin inactive ? i/o pin active 15.9 single pulse pwm operation the pwm module produces single pulse outputs when the ptcon control bits, ptmod<1:0> = 10 . only edge-aligned outputs may be produced in the single pulse mode. in single pulse mode, the pwm i/o pin(s) are driven to the active state when the pten bit is set. when a match with a duty cycle register occurs, the pwm i/o pin is driven to the inactive state. when a match with the ptper register occurs, the ptmr register is cleared, all active pwm i/o pins are driven to the inactive state, the pten bit is cleared and an interrupt is generated. 15.10 pwm output override the pwm output override bits allow the user to manually drive the pwm i/o pins to specified logic states, independent of the duty cycle comparison units. all control bits associated with the pwm output over- ride function are contained in the ovdcon register. the upper half of the ovdcon register contains six bits, povdxh<3:1> and povdxl<3:1>, that determine which pwm i/o pins will be overridden. the lower half of the ovdcon register contains six bits, poutxh<3:1> and poutxl<3:1>, that determine the state of the pwm i/o pins when a particular output is overridden via the povd bits. 15.10.1 complementary output mode when a pwmxl pin is driven active via the ovdcon register, the output signal is forced to be the comple- ment of the corresponding pwmxh pin in the pair. dead-time insertion is still performed when pwm channels are overridden manually. 15.10.2 override synchronization if the osync bit in the pwmcon2 register is set, all output overrides performed via the ovdcon register are synchronized to the pwm time base. synchronous output overrides occur at the following times: ? edge-aligned mode, when ptmr is zero. ? center-aligned modes, when ptmr is zero and when the value of ptmr matches ptper.
? 2008 microchip technology inc. ds70141e-page 101 dspic30f3010/3011 15.11 pwm output and polarity control there are three device configuration bits associated with the pwm module that provide pwm output pin control: ? hpol configuration bit ? lpol configuration bit ? pwmpin configuration bit these three bits in the fborpor configuration register (see section 20.6 ?device configuration registers? ) work in conjunction with the pwm enable bits (penxh and penxl) located in the pwmcon1 sfr. the configuration bits and pwm enable bits ensure that the pwm pins are in the correct states after a device reset occurs. the pwmpin configuration bit allows the pwm module outputs to be optionally enabled on a device reset. if pwmpin = 0 , the pwm outputs will be driven to their inactive states at reset. if pwmpin = 1 (default), the pwm outputs will be tri- stated. the hpol bit specifies the polarity for the pwmxh outputs, whereas the lpol bit specifies the polarity for the pwmxl outputs. 15.11.1 output pin control the penxh<3:1> and penxl<3:1> control bits in the pwmcon1 sfr enable each high pwm output pin and each low pwm output pin, respectively. if a particular pwm output pin is not enabled, it is treated as a general purpose i/o pin. 15.12 pwm fault pin there is one fault pin (flta ) associated with the pwm module. when asserted, this pin can optionally drive each of the pwm i/o pins to a defined state. 15.12.1 fault pin enable bits the fltacon sfr has three control bits that deter- mine whether a particular pair of pwm i/o pins is to be controlled by the fault input pin. to enable a specific pwm i/o pin pair for fault overrides, the corresponding bit should be set in the fltacon register. if all enable bits are cleared in the fltacon register, then the corresponding fault input pin has no effect on the pwm module and the pin may be used as a general purpose interrupt or i/o pin. 15.12.2 fault states the fltacon special function register has 6 bits that determine the state of each pwm i/o pin when it is overridden by a fault input. when these bits are cleared, the pwm i/o pin is driven to the inactive state. if the bit is set, the pwm i/o pin will be driven to the active state. the active and inactive states are refer- enced to the polarity defined for each pwm i/o pin (hpol and lpol polarity control bits). a special case exists when a pwm module i/o pair is in the complementary mode and both pins are pro- grammed to be active on a fault condition. the pwmxh pin always has priority in the complementary mode, so that both i/o pins cannot be driven active simultaneously. 15.12.3 fault input modes the fault input pin has two modes of operation: ? latched mode: when the fault pin is driven low, the pwm outputs will go to the states defined in the fltacon register. the pwm outputs will remain in this state until the fault pin is driven high and the corresponding interrupt flag has been cleared in software. when both of these actions have occurred, the pwm outputs will return to normal operation at the beginning of the next pwm cycle or half-cycle boundary. if the interrupt flag is cleared before the fault condition ends, the pwm module will wait until the fault pin is no longer asserted to restore the outputs. ? cycle-by-cycle mode: when the fault input pin is driven low, the pwm outputs remain in the defined fault states for as long as the fault pin is held low. after the fault pin is driven high, the pwm outputs return to normal operation at the beginning of the following pwm cycle or half-cycle boundary. the operating mode for the fault input pin is selected using the fltam control bit in the fltacon special function register. the fault pin can be controlled manually in software. note: the fault pin logic can operate indepen- dent of the pwm logic. if all the enable bits in the fltacon register are cleared, then the fault pin could be used as a general purpose interrupt pin. the fault pin has an interrupt vector, interrupt flag bit and interrupt priority bits associated with it.
dspic30f3010/3011 ds70141e-page 102 ? 2008 microchip technology inc. 15.13 pwm update lockout for a complex pwm application, the user may need to write up to three duty cycle registers and the time base period register, ptper, at a given time. in some applications, it is important that all buffer registers be written before the new duty cycle and period values are loaded for use by the module. the pwm update lockout feature is enabled by setting the udis control bit in the pwmcon2 sfr. the udis bit affects all duty cycle buffer registers and the pwm time base period buffer, ptper. no duty cycle changes or period value changes will have effect while udis = 1 . 15.14 pwm special event trigger the pwm module has a special event trigger that allows a/d conversions to be synchronized to the pwm time base. the a/d sampling and conversion time may be programmed to occur at any point within the pwm period. the special event trigger allows the user to minimize the delay between the time when a/d conver- sion results are acquired and the time when the duty cycle value is updated. the pwm special event trigger has an sfr named sevtcmp, and five control bits to control its operation. the ptmr value for which a special event trigger should occur is loaded into the sevtcmp register. when the pwm time base is in a continuous up/down count mode, an additional control bit is required to specify the counting phase for the special event trig- ger. the count phase is selected using the sevtdir control bit in the sevtcmp sfr. if the sevtdir bit is cleared, the special event trigger will occur on the upward counting cycle of the pwm time base. if the sevtdir bit is set, the special event trigger will occur on the downward count cycle of the pwm time base. the sevtdir control bit has no effect unless the pwm time base is configured for a continuous up/down count mode. 15.14.1 special event trigger postscaler the pwm special event trigger has a postscaler that allows a 1:1 to 1:16 postscale ratio. the postscaler is configured by writing the sevops<3:0> control bits in the pwmcon2 sfr. the special event output postscaler is cleared on the following events: ? any write to the sevtcmp register ? any device reset 15.15 pwm operation during cpu sleep mode the fault a input pin has the ability to wake the cpu from sleep mode. the pwm module generates an interrupt if the fault pin is driven low while in sleep. 15.16 pwm operation during cpu idle mode the ptcon sfr contains a ptsidl control bit. this bit determines if the pwm module will continue to operate or stop when the device enters idle mode. if ptsidl = 0 , the module will continue to operate. if ptsidl = 1 , the module will stop operation as long as the cpu remains in idle mode.
? 2008 microchip technology inc. ds70141e-page 103 dspic30f3010/3011 table 15-1: pwm register map (1) sfr name addr. bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 reset state ptcon 01c0 pten ?ptsidl ? ? ? ? ? ptops<3:0> ptckps<1:0> ptmod<1:0> 0000 0000 0000 0000 ptmr 01c2 ptdir pwm timer count value 0000 0000 0000 0000 ptper 01c4 ? pwm time base period register 0000 0000 0000 0000 sevtcmp 01c6 sevtdir pwm special event compare register 0111 1111 1111 1111 pwmcon1 01c8 ? ? ? ? ? ptmod3 ptmod2 ptmod1 ? pen3h pen2h pen1h ? pen3l pen2l pen1l 0000 0000 1111 1111 pwmcon2 01ca ? ? ? ? sevops<3:0> ? ? ? ? ? ? osync udis 0000 0000 0000 0000 dtcon1 01cc ? ? ? ? ? ? ? ? dtaps<1:0> dead-time a value 0000 0000 0000 0000 fltacon 01d0 ? ? faov3h faov3l faov2h faov2l faov1h faov1l fltam ? ? ? ? faen3 faen2 faen1 0000 0000 0000 0000 ovdcon 01d4 ? ? povd3h povd3l povd2h povd2l povd1h povd1l ? ? pout3h pout3l pout2h pout2l pout1h pout1l 1111 1111 0000 0000 pdc1 01d6 pwm duty cycle 1 register 0000 0000 0000 0000 pdc2 01d8 pwm duty cycle 2 register 0000 0000 0000 0000 pdc3 01da pwm duty cycle 3 register 0000 0000 0000 0000 legend: ? = unimplemented bit, read as ? 0 ? note 1: refer to ? dspic30f family reference manual? (ds70046) for descriptions of register bit fields.
dspic30f3010/3011 ds70141e-page 104 ? 2008 microchip technology inc. notes:
? 2008 microchip technology inc. ds70141e-page 105 dspic30f3010/3011 16.0 spi module the serial peripheral interface (spi) module is a synchronous serial interface. it is useful for communicating with other peripheral devices, such as eeproms, shift registers, display drivers and a/d converters or other microcontrollers. it is compatible with spi and siop interfaces available on some other microcontrollers. 16.1 operating function description the spi module consists of a 16-bit shift register, spi1sr, used for shifting data in and out, and a buffer register, spi1buf. a control register, spi1con, configures the module. additionally, a status register, spi1stat, indicates various status conditions. the serial interface consists of 4 pins: sdi1 (serial data input), sdo1 (serial data output), sck1 (shift clock input or output) and ss1 (active-low slave select). in master mode operation, sck1 is a clock output, but in slave mode, it is a clock input. a series of eight (8) or sixteen (16) clock pulses shifts out bits from the spi1sr to the sdo1 pin and simultaneously shifts in data from the sdi1 pin. an interrupt is generated when the transfer is complete and the corresponding interrupt flag bit (spi1if) is set. this interrupt can be disabled through an interrupt enable bit (spi1ie). the receive operation is double-buffered. when a complete byte is received, it is transferred from spi1sr to spi1buf. if the receive buffer is full when new data is being transferred from spi1sr to spi1buf, the module will set the spirov bit, indicating an overflow condition. the transfer of the data from spi1sr to spi1buf will not be completed and the new data will be lost. the module will not respond to scl transitions while spirov is ? 1 ?, effectively disabling the module until spi1buf is read by user software. transmit writes are also double-buffered. the user writes to spi1buf. when the master or slave transfer is completed, the contents of the shift register (spi1sr) are moved to the receive buffer. if any trans- mit data has been written to the buffer register, the contents of the transmit buffer are moved to spi1sr. the received data is thus placed in spi1buf and the transmit data in spi1sr is ready for the next transfer. in master mode, the clock is generated by prescaling the system clock. data is transmitted as soon as a value is written to spi1buf. the interrupt is generated at the middle of the transfer of the last bit. in slave mode, data is transmitted and received as external clock pulses appear on sckx. again, the interrupt is generated when the last bit is latched. if ssx control is enabled, then transmission and reception are enabled only when ssx = low. the sdox output will be disabled in ssx mode with ssx high. the clock provided to the module is (f osc /4). this clock is then prescaled by the primary (ppre<1:0>) and the secondary (spre<2:0>) prescale factors. the cke bit determines whether transmit occurs on transi- tion from active clock state to idle clock state, or vice versa. the ckp bit selects the idle state (high or low) for the clock. 16.1.1 word and byte communication a control bit, mode16 (spi1con<10>), allows the module to communicate in either 16-bit or 8-bit mode. 16-bit operation is identical to 8-bit operation, except that the number of bits transmitted is 16 instead of 8. the user software must disable the module prior to changing the mode16 bit. the spi module is reset when the mode16 bit is changed by the user. a basic difference between 8-bit and 16-bit operation is that the data is transmitted out of bit 7 of the spixsr for 8-bit operation, and data is transmitted out of bit 15 of the spixsr for 16-bit operation. in both modes, data is shifted into bit 0 of the spixsr. 16.1.2 sdo1 disable a control bit, dissdo, is provided to the spi1con register to allow the sdo1 output to be disabled. this will allow the spi module to be connected in an input only configuration. sdox can also be used for general purpose i/o. note: this data sheet summarizes features of this group of dspic30f devices and is not intended to be a complete reference source. for more information on the cpu, peripherals, register descriptions and gen- eral device functionality, refer to the ? dspic30f family reference manual? (ds70046). note: both the transmit buffer (spi1txb) and the receive buffer (spi1rxb) are mapped to the same register address, spi1buf.
dspic30f3010/3011 ds70141e-page 106 ? 2008 microchip technology inc. 16.2 framed spi support the module supports a basic framed spi protocol in master or slave mode. the control bit, frmen, enables framed spi support and causes the ss1 pin to perform the frame synchronization (f sync ) pulse function. the control bit, spifsd, determines whether the ss1 pin is an input or an output (i.e., whether the module receives or generates the frame synchroniza- tion pulse). the frame pulse is an active-high pulse for a single spi clock cycle. when frame synchronization is enabled, the data transmission starts only on the subsequent transmit edge of the spi clock. figure 16-1: sp i block diagram figure 16-2: spi mast er/slave connection read write internal data bus sdi1 sdo1 ss1 sck1 spi1sr spi1buf bit 0 shift clock edge select f cy primary 1, 4, 16, 64 enable master clock prescaler secondary prescaler 1:1 ? 1:8 ss x & fsync control clock control transmit spi1buf receive serial input buffer (spixbuf) shift register (spixsr) msb lsb sdox sdix processor 1 sckx spi master serial input buffer (spiybuf) shift register (spiysr) lsb msb sdiy sdoy processor 2 scky spi slave serial clock note: x = 1 or 2, y = 1 or 2.
? 2008 microchip technology inc. ds70141e-page 107 dspic30f3010/3011 16.3 slave select synchronization the ss1 pin allows a synchronous slave mode. the spi must be configured in spi slave mode with ss1 pin control enabled (ssen = 1 ). when the ss1 pin is low, transmission and reception are enabled and the sdo1 pin is driven. when the ss1 pin goes high, the sdo1 pin is no longer driven. also, the spi module is resynchronized and all counters/control circuitry are reset. therefore, when the ss1 pin is asserted low again, transmission/reception will begin at the msb, even if ss1 has been deasserted in the middle of a transmit/receive. 16.4 spi operation during cpu sleep mode during sleep mode, the spi module is shut down. if the cpu enters sleep mode while an spi transaction is in progress, then the transmission and reception is aborted. the transmitter and receiver will stop in sleep mode. however, register contents are not affected by entering or exiting sleep mode. 16.5 spi operation during cpu idle mode when the device enters idle mode, all clock sources remain functional. the spisidl bit (spi1stat<13>) selects if the spi module will stop or continue on idle. if spisidl = 0 , the module will continue to operate when the cpu enters idle mode. if spisidl = 1 , the module will stop when the cpu enters idle mode.
dspic30f3010/3011 ds70141e-page 108 ? 2008 microchip technology inc. table 16-1: spi1 register map (1) sfr name addr. bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 reset state spi1stat 0220 spien ? spisidl ? ? ? ? ? ? spirov ? ? ? ? spitbf spirbf 0000 0000 0000 0000 spi1con 0222 ? frmen spifsd ? dissdo mode16 smp cke ssen ckp msten spre2 spre1 spre0 ppre1 ppre0 0000 0000 0000 0000 spi1buf 0224 transmit and receive buffer 0000 0000 0000 0000 legend: ? = unimplemented bit, read as ? 0 ? note 1: refer to ? dspic30f family reference manual? (ds70046) for descriptions of register bit fields.
? 2008 microchip technology inc. ds70141e-page 109 dspic30f3010/3011 17.0 i 2 c? module the inter-integrated circuit (i 2 c?) module provides complete hardware support for both slave and multi- master modes of the i 2 c serial communication standard with a 16-bit interface. this module offers the following key features: ?i 2 c interface supporting both master and slave operation. ?i 2 c slave mode supports 7 and 10-bit addressing. ?i 2 c master mode supports 7 and 10-bit addressing. ?i 2 c port allows bidirectional transfers between master and slaves. ? serial clock synchronization for i 2 c port can be used as a handshake mechanism to suspend and resume serial transfer (sclrel control). ?i 2 c supports multi-master operation; detects bus collision and will arbitrate accordingly. 17.1 operating function description the hardware fully implements all the master and slave functions of the i 2 c standard and fast mode specifications, as well as 7 and 10-bit addressing. thus, the i 2 c module can operate either as a slave or a master on an i 2 c bus. 17.1.1 various i 2 c modes the following types of i 2 c operation are supported: ?i 2 c slave operation with 7-bit addressing ?i 2 c slave operation with 10-bit addressing ?i 2 c master operation with 7 or 10-bit addressing see the i 2 c programmer?s model in figure 17-1. 17.1.2 pin configuration in i 2 c mode i 2 c has a 2-pin interface; pin scl is clock and pin sda is data. 17.1.3 i 2 c registers i2ccon and i2cstat are control and status registers, respectively. the i2ccon register is readable and writable. the lower 6 bits of i2cstat are read-only. the remaining bits of the i2cstat are read/write. i2crsr is the shift register used for shifting data, whereas i2crcv is the buffer register to which data bytes are written, or from which data bytes are read. i2crcv is the receive buffer, as shown in figure 17-1. i2ctrn is the transmit register to which bytes are written during a transmit operation, as shown in figure 17-2. the i2cadd register holds the slave address. a status bit, add10, indicates 10-bit addressing mode. the i2cbrg acts as the baud rate generator (brg) reload value. in receive operations, i2crsr and i2crcv together form a double-buffered receiver. when i2crsr receives a complete byte, it is transferred to i2crcv and an interrupt pulse is generated. during transmission, the i2ctrn is not double-buffered. figure 17-1: programmer?s model note: this data sheet summarizes features of this group of dspic30f devices and is not intended to be a complete reference source. for more information on the cpu, peripherals, register descriptions and gen- eral device functionality, refer to the ? dspic30f family reference manual? (ds70046). note: following a restart condition in 10-bit mode, the user only needs to match the first 7-bit address. bit 7 bit 0 i2crcv (8 bits) bit 7 bit 0 i2ctrn (8 bits) bit 8 bit 0 i2cbrg (9 bits) bit 15 bit 0 i2ccon (16 bits) bit 15 bit 0 i2cstat (16 bits) bit 9 bit 0 i2cadd (10 bits)
dspic30f3010/3011 ds70141e-page 110 ? 2008 microchip technology inc. figure 17-2: i 2 c? block diagram i2crsr i2crcv internal data bus scl sda shift match detect i2cadd start and stop bit detect clock addr_match clock stretching i2ctrn lsb shift clock write read brg down i2cbrg reload control f cy start, restart, stop bit generate write read acknowledge generation collision detect write read write read i2ccon write read i2cstat control logic read lsb counter
? 2008 microchip technology inc. ds70141e-page 111 dspic30f3010/3011 17.2 i 2 c module addresses the i2cadd register contains the slave mode addresses. the register is a 10-bit register. if the a10m bit (i2ccon<10>) is ? 0 ?, the address is interpreted by the module as a 7-bit address. when an address is received, it is compared to the 7 lsbs of the i2cadd register. if the a10m bit is ? 1 ?, the address is assumed to be a 10-bit address. when an address is received, it will be compared with the binary value, ? 11110 a9 a8 ? (where a9 and a8 are two most significant bits of i2cadd). if that value matches, the next address will be compared with the least significant 8 bits of i2cadd, as specified in the 10-bit addressing protocol. the 7-bit i 2 c slave addresses supported by the dspic30f are shown in table 17-1. table 17-1: 7-bit i 2 c? slave addresses 17.3 i 2 c 7-bit slave mode operation once enabled (i2cen = 1 ), the slave module will wait for a start bit to occur (i.e., the i 2 c module is ?idle?). following the detection of a start bit, 8 bits are shifted into i2crsr and the address is compared against i2cadd. in 7-bit mode (a10m = 0 ), bits i2cadd<6:0> are compared against i2crsr<7:1> and i2crsr<0> is the r_w bit. all incoming bits are sampled on the rising edge of scl. if an address match occurs, an acknowledgement will be sent, and the slave event interrupt flag (si2cif) is set on the falling edge of the ninth (ack ) bit. the address match does not affect the contents of the i2crcv buffer or the rbf bit. 17.3.1 slave transmission if the r_w bit received is a ? 1 ?, then the serial port will go into transmit mode. it will send an ack on the ninth bit and then hold scl to ? 0 ? until the cpu responds by writing to i2ctrn. scl is released by setting the sclrel bit, and 8 bits of data are shifted out. data bits are shifted out on the falling edge of scl, such that sda is valid during scl high. the interrupt pulse is sent on the falling edge of the ninth clock pulse, regardless of the status of the ack received from the master. 17.3.2 slave reception if the r_w bit received is a ? 0 ? during an address match, then receive mode is initiated. incoming bits are sampled on the rising edge of scl. after 8 bits are received, if i2crcv is not full or i2cov is not set, i2crsr is transferred to i2crcv. ack is sent on the ninth clock. if the rbf flag is set, indicating that i2crcv is still holding data from a previous operation (rbf = 1 ), then ack is not sent; however, the interrupt pulse is gener- ated. in the case of an overflow, the contents of the i2crsr are not loaded into the i2crcv. 17.4 i 2 c 10-bit slave mode operation in 10-bit mode, the basic receive and transmit opera- tions are the same as in the 7-bit mode. however, the criteria for address match is more complex. the i 2 c specification dictates that a slave must be addressed for a write operation, with two address bytes following a start bit. the a10m bit is a control bit that signifies that the address in i2cadd is a 10-bit address rather than a 7-bit address. the address detection protocol for the first byte of a message address is identical for 7-bit and 10-bit messages, but the bits being compared are different. i2cadd holds the entire 10-bit address. upon receiv- ing an address following a start bit, i2crsr <7:3> is compared against a literal ? 11110 ? (the default 10-bit address) and i2crsr<2:1> are compared against i2cadd<9:8>. if a match occurs and if r_w = 0 , the interrupt pulse is sent. the add10 bit will be cleared to indicate a partial address match. if a match fails or r_w = 1 , the add10 bit is cleared and the module returns to the idle state. the low byte of the address is then received and com- pared with i2cadd<7:0>. if an address match occurs, the interrupt pulse is generated and the add10 bit is set, indicating a complete 10-bit address match. if an address match did not occur, the add10 bit is cleared and the module returns to the idle state. 0x00 general call address or start byte 0x01-0x03 reserved 0x04-0x07 hs mode master codes 0x08-0x77 valid 7-bit addresses 0x78-0x7b valid 10-bit addresses (lower 7 bits) 0x7c-0x7f reserved note: the i2crcv will be loaded if the i2cov bit = 1 and the rbf flag = 0 . in this case, a read of the i2crcv was performed, but the user did not clear the state of the i2cov bit before the next receive occurred. the acknowledgement is not sent (ack = 1 ) and the i2crcv is updated.
dspic30f3010/3011 ds70141e-page 112 ? 2008 microchip technology inc. 17.4.1 10-bit mode slave transmission once a slave is addressed in this fashion, with the full 10-bit address (we will refer to this state as ? prior_addr_match ?), the master can begin sending data bytes for a slave reception operation. 17.4.2 10-bit mode slave reception once addressed, the master can generate a repeated start, reset the high byte of the address and set the r_w bit without generating a stop bit, thus initiating a slave transmit operation. 17.5 automatic clock stretch in the slave modes, the module can synchronize buffer reads and writes to the master device by clock stretching. 17.5.1 transmit clock stretching both 10-bit and 7-bit transmit modes implement clock stretching by asserting the sclrel bit after the falling edge of the ninth clock if the tbf bit is cleared, indicating the buffer is empty. in slave transmit modes, clock stretching is always performed, irrespective of the stren bit. clock synchronization takes place following the ninth clock of the transmit sequence. if the device samples an ack on the falling edge of the ninth clock, and if the tbf bit is still clear, then the sclrel bit is automati- cally cleared. the sclrel being cleared to ? 0 ? will assert the scl line low. the user?s isr must set the sclrel bit before transmission is allowed to continue. by holding the scl line low, the user has time to service the isr and load the contents of the i2ctrn before the master device can initiate another transmit sequence. 17.5.2 receive clock stretching the stren bit in the i2ccon register can be used to enable clock stretching in slave receive mode. when the stren bit is set, the scl pin will be held low at the end of each data receive sequence. 17.5.3 clock stretching during 7-bit addressing (stren = 1 ) when the stren bit is set in slave receive mode, the scl line is held low when the buffer register is full. the method for stretching the scl output is the same for both 7 and 10-bit addressing modes. clock stretching takes place following the ninth clock of the receive sequence. on the falling edge of the ninth clock at the end of the ack sequence, if the rbf bit is set, the sclrel bit is automatically cleared, forcing the scl output to be held low. the user?s isr must set the sclrel bit before reception is allowed to continue. by holding the scl line low, the user has time to service the isr and read the contents of the i2crcv before the master device can initiate another receive sequence. this will prevent buffer overruns from occurring. 17.5.4 clock stretching during 10-bit addressing (stren = 1 ) clock stretching takes place automatically during the addressing sequence. because this module has a register for the entire address, it is not necessary for the protocol to wait for the address to be updated. after the address phase is complete, clock stretching will occur on each data receive or transmit sequence as was described earlier. 17.6 software controlled clock stretching (stren = 1 ) when the stren bit is ? 1 ?, the sclrel bit may be cleared by software to allow software to control the clock stretching. the logic will synchronize writes to the sclrel bit with the scl clock. clearing the sclrel bit will not assert the scl output until the module detects a falling edge on the scl output and scl is sampled low. if the sclrel bit is cleared by the user while the scl line has been sampled low, the scl output will be asserted (held low). the scl out- put will remain low until the sclrel bit is set, and all other devices on the i 2 c bus have deasserted scl. this ensures that a write to the sclrel bit will not violate the minimum high time requirement for scl. if the stren bit is ? 0 ?, a software write to the sclrel bit will be disregarded and have no effect on the sclrel bit. note 1: if the user loads the contents of i2ctrn, setting the tbf bit before the falling edge of the ninth clock, the sclrel bit will not be cleared and clock stretching will not occur. 2: the sclrel bit can be set in software, regardless of the state of the tbf bit. note 1: if the user reads the contents of the i2crcv, clearing the rbf bit before the falling edge of the ninth clock, the sclrel bit will not be cleared and clock stretching will not occur. 2: the sclrel bit can be set in software, regardless of the state of the rbf bit. the user should be careful to clear the rbf bit in the isr before the next receive sequence in order to prevent an overflow condition.
? 2008 microchip technology inc. ds70141e-page 113 dspic30f3010/3011 17.7 interrupts the i 2 c module generates two interrupt flags, mi2cif (i 2 c master interrupt flag) and si2cif (i 2 c slave interrupt flag). the mi2cif interrupt flag is activated on completion of a master message event. the si2cif interrupt flag is activated on detection of a message directed to the slave. 17.8 slope control the i 2 c standard requires slope control on the sda and scl signals for fast mode (400 khz). the control bit, disslw, enables the user to disable slew rate control, if desired. it is necessary to disable the slew rate control for 1 mhz mode. 17.9 ipmi support the control bit, ipmien, enables the module to support intelligent peripheral management interface (ipmi). when this bit is set, the module accepts and acts upon all addresses. 17.10 general call address support the general call address can address all devices. when this address is used, all devices should, in theory, respond with an acknowledgement. the general call address is one of eight addresses reserved for specific purposes by the i 2 c protocol. it consists of all ? 0 ?s with r_w = 0 . the general call address is recognized when the gen- eral call enable (gcen) bit is set (i2ccon<7> = 1 ). following a start bit detection, 8 bits are shifted into i2crsr and the address is compared with i2cadd, and is also compared with the general call address which is fixed in hardware. if a general call address match occurs, the i2crsr is transferred to the i2crcv after the eighth clock, the rbf flag is set, and on the falling edge of the ninth bit (ack bit), the master event interrupt flag (mi2cif) is set. when the interrupt is serviced, the source for the interrupt can be checked by reading the contents of the i2crcv to determine if the address was device-specific, or a general call address. 17.11 i 2 c master support as a master device, six operations are supported: ? assert a start condition on sda and scl ? assert a restart condition on sda and scl ? write to the i2ctrn register initiating transmission of data/address ? generate a stop condition on sda and scl ? configure the i 2 c port to receive data ? generate an ack condition at the end of a received byte of data 17.12 i 2 c master operation the master device generates all of the serial clock pulses and the start and stop conditions. a transfer is ended with a stop condition or with a repeated start condition. since the repeated start condition is also the beginning of the next serial transfer, the i 2 c bus will not be released. in master transmitter mode, serial data is output through sda, while scl outputs the serial clock. the first byte transmitted contains the slave address of the receiving device (7 bits) and the data direction bit. in this case, the data direction bit (r_w) is logic ? 0 ?. serial data is transmitted 8 bits at a time. after each byte is transmitted, an ack bit is received. start and stop conditions are output to indicate the beginning and the end of a serial transfer. in master receive mode, the first byte transmitted contains the slave address of the transmitting device (7 bits) and the data direction bit. in this case, the data direction bit (r_w) is logic ? 1 ?. thus, the first byte transmitted is a 7-bit slave address, followed by a ? 1 ? to indicate the receive bit. serial data is received via sda, while scl outputs the serial clock. serial data is received 8 bits at a time. after each byte is received, an ack bit is transmitted. start and stop conditions indicate the beginning and end of transmission. 17.12.1 i 2 c master transmission transmission of a data byte, a 7-bit address or the second half of a 10-bit address is accomplished by simply writing a value to i2ctrn register. the user should only write to i2ctrn when the module is in a wait state. this action will set the buffer full flag (tbf) and allow the baud rate generator to begin counting and start the next transmission. each bit of address/ data will be shifted out onto the sda pin after the falling edge of scl is asserted. the transmit status flag, trstat (i2cstat<14>), indicates that a master transmit is in progress.
dspic30f3010/3011 ds70141e-page 114 ? 2008 microchip technology inc. 17.12.2 i 2 c master reception master mode reception is enabled by programming the receive enable (rcen) bit (i2ccon<3>). the i 2 c module must be idle before the rcen bit is set; other- wise, the rcen bit will be disregarded. the baud rate generator begins counting, and on each rollover, the state of the scl pin toggles, and data is shifted into the i2crsr on the rising edge of each clock. 17.12.3 baud rate generator (brg) in i 2 c master mode, the reload value for the brg is located in the i2cbrg register. when the brg is loaded with this value, the brg counts down to ? 0 ? and stops until another reload has taken place. if clock arbitration is taking place, for instance, the brg is reloaded when the scl pin is sampled high. as per the i 2 c standard, f scl may be 100 khz or 400 khz. however, the user can specify any baud rate up to 1 mhz. i2cbrg values of ? 0 ? or ? 1 ? are illegal. equation 17-1: i2cbrg value 17.12.4 clock arbitration clock arbitration occurs when the master deasserts the scl pin (scl allowed to float high) during any receive, transmit or restart/stop condition. when the scl pin is allowed to float high, the baud rate generator is suspended from counting until the scl pin is actually sampled high. when the scl pin is sampled high, the baud rate generator is reloaded with the contents of i2cbrg and begins counting. this ensures that the scl high time will always be at least one brg rollover count in the event that the clock is held low by an external device. 17.12.5 multi-master communication, bus collision and bus arbitration multi-master operation support is achieved by bus arbitration. when the master outputs address/data bits onto the sda pin, arbitration takes place when the master outputs a ? 1 ? on sda, by letting sda float high while another master asserts a ? 0 ?. when the scl pin floats high, data should be stable. if the expected data on sda is a ? 1 ? and the data sampled on the sda pin = 0 , then a bus collision has taken place. the master will set the mi2cif pulse and reset the master portion of the i 2 c port to its idle state. if a transmit was in progress when the bus collision occurred, the transmission is halted, the tbf flag is cleared, the sda and scl lines are deasserted and a value can now be written to i2ctrn. when the user services the i 2 c master event interrupt service routine, if the i 2 c bus is free (i.e., the p bit is set), the user can resume communication by asserting a start condition. if a start, restart, stop or acknowledge condition was in progress when the bus collision occurred, the condi- tion is aborted, the sda and scl lines are deasserted and the respective control bits in the i2ccon register are cleared to ? 0 ?. when the user services the bus collision interrupt service routine, and if the i 2 c bus is free, the user can resume communication by asserting a start condition. the master will continue to monitor the sda and scl pins, and if a stop condition occurs, the mi2cif bit will be set. a write to the i2ctrn will start the transmission of data at the first data bit, regardless of where the transmitter left off when bus collision occurred. in a multi-master environment, the interrupt generation on the detection of start and stop conditions allows the determination of when the bus is free. control of the i 2 c bus can be taken when the p bit is set in the i2cstat register, or the bus is idle and the s and p bits are cleared. 17.13 i 2 c module operation during cpu sleep and idle modes 17.13.1 i 2 c operation during cpu sleep mode when the device enters sleep mode, all clock sources to the module are shut down and stay at logic ? 0 ?. if sleep occurs in the middle of a transmission, and the state machine is partially into a transmission as the clocks stop, then the transmission is aborted. similarly, if sleep occurs in the middle of a reception, then the reception is aborted. 17.13.2 i 2 c operation during cpu idle mode for the i 2 c, the i2csidl bit selects if the module will stop on idle or continue on idle. if i2csidl = 0 , the module will continue operation on assertion of the idle mode. if i2csidl = 1 , the module will stop on idle. i2cbrg = f cy f cy f scl 1,111,111 ? 1 ? ()
? 2008 microchip technology inc. ds70141e-page 115 dspic30f3010/3011 table 17-2: i 2 c? register map (1) sfr name addr. bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 reset state i2crcv 0200 ? ? ? ? ? ? ? ? receive register 0000 0000 0000 0000 i2ctrn 0202 ? ? ? ? ? ? ? ? transmit register 0000 0000 1111 1111 i2cbrg 0204 ? ? ? ? ? ? ? baud rate generator 0000 0000 0000 0000 i2ccon 0206 i2cen ? i2csidl sclrel ipmien a10m disslw smen gcen stren ackdt acken rcen pen rsen sen 0001 0000 0000 0000 i2cstat 0208 ackstat trstat ? ? ? bcl gcstat add10 iwcol i2cov d_a p s r_w rbf tbf 0000 0000 0000 0000 i2cadd 020a ? ? ? ? ? ? address register 0000 0000 0000 0000 legend: ? = unimplemented bit, read as ? 0 ? note 1: refer to ? dspic30f family reference manual? (ds70046) for descriptions of register bit fields.
dspic30f3010/3011 ds70141e-page 116 ? 2008 microchip technology inc. notes:
? 2008 microchip technology inc. ds70141e-page 117 dspic30f3010/3011 18.0 universal asynchronous receiver transmitter (uart) module this section describes the universal asynchronous receiver/transmitter communications module. 18.1 uart module overview the key features of the uart module are: ? full-duplex, 8 or 9-bit data communication ? even, odd or no parity options (for 8-bit data) ? one or two stop bits ? fully integrated baud rate generator with 16-bit prescaler ? baud rates range from 38 bps to 1.875 mbps at a 30 mhz instruction rate ? 4-word deep transmit data buffer ? 4-word deep receive data buffer ? parity, framing and buffer overrun error detection ? support for interrupt only on address detect (9th bit = 1 ) ? separate transmit and receive interrupts ? loopback mode for diagnostic support figure 18-1: uart trans mitter block diagram note: this data sheet summarizes features of this group of dspic30f devices and is not intended to be a complete reference source. for more information on the cpu, peripherals, register descriptions and gen- eral device functionality, refer to the ? dspic30f family reference manual? (ds70046). write write utx8 uxtxreg low byte load tsr transmit control ? control tsr ? control buffer ? generate flags ? generate interrupt control and status bits uxtxif data ? 0 ? (start) ? 1 ? (stop) parity parity generator transmit shift register (uxtsr) 16 divider control signals 16x baud clock from baud rate generator internal data bus utxbrk uxtx note: x = 1 or 2 dspic30f3010 only has uart1.
dspic30f3010/3011 ds70141e-page 118 ? 2008 microchip technology inc. figure 18-2: uart rece iver block diagram read urx8 uxrxreg low byte load rsr uxmode receive buffer control ? generate flags ? generate interrupt uxrxif uxrx start bit detect receive shift register 16 divider control signals uxsta ? shift data characters read read write write to buffer 8-9 (uxrsr) perr ferr parity check stop bit detect shift clock generation wake logic 16 internal data bus 1 0 lpback from uxtx 16x baud clock from baud rate generator
? 2008 microchip technology inc. ds70141e-page 119 dspic30f3010/3011 18.2 enabling and setting up uart 18.2.1 enabling the uart the uart module is enabled by setting the uarten bit in the uxmode register (where x = 1 or 2). once enabled, the uxtx and uxrx pins are configured as an output and an input respectively, overriding the tris and latch register bit settings for the corresponding i/o port pins. the uxtx pin is at logic ? 1 ? when no transmission is taking place. 18.2.2 disabling the uart the uart module is disabled by clearing the uarten bit in the uxmode register. this is the default state after any reset. if the uart is disabled, all i/o pins operate as port pins under the control of the latch and tris bits of the corresponding port pins. disabling the uart module resets the buffers to empty states. any data characters in the buffers are lost and the baud rate counter is reset. all error and status flags associated with the uart module are reset when the module is disabled. the urxda, oerr, ferr, perr, utxen, utxbrk and utxbf bits are cleared, whereas ridle and trmt are set. other control bits, including adden, urxisel<1:0>, utxisel, as well as the uxmode and uxbrg registers, are not affected. clearing the uarten bit while the uart is active will abort all pending transmissions and receptions and reset the module as defined above. re-enabling the uart will restart the uart in the same configuration. 18.2.3 alternate i/o the alternate i/o function is enabled by setting the altio bit (u1mode<10>). if altio = 1 , the uxatx and uxarx pins (alternate transmit and alternate receive pins, respectively) are used by the uart module instead of the uxtx and uxrx pins. if altio = 0 , the uxtx and uxrx pins are used by the uart module. 18.2.4 setting up data, parity and stop bit selections control bits, pdsel<1:0> in the uxmode register, are used to select the data length and parity used in the transmission. the data length may either be 8 bits with even, odd or no parity, or 9 bits with no parity. the stsel bit determines whether one or two stop bits will be used during data transmission. the default (power-on) setting of the uart is 8 bits, no parity, 1 stop bit (typically represented as 8, n, 1). 18.3 transmitting data 18.3.1 transmitting in 8-bit data mode the following steps must be performed in order to transmit 8-bit data: 1. set up the uart: first, the data length, parity and number of stop bits must be selected. then, the transmit and receive interrupt enable and priority bits are set up in the uxmode and uxsta registers. also, the appropriate baud rate value must be written to the uxbrg register. 2. enable the uart by setting the uarten bit (uxmode<15>). 3. set the utxen bit (uxsta<10>), thereby enabling a transmission. 4. write the byte to be transmitted to the lower byte of uxtxreg. the value will be transferred to the transmit shift register (uxtsr) immediately and the serial bit stream will start shifting out during the next rising edge of the baud clock. alternatively, the data byte may be written while utxen = 0 , following which, the user may set utxen. this will cause the serial bit stream to begin immediately because the baud clock will start from a cleared state. 5. a transmit interrupt will be generated depending on the value of the interrupt control bit, utxisel (uxsta<15>). 18.3.2 transmitting in 9-bit data mode the sequence of steps involved in the transmission of 9-bit data is similar to 8-bit transmission, except that a 16-bit data word (of which the upper 7 bits are always clear) must be written to the uxtxreg register. 18.3.3 transmit buffer (u x txb) the transmit buffer is 9 bits wide and 4 characters deep. including the transmit shift register (uxtsr), the user effectively has a 5-deep fifo (first in first out) buffer. the utxbf status bit (uxsta<9>) indicates whether the transmit buffer is full. if a user attempts to write to a full buffer, the new data will not be accepted into the fifo, and no data shift will occur within the buffer. this enables recovery from a buffer overrun condition. the fifo is reset during any device reset, but is not affected when the device enters or wakes up from a power-saving mode.
dspic30f3010/3011 ds70141e-page 120 ? 2008 microchip technology inc. 18.3.4 transmit interrupt the transmit interrupt flag (u1txif or u2txif) is located in the corresponding interrupt flag register. the transmitter generates an edge to set the uxtxif bit. the condition for generating the interrupt depends on the utxisel control bit: a) if utxisel = 0 , an interrupt is generated when a word is transferred from the transmit buffer to the transmit shift register (uxtsr). this implies that the transmit buffer has at least one empty word. b) if utxisel = 1 , an interrupt is generated when a word is transferred from the transmit buffer to the transmit shift register (uxtsr) and the transmit buffer is empty. switching between the two interrupt modes during operation is possible and sometimes offers more flexibility. 18.3.5 transmit break setting the utxbrk bit (uxsta<11>) will cause the uxtx line to be driven to logic ? 0 ?. the utxbrk bit overrides all transmission activity. therefore, the user should generally wait for the transmitter to be idle before setting utxbrk. to send a break character, the utxbrk bit must be set by software and must remain set for a minimum of 13 baud clock cycles. the utxbrk bit is then cleared by software to generate stop bits. the user must wait for a duration of at least one or two baud clock cycles in order to ensure a valid stop bit(s) before reloading the uxtxb or starting other transmitter activity. trans- mission of a break character does not generate a transmit interrupt. 18.4 receiving data 18.4.1 receiving in 8-bit or 9-bit data mode the following steps must be performed while receiving 8-bit or 9-bit data: 1. set up the uart (see section 18.3.1 ?trans- mitting in 8-bit data mode? and sec- tion 18.3.2 ?transmitting in 9-bit data mode? ). 2. enable the uart (see section 18.3.1 ?trans- mitting in 8-bit data mode? and section 18.3.2 ?transmitting in 9-bit data mode? ). 3. a receive interrupt will be generated when one or more data words have been received, depending on the receive interrupt settings specified by the urxisel bits (uxsta<7:6>). 4. read the oerr bit to determine if an overrun error has occurred. the oerr bit must be reset in software. 5. read the received data from uxrxreg. the act of reading uxrxreg will move the next word to the top of the receive fifo, and the perr and ferr values will be updated. 18.4.2 receive buffer (u x rxb) the receive buffer is 4 words deep. including the receive shift register (uxrsr), the user effectively has a 5-word deep fifo buffer. urxda (uxsta<0>) = 1 indicates that the receive buffer has data available. urxda = 0 implies that the buffer is empty. if a user attempts to read an empty buffer, the old values in the buffer will be read and no data shift will occur within the fifo. the fifo is reset during any device reset. it is not affected when the device enters or wakes up from a power-saving mode. 18.4.3 receive interrupt the receive interrupt flag (u1rxif or u2rxif) can be read from the corresponding interrupt flag register. the interrupt flag is set by an edge generated by the receiver. the condition for setting the receive interrupt flag depends on the settings specified by the urxisel<1:0> (uxsta<7:6>) control bits. a) if urxisel<1:0> = 00 or 01 , an interrupt is generated every time a data word is transferred from the receive shift register (uxrsr) to the receive buffer. there may be one or more characters in the receive buffer. b) if urxisel<1:0> = 10 , an interrupt is generated when a word is transferred from the receive shift register (uxrsr) to the receive buffer, which, as a result of the transfer, contains 3 characters. c) if urxisel<1:0> = 11 , an interrupt is set when a word is transferred from the receive shift register (uxrsr) to the receive buffer, which, as a result of the transfer, contains 4 characters (i.e., becomes full). switching between the interrupt modes during opera- tion is possible, though generally not advisable during normal operation. 18.5 reception error handling 18.5.1 receive buffer overrun error (oerr bit) the oerr bit (uxsta<1>) is set if all of the following conditions occur: a) the receive buffer is full. b) the receive shift register is full, but unable to transfer the character to the receive buffer. c) the stop bit of the character in the uxrsr is detected, indicating that the uxrsr needs to transfer the character to the buffer. once oerr is set, no further data is shifted in uxrsr (until the oerr bit is cleared in software or a reset occurs). the data held in uxrsr and uxrxreg remains valid.
? 2008 microchip technology inc. ds70141e-page 121 dspic30f3010/3011 18.5.2 framing error (ferr) the ferr bit (uxsta<2>) is set if a ? 0 ? is detected instead of a stop bit. if two stop bits are selected, both stop bits must be ? 1 ?; otherwise, ferr will be set. the read-only ferr bit is buffered along with the received data; it is cleared on any reset. 18.5.3 parity error (perr) the perr bit (uxsta<3>) is set if the parity of the received word is incorrect. this error bit is applicable only if a parity mode (odd or even) is selected. the read-only perr bit is buffered along with the received data bytes; it is cleared on any reset. 18.5.4 idle status when the receiver is active (i.e., between the initial detection of the start bit and the completion of the stop bit), the ridle bit (uxsta<4>) is ? 0 ?. between the completion of the stop bit and detection of the next start bit, the ridle bit is ? 1 ?, indicating that the uart is idle. 18.5.5 receive break the receiver will count and expect a certain number of bit times based on the values programmed in the pdsel (uxmode<2:1>) and stsel (uxmode<0>) bits. if the break is longer than 13 bit times, the reception is considered complete after the number of bit times specified by pdsel and stsel. the urxda bit is set, ferr is set, zeros are loaded into the receive fifo, interrupts are generated, if appropriate and the ridle bit is set. when the module receives a long break signal and the receiver has detected the start bit, the data bits and the invalid stop bit (which sets the ferr), the receiver must wait for a valid stop bit before looking for the next start bit. it cannot assume that the break condition on the line is the next start bit. break is regarded as a character containing all 0 ?s, with the ferr bit set. the break character is loaded into the buffer. no further reception can occur until a stop bit is received. note that ridle goes high when the stop bit has not been received yet. 18.6 address detect mode setting the adden bit (uxsta<5>) enables the address detect mode, in which a 9th bit (urx8) value of ? 1 ? identifies the received word as an address rather than data. this mode is only applicable for 9-bit data communication. the urxisel control bit does not have any impact on interrupt generation in this mode, since an interrupt (if enabled) will be generated every time the received word has the 9th bit set. 18.7 loopback mode setting the lpback bit enables this special mode in which the uxtx pin is internally connected to the uxrx pin. when configured for the loopback mode, the uxrx pin is disconnected from the internal uart receive logic. however, the uxtx pin still functions as in a normal operation. to select this mode: a) configure uart for desired mode of operation. b) set lpback = 1 to enable loopback mode. c) enable transmission as defined in section 18.3 ?transmitting data? . 18.8 baud rate generator the uart has a 16-bit baud rate generator to allow maximum flexibility in baud rate generation. the baud rate generator register (uxbrg) is readable and writable. the baud rate is computed as follows: brg = 16-bit value held in uxbrg register (0 through 65535) f cy = instruction clock rate (1/t cy ) the baud rate is given by equation 18-1. equation 18-1: baud rate therefore, maximum baud rate possible is f cy /16 (if brg = 0 ), and the minimum baud rate possible is f cy /(16 * 65536). with a full 16-bit baud rate generator, at 30 mips operation, the minimum baud rate achievable is 28.5 bps. baud rate = f cy /(16*(brg+1))
dspic30f3010/3011 ds70141e-page 122 ? 2008 microchip technology inc. 18.9 auto baud support to allow the system to determine baud rates of received characters, the input can be optionally linked to a selected capture input. to enable this mode, the user must program the input capture module to detect the falling and rising edges of the start bit. 18.10 uart operation during cpu sleep and idle modes 18.10.1 uart operation during cpu sleep mode when the device enters sleep mode, all clock sources to the module are shut down and stay at logic ? 0 ?. if entry into sleep mode occurs while a transmission is in progress, then the transmission is aborted. the uxtx pin is driven to logic ? 1 ?. similarly, if entry into sleep mode occurs while a reception is in progress, then the reception is aborted. the uxsta, uxmode, transmit and receive registers and buffers, and the uxbrg register are not affected by sleep mode. if the wake bit (uxmode<7>) is set before the device enters sleep mode, then a falling edge on the uxrx pin will generate a receive interrupt. the receive interrupt select mode bit (urxisel) has no effect for this function. if the receive interrupt is enabled, then this will wake-up the device from sleep. the uarten bit must be set in order to generate a wake-up interrupt. 18.10.2 uart operation during cpu idle mode for the uart, the usidl bit selects if the module will stop operation when the device enters idle mode, or whether the module will continue on idle. if usidl = 0 , the module will continue operation during idle mode. if usidl = 1 , the module will stop on idle.
? 2008 microchip technology inc. ds70141e-page 123 dspic30f3010/3011 table 18-1: uart1 register map (1) table 18-2: uart2 register map (1) (not available on dspic30f3010) sfr name addr. bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 reset state u1mode 020c uarten ?usidl ? ?altio ? ? wake lpback abaud ? ? pdsel1 pdsel0 stsel 0000 0000 0000 0000 u1sta 020e utxisel ? ? ? utxbrk utxen utxbf trmt urxisel1 urxisel0 adden ridle perr ferr oerr urxda 0000 0001 0001 0000 u1txreg 0210 ? ? ? ? ? ? ? utx8 transmit register 0000 000u uuuu uuuu u1rxreg 0212 ? ? ? ? ? ? ? urx8 receive register 0000 0000 0000 0000 u1brg 0214 baud rate generator prescaler 0000 0000 0000 0000 legend: u = uninitialized bit; ? = unimplemented bit, read as ? 0 ? note 1: refer to ? dspic30f family reference manual ? (ds70046) for descriptions of register bit fields. sfr name addr. bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 reset state u2mode 0216 uarten ?usidl ? ? ? ? ? wake lpback abaud ? ? pdsel1 pdsel0 stsel 0000 0000 0000 0000 u2sta 0218 utxisel ? ? ? utxbrk utxen utxbf trmt urxisel1 urxisel0 adden ridle perr ferr oerr urxda 0000 0001 0001 0000 u2txreg 021a ? ? ? ? ? ? ? utx8 transmit register 0000 000u uuuu uuuu u2rxreg 021c ? ? ? ? ? ? ? urx8 receive register 0000 0000 0000 0000 u2brg 021e baud rate generator prescaler 0000 0000 0000 0000 legend: u = uninitialized bit; ? = unimplemented bit, read as ? 0 ? note 1: refer to ? dspic30f family reference manual? (ds70046) for descriptions of register bit fields.
dspic30f3010/3011 ds70141e-page 124 ? 2008 microchip technology inc. notes:
? 2008 microchip technology inc. ds70141e-page 125 dspic30f3010/3011 19.0 10-bit high-speed analog- to-digital converter (adc) module the 10-bit high-speed analog-to-digital converter (adc) allows conversion of an analog input signal to a 10-bit digital number. this module is based on a suc- cessive approximation register (sar) architecture, and provides a maximum sampling rate of 1 msps. the adc module has 16 analog inputs which are multi- plexed into four sample and hold amplifiers. the output of the sample and hold is the input into the converter, which generates the result. the analog reference volt- ages are software selectable to either the device sup- ply voltage (av dd /av ss ) or the voltage level on the (v ref +/v ref -) pin. the adc has a unique feature of being able to operate while the device is in sleep mode. the adc module has six 16-bit registers: ? a/d control register 1 (adcon1) ? a/d control register 2 (adcon2) ? a/d control register 3 (adcon3) ? a/d input select register (adchs) ? a/d port configuration register (adpcfg) ? a/d input scan selection register (adcssl) the adcon1, adcon2 and adcon3 registers control the operation of the adc module. the adchs register selects the input channels to be converted. the adpcfg register configures the port pins as analog inputs or as digital i/o. the adcssl register selects inputs for scanning. the block diagram of the adc module is shown in figure 19-1. note: this data sheet summarizes features of this group of dspic30f devices and is not intended to be a complete reference source. for more information on the cpu, peripherals, register descriptions and gen- eral device functionality, refer to the ? dspic30f family reference manual? (ds70046). note: the ssrc<2:0>, asam, simsam, smpi<3:0>, bufm and alts bits, as well as the adcon3 and adcssl registers, must not be written to while adon = 1 . this would lead to indeterminate results.
dspic30f3010/3011 ds70141e-page 126 ? 2008 microchip technology inc. figure 19-1: 10-bit high-speed adc functional block diagram s/h + - 10-bit result conversion logic v ref + av ss av dd adc data 16-word, 10-bit dual port buffer bus interface an0 an5 an7 an1 an2 an3 an4 an6 an8 an8 (1) an4 an5 an6 (1) an7 (1) an0 an1 an2 an3 ch1 ch2 ch3 ch0 an5 an2 an8 an4 an1 an7 an3 an0 an6 an1 v ref - sample/sequence control sample ch1,ch2, ch3,ch0 input mux control input switches s/h + - s/h + - s/h + - format note 1: not available on dspic30f3010 devices.
? 2008 microchip technology inc. ds70141e-page 127 dspic30f3010/3011 19.1 adc result buffer the module contains a 16-word, dual port, read-only buffer, called adcbuf0...adcbuff, to buffer the adc results. the ram is 10 bits wide, but is read into different format 16-bit words. the contents of the sixteen adc conversion result buffer registers, adcbuf0 through adcbuff, cannot be written by user software. 19.2 conversion operation after the adc module has been configured, the sample acquisition is started by setting the samp bit. various sources, such as a programmable bit, timer time-outs and external events, will terminate acquisition and start a conversion. when the a/d conversion is complete, the result is loaded into adcbuf0...adcbuff, and the a/d interrupt flag, adif, and the done bit are set after the number of samples specified by the smpi bit. the following steps should be followed for doing an a/d conversion: ? configure the adc module: - configure analog pins, voltage reference and digital i/o - select a/d input channels - select a/d conversion clock - select a/d conversion trigger - turn on a/d module ? configure a/d interrupt (if required): - clear adif bit - select a/d interrupt priority ? start sampling ? wait the required acquisition time ? trigger acquisition end; start conversion ? wait for a/d conversion to complete, by either: - waiting for the a/d interrupt - waiting for the done bit to be set ? read a/d result buffer; clear adif if required 19.3 selecting the conversion sequence several groups of control bits select the sequence in which the a/d connects inputs to the sample/hold channels, converts channels, writes the buffer memory and generates interrupts. the sequence is controlled by the sampling clocks. the simsam bit controls the acquire/convert sequence for multiple channels. if the simsam bit is ? 0 ?, the two or four selected channels are acquired and converted sequentially, with two or four sample clocks. if the simsam bit is ? 1 ?, two or four selected channels are acquired simultaneously, with one sample clock. the channels are then converted sequentially. obvi- ously, if there is only 1 channel selected, the simsam bit is not applicable. the chps bits select how many channels are sam- pled. this can vary from 1, 2 or 4 channels. if the chps bits select 1 channel, the ch0 channel will be sampled at the sample clock and converted. the result is stored in the buffer. if the chps bits select 2 channels, the ch0 and ch1 channels will be sampled and converted. if the chps bits select 4 channels, the ch0, ch1, ch2 and ch3 channels will be sampled and converted. the smpi bits select the number of acquisition/ conversion sequences that would be performed before an interrupt occurs. this can vary from 1 sample per interrupt to 16 samples per interrupt. the user cannot program a combination of chps and smpi bits that specifies more than 16 conversions per interrupt, or 8 conversions per interrupt, depending on the bufm bit. the bufm bit, when set, will split the 16-word results buffer (adcbuf0...adcbuff) into two 8-word groups. writing to the 8-word buffers will be alternated on each interrupt event. use of the bufm bit will depend on how much time is available for moving data out of the buffers after the interrupt, as determined by the application. if the processor can quickly unload a full buffer within the time it takes to acquire and convert one channel, the bufm bit can be ? 0 ? and up to 16 conversions may be done per interrupt. the processor will have one sample and conversion time to move the sixteen conversions. if the processor cannot unload the buffer within the acquisition and conversion time, the bufm bit should be ? 1 ?. for example, if sm pi<3:0> (adcon2<5:2>) = 0111 , then eight conversions will be loaded into 1/2 of the buf- fer, following which an interrupt occurs. the next eight conversions will be loaded into the other 1/2 of the buffer. the processor will have the entire time between interrupts to move the eight conversions. the alts bit can be used to alternate the inputs selected during the sampling sequence. the input multiplexer has two sets of sample inputs: mux a and mux b. if the alts bit is ? 0 ?, only the mux a inputs are selected for sampling. if the alts bit is ? 1 ? and smpi<3:0> = 0000 , on the first sample/convert sequence, the mux a inputs are selected, and on the next acquire/convert sequence, the mux b inputs are selected. the cscna bit (adcon2<10>) will allow the ch0 channel inputs to be alternately scanned across a selected number of analog inputs for the mux a group. the inputs are selected by the adcssl register. if a particular bit in the adcssl register is ? 1 ?, the corre- sponding input is selected. the inputs are always scanned from lower to higher numbered inputs, starting after each interrupt. if the number of inputs selected is greater than the number of samples taken per interrupt, the higher numbered inputs are unused.
dspic30f3010/3011 ds70141e-page 128 ? 2008 microchip technology inc. 19.4 programming the start of conversion trigger the conversion trigger will terminate acquisition and start the requested conversions. the ssrc<2:0> bits select the source of the conversion trigger. the ssrc bits provide for up to five alternate sources of conversion trigger. when ssrc<2:0> = 000 , the conversion trigger is under software control. clearing the samp bit will cause the conversion trigger. when ssrc<2:0> = 111 (auto-start mode), the conversion trigger is under a/d clock control. the samc bits select the number of a/d clocks between the start of acquisition and the start of conversion. this provides the fastest conversion rates on multiple channels. the samc bits must always be at least one clock cycle. other trigger sources can come from timer modules, motor control pwm module or external interrupts. 19.5 aborting a conversion clearing the adon bit during a conversion will abort the current conversion and stop the sampling sequenc- ing. the adcbuf will not be updated with the partially completed a/d conversion sample. that is, the adcbuf will continue to contain the value of the last completed conversion (or the last value written to the adcbuf register). if the clearing of the adon bit coincides with an auto-start, the clearing has a higher priority. after the a/d conversion is aborted, a 2 t ad wait is required before the next sampling may be started by setting the samp bit. if sequential sampling is specified, the a/d will continue at the next sample pulse which corresponds with the next channel converted. if simultaneous sampling is specified, the a/d will continue with the next multi-chan- nel group conversion sequence. 19.6 selecting the a/d conversion clock the a/d conversion requires 12 t ad . the source of the a/d conversion clock is software selected using a 6-bit counter. there are 64 possible options for t ad . equation 19-1: a/d conversion clock the internal rc oscillator is selected by setting the adrc bit. for correct a/d conversions, the a/d conversion clock (t ad ) must be selected to ensure a minimum t ad time of 83.33 nsec (for v dd = 5v). refer to section 23.0 "electrical characteristics" for minimum t ad under other operating conditions. example 19-1 shows a sample calculation for the adcs<5:0> bits, assuming a device operating speed of 30 mips. example 19-1: a/d conversion clock calculation note: to operate the a/d at the maximum specified conversion speed, the auto- convert trigger option should be selected (ssrc = 111 ) and the auto-sample time bits should be set to 1 t ad (samc = 00001 ). this configuration will give a total conversion period (sample + convert) of 13 t ad . the use of any other conversion trigger will result in additional t ad cycles to synchronize the external event to the a/d. t ad = t cy ? (0.5 ? (adcs<5:0> + 1)) adcs<5:0> = 2 ? 1 t ad t cy t ad = 154 nsec adcs<5:0> = 2 ? 1 t ad t cy t cy = 33 nsec (30 mips) = 2 ? ? 1 154 nsec 33 nsec = 8.33 therefore, set adcs<5:0> = 9 actual t ad = (adcs<5:0> + 1) t cy 2 = (9 + 1) 33 nsec 2 = 165 nsec
? 2008 microchip technology inc. ds70141e-page 129 dspic30f3010/3011 19.7 adc conversion speeds the dspic30f 10-bit adc specifications permit a maximum 1 msps sampling rate. table 19-1 summarizes the conversion speeds for the dspic30f 10-bit a/d converter and the required operating conditions. table 19-1: 10-bit adc conversion rate parameters dspic30f 10-bit adc conversion rates adc speed t ad minimum sampling time min r s max v dd temperature a/d channels configuration up to 1 msps (1) 83.33 ns 12 t ad 500 4.5v to 5.5v -40c to +85c up to 750 ksps (1) 95.24 ns 2 t ad 500 4.5v to 5.5v -40c to +85c up to 600 ksps (1) 138.89 ns 12 t ad 500 3.0v to 5.5v -40c to +125c up to 500 ksps 153.85 ns 1 t ad 5.0 k 4.5v to 5.5v -40c to +125c up to 300 ksps 256.41 ns 1 t ad 5.0 k 3.0v to 5.5v -40c to +125c note 1: external v ref - and v ref + pins must be used for correct operation. see figure 19-2 for recommended circuit. v ref -v ref + adc anx s/h s/h ch1, ch2 or ch3 ch0 v ref -v ref + adc anx s/h ch x v ref -v ref + adc anx s/h s/h ch1, ch2 or ch3 ch0 v ref -v ref + adc anx s/h ch x anx or v ref - or av ss or av dd v ref -v ref + adc anx s/h ch x anx or v ref - or av ss or av dd
dspic30f3010/3011 ds70141e-page 130 ? 2008 microchip technology inc. the configuration guidelines give the required setup values for the conversion speeds above 500 ksps, since they require external v ref pins usage and there are some differences in the configuration procedure. configuration details that are not critical to the conversion speed have been omitted. figure 19-2 depicts the recommended circuit for the conversion rates above 500 ksps. figure 19-2: adc voltage reference schematic 19.7.1 1 msps configuration guideline the configuration for 1 msps operation is dependent on whether a single input pin is to be sampled or whether multiple pins will be sampled. 19.7.1.1 single analog input for conversions at 1 msps for a single analog input, at least two sample and hold channels must be enabled. the analog input multiplexer must be configured so that the same input pin is connected to both sample and hold channels. the adc converts the value held on one s/h channel, while the second s/h channel acquires a new input sample. 19.7.1.2 multiple analog inputs the adc can also be used to sample multiple analog inputs using multiple sample and hold channels. in this case, the total 1 msps conversion rate is divided among the different input signals. for example, four inputs can be sampled at a rate of 250 ksps for each signal or two inputs could be sampled at a rate of 500 ksps for each signal. sequential sampling must be used in this con- figuration to allow adequate sampling time on each input. 44 43 42 41 40 39 38 37 36 35 14 15 16 17 18 19 20 21 3 30 29 28 27 26 25 24 23 4 5 7 8 9 10 11 1 2 32 31 dspic30f3011 6 22 33 34 12 13 v ss v dd v dd v ref - v ref + av dd av ss v dd v dd v dd v dd v dd r2 10 c2 0.1 f c1 0.01 f r1 10 c8 1 f v dd c7 0.1 f v dd c6 0.01 f v dd c5 1 f v dd c4 0.1 f v dd c3 0.01 f v dd v ss v ss v dd
? 2008 microchip technology inc. ds70141e-page 131 dspic30f3010/3011 19.7.1.3 1 msps configuration items the following configuration items are required to achieve a 1 msps conversion rate. ? comply with conditions provided in table 20-2 ? connect external v ref + and v ref - pins following the recommended circuit shown in figure 19-2 ? set ssrc<2:0> = 111 in the adcon1 register to enable the auto-convert option ? enable automatic sampling by setting the asam control bit in the adcon1 register ? enable sequential sampling by clearing the simsam bit in the adcon1 register ? enable at least two sample and hold channels by writing the chps<1:0> control bits in the adcon2 register ? write the smpi<3:0> control bits in the adcon2 register for the desired number of conversions between interrupts. at a minimum, set smpi<3:0> = 0001 since at least two sample and hold channels should be enabled ? configure the a/d clock period to be: by writing to the adcs<5:0> control bits in the adcon3 register ? configure the sampling time to be 2 t ad by writing: samc<4:0> = 00010 ? select at least two channels per analog input pin by writing to the adchs register 19.7.2 750 ksps configuration guideline the following configuration items are required to achieve a 750 ksps conversion rate. this configuration assumes that a single analog input is to be sampled. ? comply with conditions provided in table 20-2 ? connect external v ref + and v ref - pins following the recommended circuit shown in figure 19-2 ? set ssrc<2:0> = 111 in the adcon1 register to enable the auto-convert option ? enable automatic sampling by setting the asam control bit in the adcon1 register ? enable one sample and hold channel by setting chps<1:0> = 00 in the adcon2 register ? write the smpi<3:0> control bits in the adcon2 register for the desired number of conversions between interrupts ? configure the a/d clock period to be: by writing to the adcs<5:0> control bits in the adcon3 register ? configure the sampling time to be 2 t ad by writing: samc<4:0> = 00010 19.7.3 600 ksps configuration guideline the configuration for 600 ksps operation is dependent on whether a single input pin is to be sampled or whether multiple pins will be sampled. 19.7.3.1 single analog input when performing conversions at 600 ksps for a single analog input, at least two sample and hold channels must be enabled. the analog input multiplexer must be configured so that the same input pin is connected to both sample and hold channels. the a/d converts the value held on one s/h channel, while the second s/h channel acquires a new input sample. 19.7.3.2 multiple analog input the a/d converter can also be used to sample multiple analog inputs using multiple sample and hold channels. in this case, the total 600 ksps conversion rate is divided among the different input signals. for example, four inputs can be sampled at a rate of 150 ksps for each signal or two inputs can be sampled at a rate of 300 ksps for each signal. sequential sampling must be used in this configuration to allow adequate sampling time on each input. 19.7.3.3 600 ksps configuration items the following configuration items are required to achieve a 600 ksps conversion rate. ? comply with conditions provided in table 20-2 ? connect external v ref + and v ref - pins following the recommended circuit shown in figure 19-2 ? set ssrc<2:0> = 111 in the adcon1 register to enable the auto-convert option ? enable automatic sampling by setting the asam control bit in the adcon1 register ? enable sequential sampling by clearing the simsam bit in the adcon1 register ? enable at least two sample and hold channels by writing the chps<1:0> control bits in the adcon2 register ? write the smpi<3:0> control bits in the adcon2 register for the desired number of conversions between interrupts. at a minimum, set smpi<3:0> = 0001 since at least two sample and hold channels should be enabled ? configure the a/d clock period to be: by writing to the adcs<5:0> control bits in the adcon3 register ? configure the sampling time to be 2 t ad by writing: samc<4:0> = 00010 select at least two channels per analog input pin by writing to the adchs register. 1 12 x 1,000,000 = 83.33 ns 1 (12 + 2) x 750,000 = 95.24 ns 1 12 x 600,000 = 138.89 ns
dspic30f3010/3011 ds70141e-page 132 ? 2008 microchip technology inc. 19.8 a/d acquisition requirements the analog input model of the 10-bit adc is shown in figure 19-3. the total sampling time for the adc is a function of the internal amplifier settling time, device v dd and the holding capacitor charge time. for the adc to meet its specified accuracy, the charge holding capacitor (c hold ) must be allowed to fully charge to the voltage level on the analog input pin. the source impedance (r s ), the interconnect impedance (r ic ) and the internal sampling switch (r ss ) impedance combine to directly affect the time required to charge the capacitor, c hold . the combined impedance of the analog sources must therefore be small enough to fully charge the holding capacitor within the chosen sample time. to minimize the effects of pin leakage currents on the accuracy of the a/d converter, the maximum recommended source impedance, r s , is 5 k . after the analog input channel is selected (changed), this sampling function must be completed prior to starting the conversion. the internal holding capacitor will be in a discharged state prior to each sample operation. the user must allow at least 1 t ad period of sampling time, t samp , between conversions to allow each sample to be acquired. this sample time may be controlled manually in software by setting/clearing the samp bit, or it may be automatically controlled by the adc. in an automatic configuration, the user must allow enough time between conversion triggers so that the minimum sample time can be satisfied. refer to the section 23.0 "electrical characteristics" for t ad and sample time requirements. figure 19-3: adc analog input model c pin va rs anx v t = 0.6v v t = 0.6v i leakage r ic 250 sampling switch r ss c hold = dac capacitance v ss v dd = 4.4 pf 500 na legend: c pin v t i leakage r ic r ss c hold = input capacitance = threshold voltage = leakage current at the pin due to = interconnect resistance = sampling switch resistance = sample/hold capacitance (from dac) various junctions note: c pin value depends on device package and is not tested. effect of c pin negligible if rs 5 k . r ss 3 k
? 2008 microchip technology inc. ds70141e-page 133 dspic30f3010/3011 19.9 module power-down modes the module has three internal power modes. when the adon bit is ? 1 ?, the module is in active mode; it is fully powered and functional. when adon is ? 0 ?, the module is in off mode. the digital and analog portions of the circuit are disabled for maximum current savings. in order to return to the active mode from off mode, the user must wait for the adc circuitry to stabilize. 19.10 adc operation during cpu sleep and idle modes 19.10.1 adc operation during cpu sleep mode when the device enters sleep mode, all clock sources to the module are shut down and stay at logic ? 0 ?. if sleep occurs in the middle of a conversion, the conversion is aborted. the converter will not continue with a partially completed conversion on exit from sleep mode. register contents are not affected by the device entering or leaving sleep mode. the adc module can operate during sleep mode if the adc clock source is set to rc (adrc = 1 ). when the rc clock source is selected, the adc module waits one instruction cycle before starting the conversion. this allows the sleep instruction to be executed, which eliminates all digital switching noise from the conversion. when the conversion is complete, the done bit will be set and the result loaded into the adcbuf register. if the adc interrupt is enabled, the device will wake-up from sleep. if the adc interrupt is not enabled, the adc module will then be turned off, although the adon bit will remain set. 19.10.2 a/d operation during cpu idle mode the adsidl bit selects if the module will stop on idle or continue on idle. if adsidl = 0 , the module will continue operation on assertion of idle mode. if adsidl = 1 , the module will stop on idle. 19.11 effects of a reset a device reset forces all registers to their reset state. this forces the adc module to be turned off, and any conversion and acquisition sequence is aborted. the values that are in the adcbuf registers are not modified. the a/dc result register will contain unknown data after a power-on reset. 19.12 output formats the adc result is 10 bits wide. the data buffer ram is also 10 bits wide. the 10-bit data can be read in one of four different formats. the form<1:0> bits select the format. each of the output formats translates to a 16-bit result on the data bus. write data will always be in right justified (integer) format. figure 19-4: adc output data formats ram contents: d09 d08 d07 d06 d05 d04 d03 d02 d01 d00 read to bus: signed fractional (1.15) d09 d08d07d06d05d04d03d02d01d00000000 fractional (1.15)d09d08d07d06d05d04d03d02d01d00000000 signed integer d09 d09 d09 d09 d09 d09 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00 integer 0 0 0 0 0 0 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00
dspic30f3010/3011 ds70141e-page 134 ? 2008 microchip technology inc. 19.13 configuring analog port pins the use of the adpcfg and tris registers control the operation of the adc port pins. the port pins that are desired as analog inputs must have their correspond- ing tris bit set (input). if the tris bit is cleared (output), the digital output level (v oh or v ol ) will be converted. the a/d operation is independent of the state of the ch0sa<3:0>/ch0sb<3:0> bits and the tris bits. when reading the port register, all pins configured as analog input channels will read as cleared. pins configured as digital inputs will not convert an analog input. analog levels on any pin that is defined as a digital input (including the anx pins) may cause the input buffer to consume current that exceeds the device specifications. 19.14 connection considerations the analog inputs have diodes to v dd and v ss as esd protection. this requires that the analog input be between v dd and v ss . if the input voltage exceeds this range by greater than 0.3v (either direction), one of the diodes becomes forward biased and it may damage the device if the input current specification is exceeded. an external rc filter is sometimes added for anti- aliasing of the input signal. the r component should be selected to ensure that the sampling time requirements are satisfied. any external components connected (via high-impedance) to an analog input pin (capacitor, zener diode, etc.) should have very little leakage current at the pin.
? 2008 microchip technology inc. ds70141e-page 135 dspic30f3010/3011 table 19-2: adc register map (1) sfr name addr. bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 reset state adcbuf0 0280 ? ? ? ? ? ? adc data buffer 0 0000 00uu uuuu uuuu adcbuf1 0282 ? ? ? ? ? ? adc data buffer 1 0000 00uu uuuu uuuu adcbuf2 0284 ? ? ? ? ? ? adc data buffer 2 0000 00uu uuuu uuuu adcbuf3 0286 ? ? ? ? ? ? adc data buffer 3 0000 00uu uuuu uuuu adcbuf4 0288 ? ? ? ? ? ? adc data buffer 4 0000 00uu uuuu uuuu adcbuf5 028a ? ? ? ? ? ? adc data buffer 5 0000 00uu uuuu uuuu adcbuf6 028c ? ? ? ? ? ? adc data buffer 6 0000 00uu uuuu uuuu adcbuf7 028e ? ? ? ? ? ? adc data buffer 7 0000 00uu uuuu uuuu adcbuf8 0290 ? ? ? ? ? ? adc data buffer 8 0000 00uu uuuu uuuu adcbuf9 0292 ? ? ? ? ? ? adc data buffer 9 0000 00uu uuuu uuuu adcbufa 0294 ? ? ? ? ? ? adc data buffer 10 0000 00uu uuuu uuuu adcbufb 0296 ? ? ? ? ? ? adc data buffer 11 0000 00uu uuuu uuuu adcbufc 0298 ? ? ? ? ? ? adc data buffer 12 0000 00uu uuuu uuuu adcbufd 029a ? ? ? ? ? ? adc data buffer 13 0000 00uu uuuu uuuu adcbufe 029c ? ? ? ? ? ? adc data buffer 14 0000 00uu uuuu uuuu adcbuff 029e ? ? ? ? ? ? adc data buffer 15 0000 00uu uuuu uuuu adcon1 02a0 adon ?adsidl ? ? ? form<1:0> ssrc<2:0> ? simsam asam samp done 0000 0000 0000 0000 adcon2 02a2 vcfg<2:0> ? ? cscna chps<1:0> bufs ?smpi<3:0>bufmalts 0000 0000 0000 0000 adcon3 02a4 ? ? ? samc<4:0> adrc ? adcs<5:0> 0000 0000 0000 0000 adchs 02a6 ch123nb<1:0> ch123sb ch0nb ch0sb<3:0> ch123na<1:0> ch123sa ch0na ch0sa<3:0> 0000 0000 0000 0000 adpcfg 02a8 ? ? ? ? ? ? ?pcfg8 (2) pcfg7 (2) pcfg6 (2) pcfg5 pcfg4 pcfg3 pcfg2 pcfg1 pcfg0 0000 0000 0000 0000 adcssl 02aa ? ? ? ? ? ? ?cssl8 (2) cssl7 (2) cssl6 (2) cssl5 cssl4 cssl3 cssl2 cssl1 cssl0 0000 0000 0000 0000 legend: u = uninitialized bit; ? = unimplemented bit, read as ? 0 ? note 1: refer to ? dspic30f family reference manual? (ds70046) for descriptions of register bit fields. 2: these bits are not available on dspic30f3010 devices.
dspic30f3010/3011 ds70141e-page 136 ? 2008 microchip technology inc. notes:
? 2008 microchip technology inc. ds70141e-page 137 dspic30f3010/3011 20.0 system integration there are several features intended to maximize system reliability, minimize cost through elimination of external components, provide power-saving operating modes and offer code protection: ? oscillator selection ? reset - power-on reset (por) - power-up timer (pwrt) - oscillator start-up timer (ost) - programmable brown-out reset (bor) ? watchdog timer (wdt) ? power-saving modes (sleep and idle) ? code protection ? unit id locations ? in-circuit serial programming (icsp) dspic30f devices have a watchdog timer, which is permanently enabled via the configuration bits, or can be software controlled. it runs off its own rc oscillator for added reliability. there are two timers that offer nec- essary delays on power-up. one is the oscillator start- up timer (ost), intended to keep the chip in reset until the crystal oscillator is stable. the other is the power- up timer (pwrt), which provides a delay on power-up only, designed to keep the part in reset while the power supply stabilizes. with these two timers on-chip, most applications need no external reset circuitry. sleep mode is designed to offer a very low-current power-down mode. the user can wake-up from sleep through external reset, watchdog timer wake-up or through an interrupt. several oscillator options are also made available to allow the part to fit a wide variety of applications. in the idle mode, the clock sources are still active, but the cpu is shut off. the rc oscillator option saves system cost, while the lp crystal option saves power. 20.1 oscillator system overview the dspic30f oscillator system has the following modules and features: ? various external and internal oscillator options as clock sources ? an on-chip pll to boost internal operating frequency ? a clock switching mechanism between various clock sources ? programmable clock postscaler for system power savings ? a fail-safe clock monitor (fscm) that detects clock failure and takes fail-safe measures ? clock control register, osccon ? configuration bits for main oscillator selection configuration bits determine the clock source upon power-on reset and brown-out reset. thereafter, the clock source can be changed between permissible clock sources. the osccon register controls the clock switching and reflects system clock related status bits. table 20-1 provides a summary of the dspic30f oscillator operating modes. a simplified diagram of the oscillator system is shown in figure 20-1. note: this data sheet summarizes features of this group of dspic30f devices and is not intended to be a complete reference source. for more information on the cpu, peripherals, register descriptions and gen- eral device functionality, refer to the ? dspic30f family reference manual? (ds70046). for more information on the device instruction set and programming, refer to the ? dspic30f/33f programmer?s reference manual? (ds70157).
dspic30f3010/3011 ds70141e-page 138 ? 2008 microchip technology inc. table 20-1: oscillator operating modes oscillator mode description xtl 200 khz-4 mhz crystal on osc1:osc2. xt 4 mhz-10 mhz crystal on osc1:osc2. xt w/pll 4x 4 mhz-10 mhz crystal on osc1:osc2, 4x pll enabled. xt w/pll 8x 4 mhz-10 mhz crystal on osc1:osc2, 8x pll enabled. xt w/pll 16x 4 mhz-10 mhz crystal on osc1:osc2, 16x pll enabled (1) . lp 32 khz crystal on sosco:sosci (2) . hs 10 mhz-25 mhz crystal. hs/2 w/pll 4x 10 mhz-25 mhz crystal, divide by 2, 4x pll enabled. hs/2 w/pll 8x 10 mhz-25mhz crystal, divide by 2, 8x pll enabled. hs/2 w/pll 16x 10 mhz-25mhz crystal, divide by 2, 16x pll enabled (1) . hs/3 w/pll 4x 10 mhz-25 mhz crystal, divide by 3, 4x pll enabled. hs/3 w/pll 8x 10 mhz-25mhz crystal, divide by 3, 8x pll enabled. hs/3 w/pll 16x 10 mhz-25mhz crystal, divide by 3, 16x pll enabled (1) . ec external clock input (0-40 mhz). ecio external clock input (0-40 mhz), osc2 pin is i/o. ec w/pll 4x external clock input (4-10 mhz), osc2 pin is i/o, 4x pll enabled (1) . ec w/pll 8x external clock input (4-10 mhz), osc2 pin is i/o, 8x pll enabled (1) . ec w/pll 16x external clock input (4-10 mhz), osc2 pin is i/o, 16x pll enabled (1) . erc external rc oscillator, osc2 pin is f osc /4 output (3) . ercio external rc oscillator, osc2 pin is i/o (3) . frc 8 mhz internal rc oscillator. frc w/pll 4x 7.37 mhz internal rc oscillator, 4x pll enabled. frc w/pll 8x 7.37 mhz internal rc oscillator, 8x pll enabled. frc w/pll 16x 7.37 mhz internal rc oscillator, 16x pll enabled. lprc 512 khz internal rc oscillator. note 1: dspic30f maximum operating frequency of 120 mhz must be met. 2: lp oscillator can be conveniently shared as system clock, as well as real-time clock for timer1. 3: requires external r and c. frequency operation up to 4 mhz.
? 2008 microchip technology inc. ds70141e-page 139 dspic30f3010/3011 figure 20-1: oscillator system block diagram primary osc1 osc2 sosco sosci oscillator 32 khz lp clock and control block switching oscillator x4, x8, x16 pll primary oscillator stability detector stability detector secondary oscillator programmable clock divider oscillator start-up timer fail-safe clock monitor (fscm) internal fast rc oscillator (frc) internal low power rc oscillator (lprc) pwrsav instruction wake-up request oscillator configuration bits system clock oscillator trap to timer1 lprc secondary osc por done primary osc f pll post<1:0> 2 fcksm<1:0> 2 pll lock cosc<2:0> nosc<2:0> oswen cf tun<3:0> 4
dspic30f3010/3011 ds70141e-page 140 ? 2008 microchip technology inc. 20.2 oscillator configurations 20.2.1 initial clock source selection while coming out of power-on reset or brown-out reset, the device selects its clock source based on: a) fos<2:0> configuration bits that select one of four oscillator groups, b) and fpr<4:0> configuration bits that select one of 15 oscillator choices within the primary group. the selection is as shown in table 20-2. 20.2.2 oscillator start-up timer (ost) in order to ensure that a crystal oscillator (or ceramic resonator) has started and stabilized, an oscillator start-up timer is included. it is a simple 10-bit counter that counts 1024 t osc cycles before releasing the oscillator clock to the rest of the system. the time-out period is designated as t ost . the t ost time is involved every time the oscillator has to restart (i.e., on por, bor and wake-up from sleep). the oscillator start-up timer is applied to the lp, xt, xtl and hs oscillator modes (upon wake-up from sleep, por and bor) for the primary oscillator. table 20-2: configuration bit values for clock selection oscillator mode oscillator source fos<2:0> fpr<4:0> osc2 function ecio w/pll 4x pll 1 1 101101 i/o ecio w/pll 8x pll 1 1 101110 i/o ecio w/pll 16x pll 1 1 101111 i/o frc w/pll 4x pll 1 1 100001 i/o frc w/pll 8x pll 1 1 101010 i/o frc w/pll 16x pll 1 1 100011 i/o xt w/pll 4x pll 1 1 100101 osc2 xt w/pll 8x pll 1 1 100110 osc2 xt w/pll 16x pll 1 1 100111 osc2 hs2 w/pll 4x pll 1 1 110001 osc2 hs2 w/pll 8x pll 1 1 110010 osc2 hs2 w/pll 16x pll 1 1 110011 osc2 hs3 w/pll 4x pll 1 1 110101 osc2 hs3 w/pll 8x pll 1 1 110110 osc2 hs3 w/pll 16x pll 1 1 110111 osc2 ecio external 0 1 101100 i/o xt external 0 1 100100 osc2 hs external 0 1 100010 osc2 ec external 0 1 101011 clko erc external 0 1 101001 clko ercio external 0 1 101000 i/o xtl external 0 1 100000 osc2 lp secondary 0 0 0xxxxx (note 1, 2) frc internal frc 0 0 1xxxxx (note 1, 2) lprc internal lprc 0 1 0xxxxx (note 1, 2) note 1: osc2 pin function is determined by (fpr<4:0>). 2: osc1 pin cannot be used as an i/o pin even if the secondary osc illator or an internal clock source is selected at all times.
? 2008 microchip technology inc. ds70141e-page 141 dspic30f3010/3011 20.2.3 lp oscillator control enabling the lp oscillator is controlled with two elements: 1. the current oscillator group bits, cosc<2:0> 2. the lposcen bit (oscon register) the lp oscillator is on (even during sleep mode) if lposcen = 1 . the lp oscillator is the device clock if: ? cosc<1:0> = 00 (lp selected as main oscillator) and ? lposcen = 1 keeping the lp oscillator on at all times allows for a fast switch to the 32 khz system clock for lower power operation. returning to the faster main oscillator will still require a start-up time. 20.2.4 phase locked loop (pll) the pll multiplies the clock which is generated by the primary oscillator. the pll is selectable to have either gains of x4, x8 and x16. input and output frequency ranges are summarized in table 20-3. table 20-3: pll frequency range the pll features a lock output, which is asserted when the pll enters a phase locked state. should the loop fall out of lock (e.g., due to noise), the lock signal will be rescinded. the state of this signal is reflected in the read-only lock bit in the osccon register. 20.2.5 fast rc oscillator (frc) the frc oscillator is a fast (7.37 mhz +/- 2% nominal) internal rc oscillator. this oscillator is intended to pro- vide reasonable device operating speeds without the use of an external crystal, ceramic resonator or rc net- work. the frc oscillator can be used with the pll to obtain higher clock frequencies. the dspic30f operates from the frc oscillator whenever the current oscillator selection control bits in the osccon register (osccon<13:12>) are set to ? 01 ?. the four-bit field specified by tun<3:0> (osctun<3:0>) allows the user to tune the internal fast rc oscillator (nominal 7.37 mhz). the user can tune the frc oscillator within a range of +10.5% (840 khz) and -12% (960 khz) in steps of 1.50% around the factory calibrated setting (see table 20-4). if osccon<14:12> are set to ? 111 ? and fpr<4:0> are set to ? 00101 ?, ? 00110 ? or ? 00111 ?, then a pll multiplier of 4, 8 or 16 (respectively) is applied . table 20-4: frc tuning 20.2.6 low-power rc oscillator (lprc) the lprc oscillator is a component of the watchdog timer (wdt) and oscillates at a nominal frequency of 512 khz. the lprc oscillator is the clock source for the power-up timer (pwrt) circuit, wdt and clock monitor circuits. it may also be used to provide a low- frequency clock source option for applications where power consumption is critical and timing accuracy is not required. the lprc oscillator is always enabled at a power-on reset, because it is the clock source for the pwrt. after the pwrt expires, the lprc oscillator will remain on if one of the following is true: ? the fail-safe clock monitor is enabled ? the wdt is enabled ? the lprc oscillator is selected as the system clock via the cosc<1:0> control bits in the osccon register if one of the above conditions is not true, the lprc will shut-off after the pwrt expires. fin pll multiplier fout 4 mhz-10 mhz x4 16 mhz-40 mhz 4 mhz-10 mhz x8 32 mhz-80 mhz 4 mhz-7.5 mhz x16 64 mhz-120 mhz note: when a 16x pll is used, the frc fre- quency must not be tuned to a frequency greater than 7.5 mhz. tun<3:0> bits frc frequency 0111 +10.5% 0110 +9.0% 0101 +7.5% 0100 +6.0% 0011 +4.5% 0010 +3.0% 0001 +1.5% 0000 center frequency (oscillator is running at calibrated frequency) 1111 -1.5% 1110 -3.0% 1101 -4.5% 1100 -6.0% 1011 -7.5% 1010 -9.0% 1001 -10.5% 1000 -12.0% note 1: osc2 pin function is determined by the primary oscillator mode selection (fpr<3:0>). 2: osc1 pin cannot be used as an i/o pin, even if the secondary oscillator or an internal clock source is selected at all times.
dspic30f3010/3011 ds70141e-page 142 ? 2008 microchip technology inc. 20.2.7 fail-safe clock monitor the fail-safe clock monitor (fscm) allows the device to continue to operate even in the event of an oscillator failure. the fscm function is enabled by appropriately programming the fcksm configuration bits (clock switch and monitor selection bits) in the fosc con- figuration register. if the fscm function is enabled, the lprc internal oscillator will run at all times (except during sleep mode) and will not be subject to control by the swdten bit. in the event of an oscillator failure, the fscm will generate a clock failure trap event and will switch the system clock over to the frc oscillator. the user will then have the option to either attempt to restart the oscillator or execute a controlled shut down. the user may decide to treat the trap as a warm reset by simply loading the reset address into the oscillator fail trap vector. in this event, the cf (clock fail) status bit (osccon<3>) is also set whenever a clock failure is recognized. in the event of a clock failure, the wdt is unaffected and continues to run on the lprc clock. if the oscillator has a very slow start-up time coming out of por, bor or sleep, it is possible that the pwrt timer will expire before the oscillator has started. in such cases, the fscm will be activated and the fscm will initiate a clock failure trap, and the cosc<1:0> bits are loaded with frc oscillator selec- tion. this will effectively shut-off the original oscillator that was trying to start. the user may detect this situation and restart the oscillator in the clock fail trap isr. upon a clock failure detection, the fscm module will initiate a clock switch to the frc oscillator as follows: 1. the cosc bits (osccon<13:12>) are loaded with the frc oscillator selection value. 2. cf bit is set (osccon<3>). 3. oswen control bit (osccon<0>) is cleared. for the purpose of clock switching, the clock sources are sectioned into four groups: 1. primary 2. secondary 3. internal frc 4. internal lprc the user can switch between these functional groups, but cannot switch between options within a group. if the primary group is selected, then the choice within the group is always determined by the fpr<3:0> configuration bits. the osccon register holds the control and status bits related to clock switching. ? cosc<1:0>: read-only status bits always reflect the current oscillator group in effect. ? nosc<1:0>: control bits which are written to indicate the new oscillator group of choice. - on por and bor, cosc<1:0> and nosc<1:0> are both loaded with the configuration bit values, fos<1:0>. ? lock: the lock status bit indicates a pll lock. ? cf: read-only status bit indicating if a clock fail detect has occurred. ? oswen: control bit changes from a ? 0 ? to a ? 1 ? when a clock transition sequence is initiated. clearing the oswen control bit will abort a clock transition in progress (used for hang-up situations). if configuration bits, fcksm<1:0> = 1x , then the clock switching and fail-safe clock monitor functions are disabled. this is the default configuration bit setting. if clock switching is disabled, then the fos<1:0> and fpr<3:0> bits directly control the oscillator selection and the cosc<1:0> bits do not control the clock selection. however, these bits will reflect the clock source selection. 20.2.8 protection against accidental writes to osccon a write to the osccon register is intentionally made difficult because it controls clock switching and clock scaling. to write to the osccon low byte, the following code sequence must be executed without any other instructions in between: byte write is allowed for one instruction cycle . write the desired value or use bit manipulation instruction. to write to the osccon high byte, the following instructions must be executed without any other instructions in between: : byte write is allowed for one instruction cycle . write the desired value or use bit manipulation instruction. note: the application should not attempt to switch to a clock of frequency lower than 100 khz when the fail-safe clock monitor is enabled. if such clock switching is performed, the device may generate an oscillator fail trap and switch to the fast rc oscillator. byte write ?0x46? to osccon low byte write ?0x57? to osccon low byte write ?0x78? to osccon high byte write ?0x9a? to osccon high
? 2008 microchip technology inc. ds70141e-page 143 dspic30f3010/3011 20.3 reset the dspic30f3010/3011 differentiates between various kinds of reset: a) power-on reset (por) b) mclr reset during normal operation c) mclr reset during sleep d) watchdog timer (wdt) reset (during normal operation) e) programmable brown-out reset (bor) f) reset instruction g) reset cause by trap lockup (trapr) h) reset caused by illegal opcode, or by using an uninitialized w register as an address pointer (iopuwr) different registers are affected in different ways by various reset conditions. most registers are not affected by a wdt wake-up, since this is viewed as the resumption of normal operation. status bits from the rcon register are set or cleared differently in different reset situations, as indicated in table 20-5. these bits are used in software to determine the nature of the reset. a block diagram of the on-chip reset circuit is shown in figure 20-2. a mclr noise filter is provided in the mclr reset path. the filter detects and ignores small pulses. internally generated resets do not drive mclr pin low. figure 20-2: reset sy stem block diagram 20.3.1 por: power-on reset a power-on event will generate an internal por pulse when a v dd rise is detected. the reset pulse will occur at the por circuit threshold voltage (v por ), which is nominally 1.85v. the device supply voltage characteristics must meet specified starting voltage and rise rate requirements. the por pulse will reset a por timer and place the device in the reset state. the por also selects the device clock source identified by the oscillator configuration fuses. the por circuit inserts a small delay, t por , which is nominally 10 s and ensures that the device bias circuits are stable. furthermore, a user-selected power-up time-out (t pwrt ) is applied. the t pwrt parameter is based on device configuration bits and can be 0 ms (no delay), 4 ms, 16 ms or 64 ms. the total delay is at device power-up t por + t pwrt . when these delays have expired, sysrst will be negated on the next leading edge of the q1 clock, and the pc will jump to the reset vector. the timing for the sysrst signal is shown in figure 20-3 through figure 20-5. s r q mclr v dd v dd rise detect por sysrst sleep or idle brown-out reset boren reset instruction wdt module digital glitch filter bor trap conflict illegal opcode/ uninitialized w register
dspic30f3010/3011 ds70141e-page 144 ? 2008 microchip technology inc. figure 20-3: time-out sequ ence on power-up (mclr tied to v dd ) figure 20-4: time-out sequ ence on power-up (mclr not tied to v dd ): case 1 figure 20-5: time-out sequ ence on power-up (mclr not tied to v dd ): case 2 t pwrt t ost v dd internal por pwrt time-out ost time-out internal reset mclr t pwrt t ost v dd internal por pwrt time-out ost time-out internal reset mclr v dd mclr internal por pwrt time-out ost time-out internal reset t pwrt t ost
? 2008 microchip technology inc. ds70141e-page 145 dspic30f3010/3011 20.3.1.1 por with long crystal start-up time (with fscm enabled) the oscillator start-up circuitry is not linked to the por circuitry. some crystal circuits (especially low- frequency crystals) will have a relatively long start-up time. therefore, one or more of the following conditions is possible after the por timer and the pwrt have expired: ? the oscillator circuit has not begun to oscillate. ? the oscillator start-up timer has not expired (if a crystal oscillator is used). ? the pll has not achieved a lock (if pll is used). if the fscm is enabled and one of the above conditions is true, then a clock failure trap will occur. the device will automatically switch to the frc oscillator and the user can switch to the desired crystal oscillator in the trap isr. 20.3.1.2 operating without fscm and pwrt if the fscm is disabled and the power-up timer (pwrt) is also disabled, then the device will exit rapidly from reset on power-up. if the clock source is frc, lprc, extrc or ec, it will be active immediately. if the fscm is disabled and the system clock has not started, the device will be in a frozen state at the reset vector until the system clock starts. from the user?s perspective, the device will appear to be in reset until a system clock is available. 20.3.2 bor: programmable brown-out reset the bor (brown-out reset) module is based on an internal voltage reference circuit. the main purpose of the bor module is to generate a device reset when a brown-out condition occurs. brown-out conditions are generally caused by glitches on the ac mains (i.e., missing portions of the ac cycle waveform due to bad power transmission lines or voltage sags due to excessive current draw when a large inductive load is turned on). the bor module allows selection of one of the following voltage trip points: ? 2.6v-2.71v ?4.1v-4.4v ? 4.58v-4.73v a bor will generate a reset pulse which will reset the device. the bor will select the clock source, based on the device configuration bit values (fos<1:0> and fpr<3:0>). furthermore, if an oscillator mode is selected, the bor will activate the oscillator start-up timer (ost). the system clock is held until ost expires. if the pll is used, then the clock will be held until the lock bit (osccon<5>) is ? 1 ?. concurrently, the por time-out (t por ) and the pwrt time-out (t pwrt ) will be applied before the internal reset is released. if t pwrt = 0 and a crystal oscillator is being used, then a nominal delay of t fscm = 100 s is applied. the total delay in this case is (t por + t fscm ). the bor status bit (rcon<1>) will be set to indicate that a bor has occurred. the bor circuit, if enabled, will continue to operate while in sleep or idle modes and will reset the device should v dd fall below the bor threshold voltage. figure 20-6: external power-on reset circuit (for slow v dd power-up) note: the bor voltage trip points indicated here are nominal values provided for design guidance only. note: dedicated supervisory devices, such as the mcp1xx and mcp8xx, may also be used as an external power-on reset circuit. note 1: external power-on reset circuit is required only if the v dd power-up slope is too slow. the diode d helps discharge the capacitor quickly when v dd powers down. 2: r should be suitably chosen so as to make sure that the voltage drop across r does not violate the device?s electrical specification. 3: r1 should be suitably chosen so as to limit any current flowing into mclr from external capacitor c, in the event of mclr /v pp pin breakdown due to electrostatic discharge (esd) or electrical overstress (eos). c r1 r d v dd dspic30f mclr
dspic30f3010/3011 ds70141e-page 146 ? 2008 microchip technology inc. table 20-5 shows the reset conditions for the rcon register. since the control bits within the rcon register are r/w, the information in the table implies that all the bits are negated prior to the action specified in the condition column. table 20-5: initialization conditi on for rcon register case 1 table 20-6 shows a second example of the bit conditions for the rcon register. in this case, it is not assumed the user has set/cleared specific bits prior to action specified in the condition column. table 20-6: initialization conditi on for rcon register case 2 condition program counter trapr iopuwr extr swr wdto idle sleep por bor power-on reset 0x000000 000000011 brown-out reset 0x000000 000000001 mclr reset during normal operation 0x000000 001000000 software reset during normal operation 0x000000 000100000 mclr reset during sleep 0x000000 001000100 mclr reset during idle 0x000000 001001000 wdt time-out reset 0x000000 000010000 wdt wake-up pc + 2 000010100 interrupt wake-up from sleep pc + 2 (1) 000000100 clock failure trap 0x000004 000000000 trap reset 0x000000 100000000 illegal operation trap 0x000000 010000000 legend: u = unchanged, x = unknown note 1: when the wake-up is due to an enabled interrupt, the pc is loaded with the corresponding interrupt vector. condition program counter trapr iopuwr extr swr wdto idle sleep por bor power-on reset 0x000000 000000011 brown-out reset 0x000000 uuuuuuu01 mclr reset during normal operation 0x000000 uu10000uu software reset during normal operation 0x000000 uu01000uu mclr reset during sleep 0x000000 uu1u001uu mclr reset during idle 0x000000 uu1u010uu wdt time-out reset 0x000000 uu00100uu wdt wake-up pc + 2 uuuu1u1uu interrupt wake-up from sleep pc + 2 (1) uuuuuu1uu clock failure trap 0x000004 uuuuuuuuu trap reset 0x000000 1uuuuuuuu illegal operation reset 0x000000 u1uuuuuuu legend: u = unchanged, x = unknown note 1: when the wake-up is due to an enabled interrupt, the pc is loaded with the corresponding interrupt vector.
? 2008 microchip technology inc. ds70141e-page 147 dspic30f3010/3011 20.4 watchdog timer (wdt) 20.4.1 watchdog timer operation the primary function of the watchdog timer (wdt) is to reset the processor in the event of a software malfunction. the wdt is a free-running timer, which runs off an on-chip rc oscillator, requiring no external component. therefore, the wdt timer will continue to operate even if the main processor clock (e.g., the crystal oscillator) fails. 20.4.2 enabling and disabling the wdt the watchdog timer can be ?enabled? or ?disabled? only through a configuration bit (fwdten) in the configuration register, fwdt. setting fwdten = 1 enables the watchdog timer. the enabling is done when programming the device. by default, after chip erase, fwdten bit = 1 . any device programmer capable of programming dspic30f devices allows programming of this and other configuration bits. if enabled, the wdt will increment until it overflows or ?times out?. a wdt time-out will force a device reset (except during sleep). to prevent a wdt time-out, the user must clear the watchdog timer using a clrwdt instruction. if a wdt times out during sleep, the device will wake- up. the wdto bit in the rcon register will be cleared to indicate a wake-up resulting from a wdt time-out. setting fwdten = 0 allows user software to enable/ disable the watchdog timer via the swdten (rcon<5>) control bit. 20.5 power-saving modes there are two power-saving states that can be entered through the execution of a special instruction, pwrsav . these are: sleep and idle. the format of the pwrsav instruction is as follows: pwrsav , where ? parameter ? defines idle or sleep mode. 20.5.1 sleep mode in sleep mode, the clock to the cpu and peripherals is shut down. if an on-chip oscillator is being used, it is shut down. the fail-safe clock monitor is not functional during sleep, since there is no clock to monitor. however, the lprc clock remains active if wdt is operational during sleep. the brown-out protection circuit and the low-voltage detect (lvd) circuit, if enabled, will remain functional during sleep. the processor wakes up from sleep if at least one of the following conditions has occurred: ? any interrupt that is individually enabled and meets the required priority level ? any reset (por, bor and mclr ) ? wdt time-out on waking up from sleep mode, the processor will restart the same clock that was active prior to entry into sleep mode. when clock switching is enabled, bits, cosc<1:0>, will determine the oscillator source that will be used on wake-up. if clock switch is disabled, then there is only one system clock. if the clock source is an oscillator, the clock to the device will be held off until ost times out (indicating a stable oscillator). if pll is used, the system clock is held off until lock = 1 (indicating that the pll is stable). in either case, t por , t lock and t pwrt delays are applied. if ec, frc, lprc or extrc oscillators are used, then a delay of t por (~ 10 s) is applied. this is the smallest delay possible on wake-up from sleep. moreover, if the lp oscillator was active during sleep, and lp is the oscillator used on wake-up, then the start- up delay will be equal to t por . pwrt delay and ost timer delay are not applied. in order to have the small- est possible start-up delay when waking up from sleep, one of these faster wake-up options should be selected before entering sleep. note: if a por or bor occurred, the selection of the oscillator is based on the fos<1:0> and fpr<3:0> configuration bits.
dspic30f3010/3011 ds70141e-page 148 ? 2008 microchip technology inc. any interrupt that is individually enabled (using the corresponding ie bit) and meets the prevailing priority level will be able to wake-up the processor. the proces- sor will process the interrupt and branch to the isr. the sleep status bit in rcon register is set upon wake-up. all resets will wake-up the processor from sleep mode. any reset, other than por, will set the sleep status bit. in a por, the sleep bit is cleared. if the watchdog timer is enabled, then the processor will wake-up from sleep mode upon wdt time-out. the sleep and wdto status bits are both set. 20.5.2 idle mode in idle mode, the clock to the cpu is shut down while peripherals keep running. unlike sleep mode, the clock source remains active. several peripherals have a control bit in each module that allows them to operate during idle. the lprc fail-safe clock remains active if clock failure detect is enabled. the processor wakes up from idle if at least one of the following conditions is true: ? on any interrupt that is individually enabled (ie bit is ? 1 ?) and meets the required priority level ? on any reset (por, bor, mclr ) ? on wdt time-out upon wake-up from idle mode, the clock is re-applied to the cpu and instruction execution begins immediately, starting with the instruction following the pwrsav instruction. any interrupt that is individually enabled (using the ie bit) and meets the prevailing priority level will be able to wake-up the processor. the processor will process the interrupt and branch to the isr. the idle status bit in the rcon register is set upon wake-up. any reset, other than por, will set the idle status bit. on a por, the idle bit is cleared. if the watchdog timer is enabled, then the processor will wake-up from idle mode upon wdt time-out. the idle and wdto status bits are both set. unlike wake-up from sleep, there are no time delays involved in wake-up from idle. 20.6 device configuration registers the configuration bits in each device configuration register specify some of the device modes and are pro- grammed by a device programmer, or by using the in-circuit serial programming (icsp) feature of the device. each device configuration register is a 24-bit register, but only the lower 16 bits of each register are used to hold configuration data. there are four device configuration registers available to the user: 1. fosc (0xf80000): oscillator configuration register 2. fwdt (0xf80002): watchdog timer configuration register 3. fborpor (0xf80004): bor and por configuration register 4. fgs (0xf8000a): general code segment configuration register 5. ficd (0xf8000c): fuse configuration register the placement of the configuration bits is automatically handled when you select the device in your device programmer. the desired state of the configuration bits may be specified in the source code (dependent on the language tool used), or through the programming interface. after the device has been programmed, the application software may read the configuration bit values through the table read instructions. for additional information, please refer to the programming specifications of the device. note: in spite of various delays applied (t por , t lock and t pwrt ), the crystal oscillator (and pll) may not be active at the end of the time-out (e.g., for low-frequency crys- tals). in such cases, if fscm is enabled, then the device will detect this as a clock failure and process the clock failure trap, the frc oscillator will be enabled, and the user will have to re-enable the crystal oscillator. if fscm is not enabled, then the device will simply suspend execution of code until the clock is stable, and will remain in sleep until the oscillator clock has started. note: if the code protection configuration bits (fgs and fgs) have been programmed, an erase of the entire code-protected device is only possible at voltages v dd 4.5v.
? 2008 microchip technology inc. ds70141e-page 149 dspic30f3010/3011 20.7 in-circuit debugger when mplab ? icd 2 is selected as a debugger, the in-circuit debugging functionality is enabled. this func- tion allows simple debugging functions when used with mplab ide. when the device has this feature enabled, some of the resources are not available for general use. these resources include the first 80 bytes of data ram and two i/o pins. one of four pairs of debug i/o pins may be selected by the user using configuration options in mplab ide. these pin pairs are named emud/emuc, emud1/ emuc1, emud2/emuc2 and emud3/emuc3. in each case, the selected emud pin is the emulation/ debug data line, and the emuc pin is the emulation/ debug clock line. these pins will interface to the mplab icd 2 module available from microchip. the selected pair of debug i/o pins is used by mplab icd 2 to send commands and receive responses, as well as to send and receive data. to use the in-circuit debugger function of the device, the design must imple- ment icsp connections to mclr , v dd , v ss , pgc, pgd and the selected emudx/emucx pin pair. this gives rise to two possibilities: 1. if emud/emuc is selected as the debug i/o pin pair, then only a 5-pin interface is required, as the emud and emuc pin functions are multi- plexed with the pgd and pgc pin functions in all dspic30f devices. 2. if emud1/emuc1, emud2 /emuc2 or emud3/ emuc3 is selected as the debug i/o pin pair, then a 7-pin interface is required, as the emudx/emucx pin functions (x = 1, 2 or 3) are not multiplexed with the pgd and pgc pin functions.
dspic30f3010/3011 ds70141e-page 150 ? 2008 microchip technology inc. table 20-7: system integration register map (1) table 20-8: device conf iguration register map (1) sfr name addr. bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 reset state rcon 0740 trapr iopuwr bgst ? ? ? ? ? extr swr swdten wdto sleep idle bor por depends on type of reset. osccon 0742 ? ?cosc<1:0> ? ? nosc<1:0> post<1:0> lock ?cf ? lposcen oswen depends on configuration bits. osctun 0744 ? ? ? ? ? ? ? ? ? ? ? ? tun<3:0> legend: ? = unimplemented bit, read as ? 0 ? note 1: refer to ? dspic30f family reference manual ?(ds70046) for descriptions of register bit fields. file name addr. bits 23-16 bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 fosc f80000 ? fcksm<1:0> ? ? ? fos<2:0> ? ? ? ?fpr<3:0> fwdt f80002 ?fwdten ? ? ? ? ? ? ? ? ? fwpsa<1:0> fwpsb<3:0> fborpor f80004 ? mclren ? ? ? ? pwmpin hpol lpol boren ? borv<1:0> ? ?fpwrt<1:0> fgs f8000a ? ? ? ? ? ? ? ? ? ? ? ? ? ? reserved (2) gcp gwrp ficd f8000c ? ? ? ? ? ? ? ? ? bkbug coe ? ? ? ?ics<1:0> legend: ? = unimplemented bit, read as ? 0 ? note 1: refer to ? dspic30f family reference manual? (ds70046) for descriptions of register bit fields. 2: the fgs<2> bit is a read-only copy of the gcp bit (fgs<1>).
? 2008 microchip technology inc. ds70141e-page 151 dspic30f3010/3011 21.0 instruction set summary the dspic30f instruction set adds many enhancements to the previous pic ? microcontroller (mcu) instruction sets, while maintaining an easy migration from pic mcu instruction sets. most instructions are a single program memory word (24 bits). only three instructions require two program memory locations. each single-word instruction is a 24-bit word divided into an 8-bit opcode which specifies the instruction type, and one or more operands which further specify the operation of the instruction. the instruction set is highly orthogonal and is grouped into five basic categories: ? word or byte-oriented operations ? bit-oriented operations ? literal operations ? dsp operations ? control operations table 21-1 shows the general symbols used in describing the instructions. the dspic30f instruction set summary in table 21-2 lists all the instructions along with the status flags affected by each instruction. most word or byte-oriented w register instructions (including barrel shift instructions) have three operands: ? the first source operand, which is typically a register ?wb? without any address modifier ? the second source operand, which is typically a register ?ws? with or without an address modifier ? the destination of the result, which is typically a register ?wd? with or without an address modifier however, word or byte-oriented file register instructions have two operands: ? the file register specified by the value ?f? ? the destination, which could either be the file register ?f? or the w0 register, which is denoted as ?wreg? most bit-oriented instructions (including simple rotate/ shift instructions) have two operands: ? the w register (with or without an address modi- fier) or file register (specified by the value of ?ws? or ?f?) ? the bit in the w register or file register (specified by a literal value, or indirectly by the contents of register ?wb?) the literal instructions that involve data movement may use some of the following operands: ? a literal value to be loaded into a w register or file register (specified by the value of ?k?) ? the w register or file register where the literal value is to be loaded (specified by ?wb? or ?f?) however, literal instructions that involve arithmetic or logical operations use some of the following operands: ? the first source operand, which is a register ?wb? without any address modifier ? the second source operand, which is a literal value ? the destination of the result (only if not the same as the first source operand), which is typically a register ?wd? with or without an address modifier the mac class of dsp instructions may use some of the following operands: ? the accumulator (a or b) to be used (required operand) ? the w registers to be used as the two operands ? the x and y address space prefetch operations ? the x and y address space prefetch destinations ? the accumulator write-back destination the other dsp instructions do not involve any multiplication, and may include: ? the accumulator to be used (required) ? the source or destination operand (designated as wso or wdo, respectively) with or without an address modifier ? the amount of shift, specified by a w register ?wn? or a literal value the control instructions may use some of the following operands: ? a program memory address ? the mode of the table read and table write instructions all instructions are a single word, except for certain double-word instructions, which were made double- word instructions so that all the required information is available in these 48 bits. in the second word, the 8msbs are ? 0 ?s. if this second word is executed as an instruction (by itself), it will execute as a nop . note: this data sheet summarizes features of this group of dspic30f devices and is not intended to be a complete reference source. for more information on the cpu, peripherals, register descriptions and gen- eral device functionality, refer to the ? dspic30f family reference manual? (ds70046). for more information on the device instruction set and programming, refer to the ? dspic30f/33f programmer?s reference manual? (ds70157).
dspic30f3010/3011 ds70141e-page 152 ? 2008 microchip technology inc. most single-word instructions are executed in a single instruction cycle, unless a conditional test is true or the program counter is changed as a result of the instruc- tion. in these cases, the execution takes two instruction cycles with the additional instruction cycle(s) executed as a nop . notable exceptions are the bra (uncondi- tional/computed branch), indirect call/goto , all table reads and writes and return/retfie instructions, which are single-word instructions, but take two or three cycles. certain instructions that involve skipping over the subsequent instruction, require either two or three cycles if the skip is performed, depending on whether the instruction being skipped is a single-word or two-word instruction. moreover, double-word moves require two cycles. the double-word instructions execute in two instruction cycles. note: for more details on the instruction set, refer to the ?dspic30f/33f programmer?s reference manual? (ds70157) . table 21-1: symbols used in opcode descriptions field description #text means literal defined by ? text ? (text) means ?content of text ? [text] means ?the location addressed by text ? { } optional field or operation register bit field .b byte mode selection .d double-word mode selection .s shadow register select .w word mode selection (default) acc one of two accumulators {a, b} awb accumulator write-back destination address register {w13, [w13] + = 2} bit4 4-bit bit selection field (used in word addressed instructions) {0...15} c, dc, n, ov, z mcu status bits: carry, digit carry, negative, overflow, zero expr absolute address, label or expression (resolved by the linker) f file register address {0x0000...0x1fff} lit1 1-bit unsigned literal {0,1} lit4 4-bit unsigned literal {0...15} lit5 5-bit unsigned literal {0...31} lit8 8-bit unsigned literal {0...255} lit10 10-bit unsigned literal {0...255} for byte mode, {0:1023} for word mode lit14 14-bit unsigned literal {0...16384} lit16 16-bit unsigned literal {0...65535} lit23 23-bit unsigned literal {0...8388608}; lsb must be ? 0 ? none field does not require an entry, may be blank oa, ob, sa, sb dsp status bits: acca overflow, accb overflow, acca saturate, accb saturate pc program counter slit10 10-bit signed literal {-512...511} slit16 16-bit signed literal {-32768...32767} slit6 6-bit signed literal {-16...16}
? 2008 microchip technology inc. ds70141e-page 153 dspic30f3010/3011 wb base w register {w0..w15} wd destination w register { wd, [wd], [wd++], [wd--], [++wd], [--wd] } wdo destination w register { wnd, [wnd], [wnd++], [wnd--], [++wnd], [--wnd], [wnd+wb] } wm,wn dividend, divisor working register pair (direct addressing) wm*wm multiplicand and multiplier working register pair for square instructions {w4*w4,w5*w5,w6*w6,w7*w7} wm*wn multiplicand and multiplier working register pair for dsp instructions {w4*w5,w4*w6,w4*w7,w5*w6,w5*w7,w6*w7} wn one of 16 working registers {w0..w15} wnd one of 16 destination working registers {w0..w15} wns one of 16 source working registers {w0..w15} wreg w0 (working register used in file register instructions) ws source w register { ws, [ws], [ws++], [ws--], [++ws], [--ws] } wso source w register { wns, [wns], [wns++], [wns--], [++wns], [--wns], [wns+wb] } wx x data space prefetch address register for dsp instructions {[w8]+=6, [w8]+=4, [w8]+=2, [w8], [w8]-=6, [w8]-=4, [w8]-=2, [w9]+=6, [w9]+=4, [w9]+=2, [w9], [w9]-=6, [w9]-=4, [w9]-=2, [w9+w12],none} wxd x data space prefetch destination register for dsp instructions {w4..w7} wy y data space prefetch address register for dsp instructions {[w10]+=6, [w10]+=4, [w10]+=2, [w10], [w10]-=6, [w10]-=4, [w10]-=2, [w11]+=6, [w11]+=4, [w11]+=2, [w11], [w11]-=6, [w11]-=4, [w11]-=2, [w11+w12], none} wyd y data space prefetch destination register for dsp instructions {w4..w7} table 21-1: symbols used in opcode descriptions (continued) field description
dspic30f3010/3011 ds70141e-page 154 ? 2008 microchip technology inc. table 21-2: instruction set overview base instr # assembly mnemonic assembly syntax description # of words # of cycle s status flags affected 1 add add acc add accumulators 1 1 oa,ob,sa,sb add f f = f + wreg 1 1 c,dc,n,ov,z add f,wreg wreg = f + wreg 1 1 c,dc,n,ov,z add #lit10,wn wd = lit10 + wd 1 1 c,dc,n,ov,z add wb,ws,wd wd = wb + ws 1 1 c,dc,n,ov,z add wb,#lit5,wd wd = wb + lit5 1 1 c,dc,n,ov,z add wso,#slit4,acc 16-bit signed add to accumulator 1 1 oa,ob,sa,sb 2 addc addc f f = f + wreg + (c) 1 1 c,dc,n,ov,z addc f,wreg wreg = f + wreg + (c) 1 1 c,dc,n,ov,z addc #lit10,wn wd = lit10 + wd + (c) 1 1 c,dc,n,ov,z addc wb,ws,wd wd = wb + ws + (c) 1 1 c,dc,n,ov,z addc wb,#lit5,wd wd = wb + lit5 + (c) 1 1 c,dc,n,ov,z 3 and and f f = f .and. wreg 1 1 n,z and f,wreg wreg = f .and. wreg 1 1 n,z and #lit10,wn wd = lit10 .and. wd 1 1 n,z and wb,ws,wd wd = wb .and. ws 1 1 n,z and wb,#lit5,wd wd = wb .and. lit5 1 1 n,z 4 asr asr f f = arithmetic right shift f 1 1 c,n,ov,z asr f,wreg wreg = arithmetic right shift f 1 1 c,n,ov,z asr ws,wd wd = arithmetic right shift ws 1 1 c,n,ov,z asr wb,wns,wnd wnd = arithmetic right shift wb by wns 1 1 n,z asr wb,#lit5,wnd wnd = arithmetic right shift wb by lit5 1 1 n,z 5 bclr bclr f,#bit4 bit clear f 1 1 none bclr ws,#bit4 bit clear ws 1 1 none 6 bra bra c,expr branch if carry 1 1 (2) none bra ge,expr branch if greater than or equal 1 1 (2) none bra geu,expr branch if unsigned greater than or equal 1 1 (2) none bra gt,expr branch if greater than 1 1 (2) none bra gtu,expr branch if unsigned greater than 1 1 (2) none bra le,expr branch if less than or equal 1 1 (2) none bra leu,expr branch if unsigned less than or equal 1 1 (2) none bra lt,expr branch if less than 1 1 (2) none bra ltu,expr branch if unsigned less than 1 1 (2) none bra n,expr branch if negative 1 1 (2) none bra nc,expr branch if not carry 1 1 (2) none bra nn,expr branch if not negative 1 1 (2) none bra nov,expr branch if not overflow 1 1 (2) none bra nz,expr branch if not zero 1 1 (2) none bra oa,expr branch if accumulator a overflow 1 1 (2) none bra ob,expr branch if accumulator b overflow 1 1 (2) none bra ov,expr branch if overflow 1 1 (2) none bra sa,expr branch if accumulator a saturated 1 1 (2) none bra sb,expr branch if accumulator b saturated 1 1 (2) none bra expr branch unconditionally 1 2 none bra z,expr branch if zero 1 1 (2) none bra wn computed branch 1 2 none 7 bset bset f,#bit4 bit set f 1 1 none bset ws,#bit4 bit set ws 1 1 none 8 bsw bsw.c ws,wb write c bit to ws 1 1 none bsw.z ws,wb write z bit to ws 1 1 none 9 btg btg f,#bit4 bit toggle f 1 1 none btg ws,#bit4 bit toggle ws 1 1 none
? 2008 microchip technology inc. ds70141e-page 155 dspic30f3010/3011 10 btsc btsc f,#bit4 bit test f, skip if clear 1 1 (2 or 3) none btsc ws,#bit4 bit test ws, skip if clear 1 1 (2 or 3) none 11 btss btss f,#bit4 bit test f, skip if set 1 1 (2 or 3) none btss ws,#bit4 bit test ws, skip if set 1 1 (2 or 3) none 12 btst btst f,#bit4 bit test f 1 1 z btst.c ws,#bit4 bit test ws to c 1 1 c btst.z ws,#bit4 bit test ws to z 1 1 z btst.c ws,wb bit test ws to c 1 1 c btst.z ws,wb bit test ws to z 1 1 z 13 btsts btsts f,#bit4 bit test then set f 1 1 z btsts.c ws,#bit4 bit test ws to c, then set 1 1 c btsts.z ws,#bit4 bit test ws to z, then set 1 1 z 14 call call lit23 call subroutine 2 2 none call wn call indirect subroutine 1 2 none 15 clr clr f f = 0x0000 1 1 none clr wreg wreg = 0x0000 1 1 none clr ws ws = 0x0000 1 1 none clr acc,wx,wxd,wy,wyd,awb clear accumulator 1 1 oa,ob,sa,sb 16 clrwdt clrwdt clear watchdog timer 1 1 wdto,sleep 17 com com f f = f 11n,z com f,wreg wreg = f 11n,z com ws,wd wd = ws 11n,z 18 cp cp f compare f with wreg 1 1 c,dc,n,ov,z cp wb,#lit5 compare wb with lit5 1 1 c,dc,n,ov,z cp wb,ws compare wb with ws (wb ? ws) 1 1 c,dc,n,ov,z 19 cp0 cp0 f compare f with 0x0000 1 1 c,dc,n,ov,z cp0 ws compare ws with 0x0000 1 1 c,dc,n,ov,z 20 cpb cpb f compare f with wreg, with borrow 1 1 c,dc,n,ov,z cpb wb,#lit5 compare wb with lit5, with borrow 1 1 c,dc,n,ov,z cpb wb,ws compare wb with ws, with borrow (wb ? ws ? c ) 1 1 c,dc,n,ov,z 21 cpseq cpseq wb, wn compare wb with wn, skip if = 1 1 (2 or 3) none 22 cpsgt cpsgt wb, wn compare wb with wn, skip if > 1 1 (2 or 3) none 23 cpslt cpslt wb, wn compare wb with wn, skip if < 1 1 (2 or 3) none 24 cpsne cpsne wb, wn compare wb with wn, skip if 11 (2 or 3) none 25 daw daw wn wn = decimal adjust wn 1 1 c 26 dec dec f f = f ? 1 1 1 c,dc,n,ov,z dec f,wreg wreg = f ?1 1 1 c,dc,n,ov,z dec ws,wd wd = ws ? 1 1 1 c,dc,n,ov,z 27 dec2 dec2 f f = f ? 2 1 1 c,dc,n,ov,z dec2 f,wreg wreg = f ? 2 1 1 c,dc,n,ov,z dec2 ws,wd wd = ws ? 2 1 1 c,dc,n,ov,z 28 disi disi #lit14 disable interrupts for k instruction cycles 1 1 none table 21-2: instruction set overview (continued) base instr # assembly mnemonic assembly syntax description # of words # of cycle s status flags affected
dspic30f3010/3011 ds70141e-page 156 ? 2008 microchip technology inc. 29 div div.s wm,wn signed 16/16-bit integer divide 1 18 n,z,c, ov div.sd wm,wn signed 32/16-bit integer divide 1 18 n,z,c, ov div.u wm,wn unsigned 16/16-bit integer divide 1 18 n,z,c, ov div.ud wm,wn unsigned 32/16-bit integer divide 1 18 n,z,c, ov 30 divf divf wm,wn signed 16/16-bit fractional divide 1 18 n,z,c, ov 31 do do #lit14,expr do code to pc+expr, lit14 + 1 times 2 2 none do wn,expr do code to pc+expr, (wn) + 1 times 2 2 none 32 ed ed wm*wm,acc,wx,wy,wxd euclidean distance (no accumulate) 1 1 oa,ob,oab, sa,sb,sab 33 edac edac wm*wm,acc,wx,wy,wxd euclidean distance 1 1 oa,ob,oab, sa,sb,sab 34 exch exch wns,wnd swap wns with wnd 1 1 none 35 fbcl fbcl ws,wnd find bit change from left (msb) side 1 1 c 36 ff1l ff1l ws,wnd find first one from left (msb) side 1 1 c 37 ff1r ff1r ws,wnd find first one from right (lsb) side 1 1 c 38 goto goto expr go to address 2 2 none goto wn go to indirect 1 2 none 39 inc inc f f = f + 1 1 1 c,dc,n,ov,z inc f,wreg wreg = f + 1 1 1 c,dc,n,ov,z inc ws,wd wd = ws + 1 1 1 c,dc,n,ov,z 40 inc2 inc2 f f = f + 2 1 1 c,dc,n,ov,z inc2 f,wreg wreg = f + 2 1 1 c,dc,n,ov,z inc2 ws,wd wd = ws + 2 1 1 c,dc,n,ov,z 41 ior ior f f = f .ior. wreg 1 1 n,z ior f,wreg wreg = f .ior. wreg 1 1 n,z ior #lit10,wn wd = lit10 .ior. wd 1 1 n,z ior wb,ws,wd wd = wb .ior. ws 1 1 n,z ior wb,#lit5,wd wd = wb .ior. lit5 1 1 n,z 42 lac lac wso,#slit4,acc load accumulator 1 1 oa,ob,oab, sa,sb,sab 43 lnk lnk #lit14 link frame pointer 1 1 none 44 lsr lsr f f = logical right shift f 1 1 c,n,ov,z lsr f,wreg wreg = logical right shift f 1 1 c,n,ov,z lsr ws,wd wd = logical right shift ws 1 1 c,n,ov,z lsr wb,wns,wnd wnd = logical right shift wb by wns 1 1 n,z lsr wb,#lit5,wnd wnd = logical right shift wb by lit5 1 1 n,z 45 mac mac wm*wn,acc,wx,wxd,wy,wyd, awb multiply and accumulate 1 1 oa,ob,oab, sa,sb,sab mac wm*wm,acc,wx,wxd,wy,wyd square and accumulate 1 1 oa,ob,oab, sa,sb,sab 46 mov mov f,wn move f to wn 1 1 none mov f move f to f 1 1 n,z mov f,wreg move f to wreg 1 1 n,z mov #lit16,wn move 16-bit literal to wn 1 1 none mov.b #lit8,wn move 8-bit literal to wn 1 1 none mov wn,f move wn to f 1 1 none mov wso,wdo move ws to wd 1 1 none mov wreg,f move wreg to f 1 1 n,z mov.d wns,wd move double from w(ns):w(ns + 1) to wd 1 2 none mov.d ws,wnd move double from ws to w(nd + 1):w(nd) 1 2 none 47 movsac movsac acc,wx,wxd,wy,wyd,awb prefetch and store accumulator 1 1 none 48 mpy mpy wm*wn,acc,wx,wxd,wy,wyd multiply wm by wn to accumulator 1 1 oa,ob,oab, sa,sb,sab mpy wm*wm,acc,wx,wxd,wy,wyd square wm to accumulator 1 1 oa,ob,oab, sa,sb,sab 49 mpy.n mpy.n wm*wn,acc,wx,wxd,wy,wyd -(multiply wm by wn) to accumulator 1 1 none 50 msc msc wm*wm,acc,wx,wxd,wy,wyd, awb multiply and subtract from accumulator 1 1 oa,ob,oab, sa,sb,sab table 21-2: instruction set overview (continued) base instr # assembly mnemonic assembly syntax description # of words # of cycle s status flags affected
? 2008 microchip technology inc. ds70141e-page 157 dspic30f3010/3011 51 mul mul.ss wb,ws,wnd {wnd+1, wnd} = signed(wb) * signed(ws) 1 1 none mul.su wb,ws,wnd {wnd+1, wnd} = signed(wb) * unsigned(ws) 1 1 none mul.us wb,ws,wnd {wnd+1, wnd} = unsigned(wb) * signed(ws) 1 1 none mul.uu wb,ws,wnd {wnd+1, wnd} = unsigned(wb) * unsigned(ws) 11none mul.su wb,#lit5,wnd {wnd+1, wnd} = signed(wb) * unsigned(lit5) 1 1 none mul.uu wb,#lit5,wnd {wnd+1, wnd} = unsigned(wb) * unsigned(lit5) 11none mul f w3:w2 = f * wreg 1 1 none 52 neg neg acc negate accumulator 1 1 oa,ob,oab, sa,sb,sab neg f f = f + 1 1 1 c,dc,n,ov,z neg f,wreg wreg = f + 1 1 1 c,dc,n,ov,z neg ws,wd wd = ws + 1 1 1 c,dc,n,ov,z 53 nop nop no operation 1 1 none nopr no operation 1 1 none 54 pop pop f pop f from top-of-stack (tos) 1 1 none pop wdo pop from top-of-stack (tos) to wdo 1 1 none pop.d wnd pop from top-of-stack (tos) to w(nd):w(nd + 1) 12none pop.s pop shadow registers 1 1 all 55 push push f push f to top-of-stack (tos) 1 1 none push wso push wso to top-of-stack (tos) 1 1 none push.d wns push w(ns):w(ns + 1) to top-of-stack (tos) 1 2 none push.s push shadow registers 1 1 none 56 pwrsav pwrsav #lit1 go into sleep or idle mode 1 1 wdto,sleep 57 rcall rcall expr relative call 1 2 none rcall wn computed call 1 2 none 58 repeat repeat #lit14 repeat next instruction lit14 + 1 times 1 1 none repeat wn repeat next instruction (wn) + 1 times 1 1 none 59 reset reset software device reset 1 1 none 60 retfie retfie return from interrupt 1 3 (2) none 61 retlw retlw #lit10,wn return with literal in wn 1 3 (2) none 62 return return return from subroutine 1 3 (2) none 63 rlc rlc f f = rotate left through carry f 1 1 c,n,z rlc f,wreg wreg = rotate left through carry f 1 1 c,n,z rlc ws,wd wd = rotate left through carry ws 1 1 c,n,z 64 rlnc rlnc f f = rotate left (no carry) f 1 1 n,z rlnc f,wreg wreg = rotate left (no carry) f 1 1 n,z rlnc ws,wd wd = rotate left (no carry) ws 1 1 n,z 65 rrc rrc f f = rotate right through carry f 1 1 c,n,z rrc f,wreg wreg = rotate right through carry f 1 1 c,n,z rrc ws,wd wd = rotate right through carry ws 1 1 c,n,z 66 rrnc rrnc f f = rotate right (no carry) f 1 1 n,z rrnc f,wreg wreg = rotate right (no carry) f 1 1 n,z rrnc ws,wd wd = rotate right (no carry) ws 1 1 n,z 67 sac sac acc,#slit4,wdo store accumulator 1 1 none sac.r acc,#slit4,wdo store rounded accumulator 1 1 none 68 se se ws,wnd wnd = sign-extended ws 1 1 c,n,z 69 setm setm f f = 0xffff 1 1 none setm wreg wreg = 0xffff 1 1 none setm ws ws = 0xffff 1 1 none 70 sftac sftac acc,wn arithmetic shift accumulator by (wn) 1 1 oa,ob,oab, sa,sb,sab sftac acc,#slit6 arithmetic shift accumulator by slit6 1 1 oa,ob,oab, sa,sb,sab table 21-2: instruction set overview (continued) base instr # assembly mnemonic assembly syntax description # of words # of cycle s status flags affected
dspic30f3010/3011 ds70141e-page 158 ? 2008 microchip technology inc. 71 sl sl f f = left shift f 1 1 c,n,ov,z sl f,wreg wreg = left shift f 1 1 c,n,ov,z sl ws,wd wd = left shift ws 1 1 c,n,ov,z sl wb,wns,wnd wnd = left shift wb by wns 1 1 n,z sl wb,#lit5,wnd wnd = left shift wb by lit5 1 1 n,z 72 sub sub acc subtract accumulators 1 1 oa,ob,oab, sa,sb,sab sub f f = f ? wreg 1 1 c,dc,n,ov,z sub f,wreg wreg = f ? wreg 1 1 c,dc,n,ov,z sub #lit10,wn wn = wn ? lit10 1 1 c,dc,n,ov,z sub wb,ws,wd wd = wb ? ws 1 1 c,dc,n,ov,z sub wb,#lit5,wd wd = wb ? lit5 1 1 c,dc,n,ov,z 73 subb subb f f = f ? wreg ? (c ) 1 1 c,dc,n,ov,z subb f,wreg wreg = f ? wreg ? (c ) 1 1 c,dc,n,ov,z subb #lit10,wn wn = wn ? lit10 ? (c ) 1 1 c,dc,n,ov,z subb wb,ws,wd wd = wb ? ws ? (c ) 1 1 c,dc,n,ov,z subb wb,#lit5,wd wd = wb ? lit5 ? (c ) 1 1 c,dc,n,ov,z 74 subr subr f f = wreg ? f 1 1 c,dc,n,ov,z subr f,wreg wreg = wreg ? f 1 1 c,dc,n,ov,z subr wb,ws,wd wd = ws ? wb 1 1 c,dc,n,ov,z subr wb,#lit5,wd wd = lit5 ? wb 1 1 c,dc,n,ov,z 75 subbr subbr f f = wreg ? f ? (c ) 1 1 c,dc,n,ov,z subbr f,wreg wreg = wreg ? f ? (c ) 1 1 c,dc,n,ov,z subbr wb,ws,wd wd = ws ? wb ? (c ) 1 1 c,dc,n,ov,z subbr wb,#lit5,wd wd = lit5 ? wb ? (c ) 1 1 c,dc,n,ov,z 76 swap swap.b wn wn = nibble swap wn 1 1 none swap wn wn = byte swap wn 1 1 none 77 tblrdh tblrdh ws,wd read prog<23:16> to wd<7:0> 1 2 none 78 tblrdl tblrdl ws,wd read prog<15:0> to wd 1 2 none 79 tblwth tblwth ws,wd write ws<7:0> to prog<23:16> 1 2 none 80 tblwtl tblwtl ws,wd write ws to prog<15:0> 1 2 none 81 ulnk ulnk unlink frame pointer 1 1 none 82 xor xor f f = f .xor. wreg 1 1 n,z xor f,wreg wreg = f .xor. wreg 1 1 n,z xor #lit10,wn wd = lit10 .xor. wd 1 1 n,z xor wb,ws,wd wd = wb .xor. ws 1 1 n,z xor wb,#lit5,wd wd = wb .xor. lit5 1 1 n,z 83 ze ze ws,wnd wnd = zero-extend ws 1 1 c,z,n table 21-2: instruction set overview (continued) base instr # assembly mnemonic assembly syntax description # of words # of cycle s status flags affected
? 2008 microchip technology inc. ds70141e-page 159 dspic30f3010/3011 22.0 development support the pic ? microcontrollers are supported with a full range of hardware and software development tools: ? integrated development environment - mplab ? ide software ? assemblers/compilers/linkers - mpasm tm assembler - mplab c18 and mplab c30 c compilers -mplink tm object linker/ mplib tm object librarian - mplab asm30 assembler/linker/library ? simulators - mplab sim software simulator ?emulators - mplab ice 2000 in-circuit emulator - mplab real ice? in-circuit emulator ? in-circuit debugger - mplab icd 2 ? device programmers - picstart ? plus development programmer - mplab pm3 device programmer - pickit? 2 development programmer ? low-cost demonstration and development boards and evaluation kits 22.1 mplab integrated development environment software the mplab ide software brings an ease of software development previously unseen in the 8/16-bit micro- controller market. the mplab ide is a windows ? operating system-based application that contains: ? a single graphical interface to all debugging tools - simulator - programmer (sold separately) - emulator (sold separately) - in-circuit debugger (sold separately) ? a full-featured editor with color-coded context ? a multiple project manager ? customizable data windows with direct edit of contents ? high-level source code debugging ? visual device initializer for easy register initialization ? mouse over variable inspection ? drag and drop variables from source to watch windows ? extensive on-line help ? integration of select third party tools, such as hi-tech software c compilers and iar c compilers the mplab ide allows you to: ? edit your source files (either assembly or c) ? one touch assemble (or compile) and download to pic mcu emulator and simulator tools (automatically updates all project information) ? debug using: - source files (assembly or c) - mixed assembly and c - machine code mplab ide supports multiple debugging tools in a single development paradigm, from the cost-effective simulators, through low-cost in-circuit debuggers, to full-featured emulators. this eliminates the learning curve when upgrading to tools with increased flexibility and power.
dspic30f3010/3011 ds70141e-page 160 ? 2008 microchip technology inc. 22.2 mpasm assembler the mpasm assembler is a full-featured, universal macro assembler for all pic mcus. the mpasm assembler generates relocatable object files for the mplink object linker, intel ? standard hex files, map files to detail memory usage and symbol reference, absolute lst files that contain source lines and generated machine code and coff files for debugging. the mpasm assembler features include: ? integration into mplab ide projects ? user-defined macros to streamline assembly code ? conditional assembly for multi-purpose source files ? directives that allow complete control over the assembly process 22.3 mplab c18 and mplab c30 c compilers the mplab c18 and mplab c30 code development systems are complete ansi c compilers for microchip?s pic18 and pic24 families of microcon- trollers and the dspic30 and dspic33 family of digital signal controllers. these compilers provide powerful integration capabilities, superior code optimization and ease of use not found with other compilers. for easy source level debugging, the compilers provide symbol information that is optimized to the mplab ide debugger. 22.4 mplink object linker/ mplib object librarian the mplink object linker combines relocatable objects created by the mpasm assembler and the mplab c18 c compiler. it can link relocatable objects from precompiled libraries, using directives from a linker script. the mplib object librarian manages the creation and modification of library files of precompiled code. when a routine from a library is called from a source file, only the modules that contain that routine will be linked in with the application. this allows large libraries to be used efficiently in many different applications. the object linker/library features include: ? efficient linking of single libraries instead of many smaller files ? enhanced code maintainability by grouping related modules together ? flexible creation of libraries with easy module listing, replacement, deletion and extraction 22.5 mplab asm30 assembler, linker and librarian mplab asm30 assembler produces relocatable machine code from symbolic assembly language for dspic30f devices. mplab c30 c compiler uses the assembler to produce its object file. the assembler generates relocatable object files that can then be archived or linked with other relocatable object files and archives to create an executable file. notable features of the assembler include: ? support for the entire dspic30f instruction set ? support for fixed-point and floating-point data ? command line interface ? rich directive set ? flexible macro language ? mplab ide compatibility 22.6 mplab sim software simulator the mplab sim software simulator allows code development in a pc-hosted environment by simulat- ing the pic mcus and dspic ? dscs on an instruction level. on any given instruction, the data areas can be examined or modified and stimuli can be applied from a comprehensive stimulus controller. registers can be logged to files for further run-time analysis. the trace buffer and logic analyzer display extend the power of the simulator to record and track program execution, actions on i/o, most peripherals and internal registers. the mplab sim software simulator fully supports symbolic debugging using the mplab c18 and mplab c30 c compilers, and the mpasm and mplab asm30 assemblers. the software simulator offers the flexibility to develop and debug code outside of the hardware laboratory environment, making it an excellent, economical software development tool.
? 2008 microchip technology inc. ds70141e-page 161 dspic30f3010/3011 22.7 mplab ice 2000 high-performance in-circuit emulator the mplab ice 2000 in-circuit emulator is intended to provide the product development engineer with a complete microcontroller design tool set for pic microcontrollers. software control of the mplab ice 2000 in-circuit emulator is advanced by the mplab integrated development environment, which allows editing, building, downloading and source debugging from a single environment. the mplab ice 2000 is a full-featured emulator system with enhanced trace, trigger and data monitor- ing features. interchangeable processor modules allow the system to be easily reconfigured for emulation of different processors. the architecture of the mplab ice 2000 in-circuit emulator allows expansion to support new pic microcontrollers. the mplab ice 2000 in-circuit emulator system has been designed as a real-time emulation system with advanced features that are typically found on more expensive development tools. the pc platform and microsoft ? windows ? 32-bit operating system were chosen to best make these features available in a simple, unified application. 22.8 mplab real ice in-circuit emulator system mplab real ice in-circuit emulator system is microchip?s next generation high-speed emulator for microchip flash dsc and mcu devices. it debugs and programs pic ? flash mcus and dspic ? flash dscs with the easy-to-use, powerful graphical user interface of the mplab integrated development environment (ide), included with each kit. the mplab real ice probe is connected to the design engineer?s pc using a high-speed usb 2.0 interface and is connected to the target with either a connector compatible with the popular mplab icd 2 system (rj11) or with the new high-speed, noise tolerant, low- voltage differential signal (lvds) interconnection (cat5). mplab real ice is field upgradeable through future firmware downloads in mplab ide. in upcoming releases of mplab ide, new devices will be sup- ported, and new features will be added, such as soft- ware breakpoints and assembly code trace. mplab real ice offers significant advantages over competi- tive emulators including low-cost, full-speed emulation, real-time variable watches, trace analysis, complex breakpoints, a ruggedized probe interface and long (up to three meters) interconnection cables. 22.9 mplab icd 2 in-circuit debugger microchip?s in-circuit debugger, mplab icd 2, is a powerful, low-cost, run-time development tool, connecting to the host pc via an rs-232 or high-speed usb interface. this tool is based on the flash pic mcus and can be used to develop for these and other pic mcus and dspic dscs. the mplab icd 2 utilizes the in-circuit debugging capability built into the flash devices. this feature, along with microchip?s in-circuit serial programming tm (icsp tm ) protocol, offers cost- effective, in-circuit flash debugging from the graphical user interface of the mplab integrated development environment. this enables a designer to develop and debug source code by setting breakpoints, single step- ping and watching variables, and cpu status and peripheral registers. running at full speed enables testing hardware and applications in real time. mplab icd 2 also serves as a development programmer for selected pic devices. 22.10 mplab pm3 device programmer the mplab pm3 device programmer is a universal, ce compliant device programmer with programmable voltage verification at v ddmin and v ddmax for maximum reliability. it features a large lcd display (128 x 64) for menus and error messages and a modu- lar, detachable socket assembly to support various package types. the icsp? cable assembly is included as a standard item. in stand-alone mode, the mplab pm3 device programmer can read, verify and program pic devices without a pc connection. it can also set code protection in this mode. the mplab pm3 connects to the host pc via an rs-232 or usb cable. the mplab pm3 has high-speed communications and optimized algorithms for quick programming of large memory devices and incorporates an sd/mmc card for file storage and secure data applications.
dspic30f3010/3011 ds70141e-page 162 ? 2008 microchip technology inc. 22.11 picstart plus development programmer the picstart plus development programmer is an easy-to-use, low-cost, prototype programmer. it connects to the pc via a com (rs-232) port. mplab integrated development environment software makes using the programmer simple and efficient. the picstart plus development programmer supports most pic devices in dip packages up to 40 pins. larger pin count devices, such as the pic16c92x and pic17c76x, may be supported with an adapter socket. the picstart plus development programmer is ce compliant. 22.12 pickit 2 development programmer the pickit? 2 development programmer is a low-cost programmer and selected flash device debugger with an easy-to-use interface for programming many of microchip?s baseline, mid-range and pic18f families of flash memory microcontrollers. the pickit 2 starter kit includes a prototyping development board, twelve sequential lessons, software and hi-tech?s picc? lite c compiler, and is designed to help get up to speed quickly using pic ? microcontrollers. the kit provides everything needed to program, evaluate and develop applications using microchip?s powerful, mid-range flash memory family of microcontrollers. 22.13 demonstration, development and evaluation boards a wide variety of demonstration, development and evaluation boards for various pic mcus and dspic dscs allows quick application development on fully func- tional systems. most boards include prototyping areas for adding custom circuitry and provide application firmware and source code for examination and modification. the boards support a variety of features, including leds, temperature sensors, switches, speakers, rs-232 interfaces, lcd displays, potentiometers and additional eeprom memory. the demonstration and development boards can be used in teaching environments, for prototyping custom circuits and for learning about various microcontroller applications. in addition to the picdem? and dspicdem? demon- stration/development board series of circuits, microchip has a line of evaluation kits and demonstration software for analog filter design, k ee l oq ? security ics, can, irda ? , powersmart battery management, seeval ? evaluation system, sigma-delta adc, flow rate sensing, plus many more. check the microchip web page (www.microchip.com) for the complete list of demonstration, development and evaluation kits.
? 2008 microchip technology inc. ds70141e-page 163 dspic30f3010/3011 23.0 electrical characteristics this section provides an overview of dspic30f electrical characteristics. additional information will be provided in future revisions of this document as it becomes available. for detailed information about the dspic30f architecture and core, refer to ?dspic30f family reference manual? (ds70046). absolute maximum ratings for the dspic30f family are listed below. exposure to these maximum rating conditions for extended periods may affect device reliability. functional operation of the device at these or any other conditions above the parameters indicated in the operation listings of this specification is not implied. absolute maximum ratings (?) ambient temperature under bias................................................................................................. ............-40c to +125c storage temperature ............................................................................................................ .................. -65c to +150c voltage on any pin with respect to v ss (except v dd and mclr ) (note 1) ..................................... -0.3v to (v dd + 0.3v) voltage on v dd with respect to v ss ......................................................................................................... -0.3v to +5.5v voltage on mclr with respect to v ss ....................................................................................................... 0v to +13.25v maximum current out of v ss pin ........................................................................................................................... 300 ma maximum current into v dd pin (note 2) ................................................................................................................250 ma input clamp current, i ik (v i < 0 or v i > v dd ) .......................................................................................................... 20 ma output clamp current, i ok (v o < 0 or v o > v dd ) ...................................................................................................20 ma maximum output current sunk by any i/o pin..................................................................................... .....................25 ma maximum output current sourced by any i/o pin .................................................................................. ..................25 ma maximum current sunk by all ports .............................................................................................. .........................200 ma maximum current sourced by all ports (note 2) ....................................................................................................200 ma note 1: voltage spikes below vss at the mclr /v pp pin, inducing currents greater than 80 ma, may cause latch-up. thus, a series resistor of 50-100 should be used when applying a ?low? level to the mclr /v pp pin, rather than pulling this pin directly to vss. 2: maximum allowable current is a function of device maximum power dissipation. see table 23-2. 23.1 dc characteristics ? notice: stresses above those listed under ?absolute maximum ratings? may cause permanent damage to the device. this is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. exposure to maximum rating conditions for extended periods may affect device reliability. table 23-1: operating mips vs. voltage v dd range temp range max mips dspic30f301x-30i dspic30f301x-20e 4.5-5.5v -40c to 85c 30 ? 4.5-5.5v -40c to 125c ? 20 3.0-3.6v -40c to 85c 20 ? 3.0-3.6v -40c to 125c ? 15 2.5-3.0v -40c to 85c 10 ?
dspic30f3010/3011 ds70141e-page 164 ? 2008 microchip technology inc. table 23-2: thermal operating conditions rating symbol min typ max unit dspic30f301x-30i operating junction temperature range t j -40 ? +125 c operating ambient temperature range t a -40 ? +85 c dspic30f301x-20e operating junction temperature range t j -40 ? +150 c operating ambient temperature range t a -40 ? +125 c power dissipation: internal chip power dissipation: p d p int + p i / o w i/o pin power dissipation: maximum allowed power dissipation p dmax (t j ? t a )/ ja w table 23-3: thermal packaging characteristics characteristic symbol typ max unit notes package thermal resistance, 28-pin spdip (sp) ja 42 ? c/w 1 package thermal resistance, 28-pin soic (so) ja 49 ? c/w 1 package thermal resistance, 40-pin pdip (p) ja 37 ? c/w 1 package thermal resistance, 44-pin tqfp (pt, 10x10x1 mm) ja 45 ? c/w 1 package thermal resistance, 44-pin qfn (ml) ja 28 ? c/w 1 note 1: junction to ambient thermal resistance, theta-ja ( ja ) numbers are achieved by package simulations. table 23-4: dc temperature and voltage specifications dc characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic min typ (1) max units conditions operating voltage (2) dc10 v dd supply voltage 2.5 ? 5.5 v industrial temperature dc11 v dd supply voltage 3.0 ? 5.5 v extended temperature dc12 v dr ram data retention voltage (3) 1.75 ? ? v dc16 v por v dd start voltage to ensure internal power-on reset signal ?v ss ?v dc17 s vdd v dd rise rate to ensure internal power-on reset signal 0.05 ? ? v/ms 0-5v in 0.1 sec 0-3v in 60 ms note 1: data in ?typ? column is at 5v, 25c unless otherwise stated. parameters are for design guidance only and are not tested. 2: these parameters are characterized but not tested in manufacturing. 3: this is the limit to which v dd can be lowered without losing ram data. p int v dd i dd i oh ? () = p i / o v dd v oh ? {} i oh () v ol i ol () + =
? 2008 microchip technology inc. ds70141e-page 165 dspic30f3010/3011 table 23-5: dc characteristics: operating current (i dd ) dc characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended parameter no. typical (1) max units conditions operating current (i dd ) (2) dc31a 1.4 2.5 ma 25c 3.3v 0.128 mips lprc (512 khz) dc31b 1.4 2.5 ma 85c dc31c 1.4 2.5 ma 125c dc31e 3.0 4.5 ma 25c 5v dc31f 2.8 4.5 ma 85c dc31g 2.8 4.5 ma 125c dc30a 3.2 5.0 ma 25c 3.3v 1.8 mips frc (7.37mhz) dc30b 3.3 5.0 ma 85c dc30c 3.3 5.0 ma 125c dc30e 6.0 9.0 ma 25c 5v dc30f 5.9 9.0 ma 85c dc30g 5.9 9.0 ma 125c dc23a 10.0 17.0 ma 25c 3.3v 4 mips dc23b 10.0 17.0 ma 85c dc23c 11.0 17.0 ma 125c dc23e 17.0 27.0 ma 25c 5v dc23f 17.0 27.0 ma 85c dc23g 18.0 27.0 ma 125c dc24a 24.0 38.0 ma 25c 3.3v 10 mips dc24b 25.0 38.0 ma 85c dc24c 25.0 38.0 ma 125c dc24e 41.0 62.0 ma 25c 5v dc24f 41.0 62.0 ma 85c dc24g 41.0 62.0 ma 125c dc27a 46.0 70.0 ma 25c 3.3v 20 mips dc27b 46.0 70.0 ma 85c dc27d 76.0 115.0 ma 25c 5v dc27e 76.0 115.0 ma 85c dc27f 76.0 115.0 ma 125c dc29a 109.0 155.0 ma 25c 5v 30 mips dc29b 108.0 155.0 ma 85c note 1: data in ?typical? column is at 5v, 25c unless otherwise stated. parameters are for design guidance only and are not tested. 2: the supply current is mainly a function of the operating voltage and frequency. other factors, such as i/o pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption. the test conditions for all i dd measurements are as follows: osc1 driven with external square wave from rail to rail. all i/o pins are configured as inputs and pulled to v dd . mclr = v dd , wdt, fscm, lvd and bor are disabled. cpu, sram, program memory and data memory are operational. no peripheral modules are operating.
dspic30f3010/3011 ds70141e-page 166 ? 2008 microchip technology inc. table 23-6: dc characteristics: idle current (i idle ) dc characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended parameter no. typical (1,2) max units conditions operating current (i dd ) dc51a 1.1 1.8 ma 25c 3.3v 0.128 mips lprc (512 khz) dc51b 1.1 1.8 ma 85c dc51c 1.1 1.8 ma 125c dc51e 2.6 4.0 ma 25c 5v dc51f 2.4 4.0 ma 85c dc51g 2.3 4.0 ma 125c dc50a 3.2 5.0 ma 25c 3.3v 1.8 mips frc (7.37mhz) dc50b 3.3 5.0 ma 85c dc50c 3.3 5.0 ma 125c dc50e 6.0 9.0 ma 25c 5v dc50f 5.9 9.0 ma 85c dc50g 5.9 9.0 ma 125c dc43a 6.0 9.3 ma 25c 3.3v 4 mips dc43b 6.1 9.3 ma 85c dc43c 6.2 9.3 ma 125c dc43e 11.0 17.0 ma 25c 5v dc43f 11.0 17.0 ma 85c dc43g 11.0 17.0 ma 125c dc44a 13.0 21.0 ma 25c 3.3v 10 mips dc44b 14.0 21.0 ma 85c dc44c 14.0 21.0 ma 125c dc44e 23.0 35.0 ma 25c 5v dc44f 23.0 35.0 ma 85c dc44g 23.0 35.0 ma 125c dc47a 25.0 40.0 ma 25c 3.3v 20 mips dc47b 26.0 40.0 ma 85c dc47d 43.0 60.0 ma 25c 5v dc47e 43.0 60.0 ma 85c dc47f 43.0 60.0 ma 125c dc49a 62.0 80.0 ma 25c 5v 30 mips dc49b 63.0 80.0 ma 85c note 1: data in ?typical? column is at 5v, 25c unless otherwise stated. parameters are for design guidance only and are not tested. 2: base i idle current is measured with core off, clock on and all modules turned off.
? 2008 microchip technology inc. ds70141e-page 167 dspic30f3010/3011 table 23-7: dc characteristics: power-down current (i pd ) dc characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended parameter no. typical (1) max units conditions power-down current (i pd ) (2) dc60a 0.3 14.0 a 25c 3.3v base power-down current dc60b 1.0 27.0 a 85c dc60c 12.0 55.0 a 125c dc60e 0.5 20.0 a 25c 5v dc60f 2.0 40.0 a 85c dc60g 17.0 90.0 a 125c dc61a 8.0 12.0 a 25c 3.3v watchdog timer current: i wdt (3) dc61b 8.0 12.0 a 85c dc61c 8.0 12.0 a 125c dc61e 14.0 21.0 a 25c 5v dc61f 14.0 21.0 a 85c dc61g 14.0 21.0 a 125c dc62a 4.0 10.0 a 25c 3.3v timer 1 w/32 khz crystal: i ti 32 (3) dc62b 5.0 10.0 a 85c dc62c 4.0 10.0 a 125c dc62e 4.0 15.0 a 25c 5v dc62f 6.0 15.0 a 85c dc62g 5.0 15.0 a 125c dc63a 33.0 57.0 a 25c 3.3v bor on: i bor (3) dc63b 37.0 57.0 a 85c dc63c 38.0 57.0 a 125c dc63e 38.0 65.0 a 25c 5v dc63f 41.0 65.0 a 85c dc63g 43.0 65.0 a 125c note 1: parameters are for design guidance only and are not tested. 2: these parameters are characterized but not tested in manufacturing. 3: these values represent the difference between the base power-down current and the power-down current with the specified peripheral enabled during sleep.
dspic30f3010/3011 ds70141e-page 168 ? 2008 microchip technology inc. table 23-8: dc characteristics: i/o pin input specifications dc characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic min typ (1) max units conditions v il input low voltage (2) di10 i/o pins: with schmitt trigger buffer v ss ?0.2v dd v di15 mclr v ss ?0.2v dd v di16 osc1 (in xt, hs and lp modes) v ss ?0.2v dd v di17 osc1 (in rc mode) (3) v ss ?0.3v dd v di18 sda, scl v ss ?0.3v dd v smbus disabled di19 sda, scl v ss ?0.2v dd v smbus enabled v ih input high voltage (2) di20 i/o pins: with schmitt trigger buffer 0.8 v dd ?v dd v di25 mclr 0.8 v dd ?v dd v di26 osc1 (in xt, hs and lp modes) 0.7 v dd ?v dd v di27 osc1 (in rc mode) (3) 0.9 v dd ?v dd v di28 sda, scl 0.7 v dd ?v dd v smbus disabled di29 sda, scl 0.8 v dd ?v dd v smbus enabled i cnpu cn xx pull-up current (2) di30 50 250 400 av dd = 5v, v pin = v ss i il input leakage current (2,4,5) di50 i/o ports ? 0.01 1 av ss v pin v dd , pin at high-impedance di51 analog input pins ? 0.50 ? av ss v pin v dd , pin at high-impedance di55 mclr ?0.055 av ss v pin v dd di56 osc1 ? 0.05 5 av ss v pin v dd , xt, hs and lp oscillator mode note 1: data in ?typ? column is at 5v, 25c unless otherwise stated. parameters are for design guidance only and are not tested. 2: these parameters are characterized but not tested in manufacturing. 3: in rc oscillator configuration, the osc1/clkl pin is a schmitt trigger input. it is not recommended that the dspic30f device be driven with an external clock while in rc mode. 4: the leakage current on the mclr pin is strongly dependent on the applied voltage level. the specified levels represent normal operating conditions. higher leakage current may be measured at different input voltages. 5: negative current is defined as current sourced by the pin.
? 2008 microchip technology inc. ds70141e-page 169 dspic30f3010/3011 figure 23-1: brown-out reset characteristics table 23-9: dc characteristics: i/o pin output specifications dc characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic min typ (1) max units conditions v ol output low voltage (2) do10 i/o ports ? ? 0.6 v i ol = 8.5 ma, v dd = 5v ??0.15vi ol = 2.0 ma, v dd = 3v do16 osc2/clko ? ? 0.6 v i ol = 1.6 ma, v dd = 5v (rc or ec oscillator mode) ? ? 0.72 v i ol = 2.0 ma, v dd = 3v v oh output high voltage (2) do20 i/o ports v dd ? 0.7 ? ? v i oh = -3.0 ma, v dd = 5v v dd ? 0.2 ? ? v i oh = -2.0 ma, v dd = 3v do26 osc2/clko v dd ? 0.7 ? ? v i oh = -1.3 ma, v dd = 5v (rc or ec oscillator mode) v dd ? 0.1 ? ? v i oh = -2.0 ma, v dd = 3v capacitive loading specs on output pins (2) do50 c osc 2 osc2/sosc2 pin ? ? 15 pf in xtl, xt, hs and lp modes when external clock is used to drive osc1. do56 c io all i/o pins and osc2 ? ? 50 pf rc or ec oscillator mode do58 c b scl, sda ? ? 400 pf in i 2 c? mode note 1: data in ?typ? column is at 5v, 25c unless otherwise stated. parameters are for design guidance only and are not tested. 2: these parameters are characterized but not tested in manufacturing. bo10 reset (due to bor) v dd (device in brown-out reset) (device not in brown-out reset) power-up time-out bo15
dspic30f3010/3011 ds70141e-page 170 ? 2008 microchip technology inc. table 23-10: electrical characteristics: bor dc characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic min typ (1) max units conditions bo10 v bor bor voltage on v dd transition high-to-low (2) borv = 11 (3) ? ? ? v not in operating range borv = 10 2.6 ? 2.71 v borv = 01 4.1 ? 4.4 v borv = 00 4.58 ? 4.73 v bo15 v bhys ?5?mv note 1: data in ?typ? column is at 5v, 25c unless otherwise stated. parameters are for design guidance only and are not tested. 2: these parameters are characterized but not tested in manufacturing. 3: ? 11 ? values not in usable operating range. table 23-11: dc characteristics: program and eeprom dc characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic min typ (1) max units conditions data eeprom memory (2) d120 e d byte endurance 100k 1m ? e/w -40 c t a +85c d121 v drw v dd for read/write v min ? 5.5 v using eecon to read/write v min = minimum operating voltage d122 t dew erase/write cycle time ? 2 ? ms d123 t retd characteristic retention 40 100 ? year provided no other specifications are violated d124 i dew i dd during programming ? 10 30 ma row erase program flash memory (2) d130 e p cell endurance 10k 100k ? e/w -40 c t a +85c d131 v pr v dd for read v min ?5.5vv min = minimum operating voltage d132 v eb v dd for bulk erase 4.5 ? 5.5 v d133 v pew v dd for erase/write 3.0 ? 5.5 v d134 t pew erase/write cycle time 1 ? 2 ms d135 t retd characteristic retention 40 100 ? year provided no other specifications are violated d136 t eb icsp? block erase time ? 4 ? ms d137 i pew i dd during programming ? 10 30 ma row erase d138 i eb i dd during programming ? 10 30 ma bulk erase note 1: data in ?typ? column is at 5v, 25c unless otherwise stated. 2: these parameters are characterized but not tested in manufacturing.
? 2008 microchip technology inc. ds70141e-page 171 dspic30f3010/3011 23.2 ac characteristics and timing parameters the information contained in this section defines dspic30f ac characteristics and timing parameters. figure 23-2: load conditions for device timing specifications figure 23-3: external clock timing table 23-12: temperature and vo ltage specifications ? ac ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended operating voltage v dd range as described in section 23.1 "dc characteristics" . v dd /2 c l r l pin pin v ss v ss c l r l = 464 c l = 50 pf for all pins except osc2 5 pf for osc2 output load condition 1 ? for all pins except osc2 load condition 2 ? for osc2 osc1 clko q4 q1 q2 q3 q4 q1 os20 os30 os30 os40 os41 os31 os31 os25
dspic30f3010/3011 ds70141e-page 172 ? 2008 microchip technology inc. table 23-13: external cl ock timing requirements ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic min typ (1) max units conditions os10 f osc external clki frequency (2) (external clocks allowed only in ec mode) dc 4 4 4 ? ? ? ? 40 10 10 7.5 mhz mhz mhz mhz ec ec with 4x pll ec with 8x pll ec with 16x pll oscillator frequency (2) dc 0.4 4 4 4 4 10 31 ? ? ? ? ? ? ? ? ? ? 7.37 512 4 4 10 10 10 7.5 25 33 ? ? mhz mhz mhz mhz mhz mhz mhz khz mhz khz rc xtl xt xt with 4x pll xt with 8x pll xt with 16x pll hs lp frc internal lprc internal os20 t osc t osc = 1/f osc ? ? ? ? see parameter os10 for f osc value os25 t cy instruction cycle time (2,3) 33 ? dc ns see table 23-16 os30 tosl, tos h external clock in (osc1) high or low time (2) .45 x t osc ??nsec os31 tosr, tos f external clock in (osc1) rise or fall time (2) ? ? 20 ns ec os40 tckr clko rise time (2,4) ? ? ? ns see parameter do31 os41 tckf clko fall time (2,4) ? ? ? ns see parameter do32 note 1: data in ?typ? column is at 5v, 25c unless otherwise stated. parameters are for design guidance only and are not tested. 2: these parameters are characterized but not tested in manufacturing. 3: instruction cycle period (t cy ) equals four times the input oscillator time base period. all specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumpt ion. all devices are tested to operate at ?min.? values with an external clock applied to the osc1/clki pin. when an external clock input is used, the ?max.? cycle time limit is ?dc? (no clock) for all devices. 4: measurements are taken in ec or erc modes. the clko signal is measured on the osc2 pin. clko is low for the q1-q2 period (1/2 t cy ) and high for the q3-q4 period (1/2 t cy ).
? 2008 microchip technology inc. ds70141e-page 173 dspic30f3010/3011 table 23-14: pll clock ti ming specifications (v dd = 2.5 to 5.5 v) ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic (1) min typ (2) max units conditions os50 f plli pll input frequency range (2) 4 4 4 4 4 4 5 (3) 5 (3) 5 (3) 4 4 4 ? ? ? ? ? ? ? ? ? ? ? ? 10 10 7.5 (4) 10 10 7.5 (4) 10 10 7.5 (4) 8.33 (3) 8.33 (3) 7.5 (4) mhz mhz mhz mhz mhz mhz mhz mhz mhz mhz mhz mhz ec with 4x pll ec with 8x pll ec with 16x pll xt with 4x pll xt with 8x pll xt with 16x pll hs/2 with 4x pll hs/2 with 8x pll hs/2 with 16x pll hs/3 with 4x pll hs/3 with 8x pll hs/3 with 16x pll os51 f sys on-chip pll output (2) 16 ? 120 mhz ec, xt, hs/2, hs/3 modes with pll os52 t loc pll start-up time (lock time) ? 20 50 s note 1: these parameters are characterized but not tested in manufacturing. 2: data in ?typ? column is at 5v, 25c unless otherwise stated. parameters are for design guidance only and are not tested. 3: limited by oscillator frequency range. 4: limited by device operating frequency range. table 23-15: pll jitter ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40c t a +125c for extended param no. characteristic min typ (1) max units conditions os61 x4 pll ? 0.251 0.413 % -40c t a +85c v dd = 3.0 to 3.6v ? 0.251 0.413 % -40c t a +125c v dd = 3.0 to 3.6v ? 0.256 0.47 % -40c t a +85c v dd = 4.5 to 5.5v ? 0.256 0.47 % -40c t a +125c v dd = 4.5 to 5.5v x8 pll ? 0.355 0.584 % -40c t a +85c v dd = 3.0 to 3.6v ? 0.355 0.584 % -40c t a +125c v dd = 3.0 to 3.6v ? 0.362 0.664 % -40c t a +85c v dd = 4.5 to 5.5v ? 0.362 0.664 % -40c t a +125c v dd = 4.5 to 5.5v x16 pll ? 0.67 0.92 % -40c t a +85c v dd = 3.0 to 3.6v ? 0.632 0.956 % -40c t a +85c v dd = 4.5 to 5.5v ? 0.632 0.956 % -40c t a +125c v dd = 4.5 to 5.5v note 1: these parameters are characterized but not tested in manufacturing.
dspic30f3010/3011 ds70141e-page 174 ? 2008 microchip technology inc. table 23-16: internal cl ock timing examples clock oscillator mode f osc (mhz) (1) t cy ( sec) (2) mips (3) w/o pll mips (3) w pll x4 mips (3) w pll x8 mips (3) w pll x16 ec 0.200 20.0 0.05 ? ? ? 4 1.0 1.0 4.0 8.0 16.0 10 0.4 2.5 10.0 20.0 ? 25 0.16 6.25 ? ? ? xt 4 1.0 1.0 4.0 8.0 16.0 10 0.4 2.5 10.0 20.0 ? note 1: assumption: oscillator postscaler is divide by 1. 2: instruction execution cycle time: t cy = 1/mips. 3: instruction execution frequency: mips = (f osc * pllx)/4 since there are 4 q clocks per instruction cycle.
? 2008 microchip technology inc. ds70141e-page 175 dspic30f3010/3011 table 23-17: ac characteristics: internal frc accuracy ac characteristics (2) standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40c t a +125c for extended param no. characteristic min typ max units conditions internal frc accuracy @ frc freq. = 7.37 mhz (1) os63 frc ? ? 2.00 % -40c t a +85c v dd = 3.0-5.5v ? ? 5.00 % -40c t a +125c v dd = 3.0-5.5v note 1: frequency calibrated at 25c and 5v. tun bits can be used to compensate for temperature drift. table 23-18: ac characteristics: internal lprc accuracy ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. characteristic min typ max units conditions lprc @ freq. = 512 khz (1) os65a -50 ? +50 % v dd = 5.0v, 10% os65b -60 ? +60 % v dd = 3.3v, 10% os65c -70 ? +70 % v dd = 2.5v note 1: change of lprc frequency as v dd changes.
dspic30f3010/3011 ds70141e-page 176 ? 2008 microchip technology inc. figure 23-4: clko and i/o ti ming characteristics table 23-19: clko and i/ o timing requirements ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic (1,2,3) min typ (4) max units conditions do31 t io r port output rise time ? 7 20 ns do32 t io f port output fall time ? 7 20 ns di35 t inp intx pin high or low time (output) 20 ? ? ns di40 t rbp cnx high or low time (input) 2 t cy ??ns note 1: these parameters are asynchronous events not related to any internal clock edges. 2: measurements are taken in rc mode and ec mode where clko output is 4 x t osc . 3: these parameters are characterized but not tested in manufacturing. 4: data in ?typ? column is at 5v, 25c unless otherwise stated. note: refer to figure 23-2 for load conditions. i/o pin (input) i/o pin (output) di35 old value new value di40 do31 do32
? 2008 microchip technology inc. ds70141e-page 177 dspic30f3010/3011 figure 23-5: reset, watchdog timer, os cillator start-up timer and power-up timer timing characteristics table 23-20: reset, watchdog timer, oscill ator start-up timer, power-up timer and brown-out reset timing requirements ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic (1) min typ (2) max units conditions sy10 tmcl mclr pulse width (low) 2 ? ? s -40c to +85c sy11 t pwrt power-up timer period 2 10 43 4 16 64 8 32 128 ms -40c to +85c, v dd = 5v user programmable sy12 t por power-on reset delay 3 10 30 s -40c to +85c sy13 t ioz i/o high-impedance from mclr low or watchdog timer reset ?0.81.0 s sy20 t wdt 1 t wdt 2 t wdt 3 watchdog timer time-out period (no prescaler) 1.1 1.2 1.3 2.0 2.0 2.0 6.6 5.0 4.0 ms ms ms v dd = 2.5v v dd = 3.3v, 10% v dd = 5v, 10% sy25 t bor brown-out reset pulse width (3) 100 ? ? sv dd v bor (d034) sy30 t ost oscillator start-up timer period ? 1024 t osc ??t osc = osc1 period sy35 t fscm fail-safe clock monitor delay ? 500 900 s -40c to +85c note 1: these parameters are characterized but not tested in manufacturing. 2: data in ?typ? column is at 5v, 25c unless otherwise stated. 3: refer to figure 23-1 and table 23-10 for bor. v dd mclr internal por pwrt time-out oscillator time-out internal reset watchdog timer reset sy11 sy10 sy20 sy13 i/o pins sy13 note: refer to figure 23-2 for load conditions. fscm delay sy35 sy30 sy12
dspic30f3010/3011 ds70141e-page 178 ? 2008 microchip technology inc. figure 23-6: band gap start-up time characteristics table 23-21: band gap start-up time requirements ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic (1) min typ (2) max units conditions sy40 t bgap band gap start-up time ? 40 65 s defined as the time between the instant that the band gap is enabled and the moment that the band gap reference voltage is stable. rcon<13> status bit note 1: these parameters are characterized but not tested in manufacturing. 2: data in ?typ? column is at 5v, 25c unless otherwise stated. v bgap enable band gap (1) band gap 0v stable note 1: band gap is enabled when fborpor<7> is set. sy40
? 2008 microchip technology inc. ds70141e-page 179 dspic30f3010/3011 figure 23-7: timer1, 2, 3, 4 and 5 external clock timing characteristics note: refer to figure 23-2 for load conditions. tx11 tx15 tx10 tx20 tmrx os60 txck table 23-22: timer1 external cl ock timing requirements ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic min typ max units conditions ta10 t tx h txck high time synchronous, no prescaler 0.5 t cy + 20 ? ? ns must also meet parameter ta15 synchronous, with prescaler 10 ? ? ns asynchronous 10 ? ? ns ta11 t tx l txck low time synchronous, no prescaler 0.5 t cy + 20 ? ? ns must also meet parameter ta15 synchronous, with prescaler 10 ? ? ns asynchronous 10 ? ? ns ta15 t tx p txck input period synchronous, no prescaler t cy + 10 ? ? ns synchronous, with prescaler greater of: 20 ns or (t cy + 40)/n ? ? ? n = prescale value (1, 8, 64, 256) asynchronous 20 ? ? ns os60 ft1 sosc1/t1ck oscillator input frequency range (oscillator enabled by setting bit, tcs (t1con<1>)) dc ? 50 khz ta20 t ckextmrl delay from external txck clock edge to timer increment 0.5 t cy 1.5 t cy ?
dspic30f3010/3011 ds70141e-page 180 ? 2008 microchip technology inc. table 23-23: timer2 and timer4 external clock timing requirements ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic min typ max units conditions tb10 ttxh txck high time synchronous, no prescaler 0.5 t cy + 20 ? ? ns must also meet parameter tb15 synchronous, with prescaler 10 ? ? ns tb11 ttxl txck low time synchronous, no prescaler 0.5 t cy + 20 ? ? ns must also meet parameter tb15 synchronous, with prescaler 10 ? ? ns tb15 ttxp txck input period synchronous, no prescaler t cy + 10 ? ? ns n = prescale value (1, 8, 64, 256) synchronous, with prescaler greater of: 20 ns or (t cy + 40)/n tb20 t ckextmrl delay from external txck clock edge to timer increment 0.5 t cy ? 1.5 t cy ? table 23-24: timer3 and timer5 ex ternal clock timing requirements ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic min typ max units conditions tc10 ttxh txck high time synchronous 0.5 t cy + 20 ? ? ns must also meet parameter tc15 tc11 ttxl txck low time synchronous 0.5 t cy + 20 ? ? ns must also meet parameter tc15 tc15 ttxp txck input period synchronous, no prescaler t cy + 10 ? ? ns n = prescale value (1, 8, 64, 256) synchronous, with prescaler greater of: 20 ns or (t cy + 40)/n tc20 t ckextmrl delay from external txck clock edge to timer increment 0.5 t cy ?1.5 t cy ?
? 2008 microchip technology inc. ds70141e-page 181 dspic30f3010/3011 figure 23-8: timerq (qei module) external clock timing characteristics table 23-25: qei module external clock timing requirements ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic (1) min typ max units conditions tq10 ttqh tqck high time synchronous, with prescaler t cy + 20 ? ? ns must also meet parameter tq15 tq11 ttql tqck low time synchronous, with prescaler t cy + 20 ? ? ns must also meet parameter tq15 tq15 ttqp tqcp input period synchronous, with prescaler 2 * t cy + 40 ? ? ns tq20 t ckextmrl delay from external tqck clock edge to timer increment 0.5 t cy ?1.5 t cy ? note 1: these parameters are characterized but not tested in manufacturing. tq11 tq15 tq10 tq20 qeb poscnt
dspic30f3010/3011 ds70141e-page 182 ? 2008 microchip technology inc. figure 23-9: input capture (capx) timing characteristics figure 23-10: output compare module (o cx) timing characteristics table 23-26: input capture timing requirements ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic (1) min max units conditions ic10 tccl icx input low time no prescaler 0.5 t cy + 20 ? ns with prescaler 10 ? ns ic11 tcch icx input high time no prescaler 0.5 t cy + 20 ? ns with prescaler 10 ? ns ic15 tccp icx input period (2 t cy + 40)/n ? ns n = prescale value (1, 4, 16) note 1: these parameters are characterized but not tested in manufacturing. table 23-27: output compare mo dule timing requirements ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic (1) min typ max units conditions oc10 tccf ocx output fall time ? ? ? ns see parameter do32 oc11 tccr ocx output rise time ? ? ? ns see parameter do31 note 1: these parameters are characterized but not tested in manufacturing. ic x ic10 ic11 ic15 note: refer to figure 23-2 for load conditions. ocx oc11 oc10 (output compare note: refer to figure 23-2 for load conditions. or pwm mode)
? 2008 microchip technology inc. ds70141e-page 183 dspic30f3010/3011 figure 23-11: ocx/pwm module ti ming characteristics table 23-28: simple ocx/pwm mode timing requirements ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic (1) min typ max units conditions oc15 t fd fault input to pwm i/o change ??50ns oc20 t flt fault input pulse width 50 ? ? ns note 1: these parameters are characterized but not tested in manufacturing. ocfa /ocfb ocx oc20 oc15
dspic30f3010/3011 ds70141e-page 184 ? 2008 microchip technology inc. figure 23-12: motor contro l pwm module fault timing characteristics figure 23-13: motor co ntrol pwm module timing characteristics table 23-29: motor co ntrol pwm module ti ming requirements ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic (1) min typ max units conditions mp10 t fpwm pwm output fall time ? ? ? ns see parameter do32 mp11 t rpwm pwm output rise time ? ? ? ns see parameter do31 mp20 t fd fault input to pwm i/o change ? ? 50 ns mp30 t fh minimum pulse width 50 ? ? ns note 1: these parameters are characterized but not tested in manufacturing. flta /b pwmx mp30 mp20 pwmx mp11 mp10 note: refer to figure 23-2 for load conditions.
? 2008 microchip technology inc. ds70141e-page 185 dspic30f3010/3011 figure 23-14: qea/qeb input characteristics table 23-30: quadrature deco der timing requirements ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic (1) typ (2) max units conditions tq30 t qu l quadrature input low time 6 t cy ?ns tq31 t qu h quadrature input high time 6 t cy ?ns tq35 t qu in quadrature input period 12 t cy ?ns tq36 t qu p quadrature phase period 3 t cy ?ns tq40 t quf l filter time to recognize low, with digital filter 3 * n * t cy ? ns n = 1, 2, 4, 16, 32, 64, 128 and 256 (note 2) tq41 t quf h filter time to recognize high, with digital filter 3 * n * t cy ? ns n = 1, 2, 4, 16, 32, 64, 128 and 256 (note 2) note 1: these parameters are characterized but not tested in manufacturing. 2: n = index channel digital filter clock divide select bits. refer to section 16. ?quadrature encoder interface (qei)? in the ?dspic30f family reference manual? (ds70046). tq30 tq35 tq31 qea (input) tq30 tq35 tq31 qeb (input) tq36 qeb internal tq40 tq41
dspic30f3010/3011 ds70141e-page 186 ? 2008 microchip technology inc. figure 23-15: qei module index puls e timing characteristics table 23-31: qei index pulse timing requirements ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic (1) min max units conditions tq50 tqil filter time to recognize low, with digital filter 3 * n * t cy ? ns n = 1, 2, 4, 16, 32, 64, 128 and 256 (note 2) tq51 tqih filter time to recognize high, with digital filter 3 * n * t cy ? ns n = 1, 2, 4, 16, 32, 64, 128 and 256 (note 2) tq55 tqidxr index pulse recognized to position counter reset (ungated index) 3 t cy ?ns note 1: these parameters are characterized but not tested in manufacturing. 2: alignment of index pulses to qea and qeb is shown for position counter reset timing only. shown for forward direction only (qea leads qeb). same timing applies for reverse direction (qea lags qeb), but index pulse recognition occurs on falling edge. qea (input) ungated index qeb (input) tq55 index internal position tq50 tq51
? 2008 microchip technology inc. ds70141e-page 187 dspic30f3010/3011 figure 23-16: spi module master mode (cke = 0 ) timing characteristics table 23-32: spi mast er mode (cke = 0 ) timing requirements ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic (1) min typ max units conditions sp10 tscl sck x output low time (2) t cy /2 ? ? ns sp11 tsch sck x output high time (2) t cy /2 ? ? ns sp20 tscf sck x output fall time (3) ? ? ? ns see parameter do32 sp21 tscr sck x output rise time (3) ? ? ? ns see parameter do31 sp30 tdof sdo x data output fall time (3) ? ? ? ns see parameter do32 sp31 tdor sdo x data output rise time (3) ? ? ? ns see parameter do31 sp35 tsch2dov, tscl2dov sdo x data output valid after sck x edge ? ? 30 ns sp40 tdiv2sch, tdiv2scl setup time of sdi x data input to sck x edge 20 ? ? ns sp41 tsch2dil, ts c l 2 d i l hold time of sdi x data input to sck x edge 20 ? ? ns note 1: these parameters are characterized but not tested in manufacturing. 2: the minimum clock period for sckx is 100 ns. therefore, the clock generated in master mode must not violate this specification. 3: assumes 50 pf load on all spi pins. sckx (ckp = 0 ) sckx (ckp = 1 ) sdox sdix sp11 sp10 sp40 sp41 sp21 sp20 sp35 sp20 sp21 msb lsb bit14 - - - - - -1 lsb in bit14 - - - -1 sp30 sp31 note: refer to figure 23-2 for load conditions. msb in
dspic30f3010/3011 ds70141e-page 188 ? 2008 microchip technology inc. figure 23-17: spi module master mode (cke = 1 ) timing characteristics table 23-33: spi module master mode (cke = 1 ) timing requirements ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic (1) min typ max units conditions sp10 tscl sck x output low time (2) t cy /2 ? ? ns sp11 tsch sck x output high time (2) t cy /2 ? ? ns sp20 tscf sck x output fall time (3) ? ? ? ns see parameter do32 sp21 tscr sck x output rise time (3) ? ? ? ns see parameter do31 sp30 tdof sdo x data output fall time (3) ? ? ? ns see parameter do32 sp31 tdor sdo x data output rise time (3) ? ? ? ns see parameter do31 sp35 tsch2dov, tscl2dov sdo x data output valid after sck x edge ? ? 30 ns sp36 tdov2sc, tdov2scl sdo x data output setup to first sck x edge 30 ? ? ns sp40 tdiv2sch, tdiv2scl setup time of sdi x data input to sck x edge 20 ? ? ns sp41 tsch2dil, ts c l 2 d i l hold time of sdi x data input to sck x edge 20 ? ? ns note 1: these parameters are characterized but not tested in manufacturing. 2: the minimum clock period for sckx is 100 ns. therefore, the clock generated in master mode must not violate this specification. 3: assumes 50 pf load on all spi pins. sck x (ckp = 0 ) sck x (ckp = 1 ) sdo x sdi x sp36 sp30,sp31 sp35 msb msb in bit14 - - - - - -1 lsb in bit14 - - - -1 lsb note: refer to figure 23-2 for load conditions. sp11 sp10 sp20 sp21 sp21 sp20 sp40 sp41
? 2008 microchip technology inc. ds70141e-page 189 dspic30f3010/3011 figure 23-18: spi module slave mode (cke = 0 ) timing characteristics table 23-34: spi module slave mode (cke = 0 ) timing requirements ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic (1) min typ (2) max units conditions sp70 tscl sck x input low time 30 ? ? ns sp71 tsch sck x input high time 30 ? ? ns sp72 tscf sck x input fall time (3) ?1025ns sp73 tscr sck x input rise time (3) ?1025ns sp30 tdof sdo x data output fall time (3) ? ? ? ns see parameter do32 sp31 tdor sdo x data output rise time (3) ? ? ? ns see parameter do31 sp35 tsch2dov, tscl2dov sdo x data output valid after sck x edge ??30ns sp40 tdiv2sch, tdiv2scl setup time of sdi x data input to sck x edge 20 ? ? ns sp41 tsch2dil, tscl2dil hold time of sdi x data input to sck x edge 20 ? ? ns sp50 tssl2sch, tssl2scl ss x to sck x or sck x input 120 ? ? ns sp51 tssh2doz ss x to sdo x output high-impedance (3) 10 ? 50 ns sp52 tsch2ssh tscl2ssh ss x after sckx edge 1.5 t cy + 40 ? ? ns ? note 1: these parameters are characterized but not tested in manufacturing. 2: data in ?typ? column is at 5v, 25c unless otherwise stated. parameters are for design guidance only and are not tested. 3: assumes 50 pf load on all spi pins. ss x sck x (ckp = 0 ) sck x (ckp = 1 ) sdo x sdi sp50 sp40 sp41 sp30,sp31 sp51 sp35 sdi x msb lsb bit14 - - - - - -1 bit14 - - - -1 lsb in sp52 sp73 sp72 sp72 sp73 sp71 sp70 note: refer to figure 23-2 for load conditions. msb in
dspic30f3010/3011 ds70141e-page 190 ? 2008 microchip technology inc. figure 23-19: spi module slave mode (cke = 1 ) timing characteristics ss x sck x (ckp = 0 ) sck x (ckp = 1 ) sdo x sdi sp50 sp60 sdi x sp30,sp31 msb bit14 - - - - - -1 lsb sp51 msb in bit14 - - - -1 lsb in sp35 sp52 sp52 sp73 sp72 sp72 sp73 sp71 sp70 sp40 sp41 note: refer to figure 23-2 for load conditions.
? 2008 microchip technology inc. ds70141e-page 191 dspic30f3010/3011 table 23-35: spi module slave mode (cke = 1 ) timing requirements ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic (1) min typ (2) max units conditions sp70 tscl sck x input low time 30 ? ? ns sp71 tsch sck x input high time 30 ? ? ns sp72 tscf sck x input fall time (3) ?1025ns sp73 tscr sck x input rise time (3) ?1025ns sp30 tdof sdo x data output fall time (3) ? ? ? ns see parameter do32 sp31 tdor sdo x data output rise time (3) ? ? ? ns see parameter do31 sp35 tsch2dov, tscl2dov sdo x data output valid after sck x edge ??30ns sp40 tdiv2sch, tdiv2scl setup time of sdi x data input to sck x edge 20 ? ? ns sp41 tsch2dil, tscl2dil hold time of sdi x data input to sck x edge 20 ? ? ns sp50 tssl2sch, tssl2scl ss x to sck x or sck x input 120 ? ? ns sp51 tssh2doz ss x to sdo x output high-impedance (4) 10 ? 50 ns sp52 tsch2ssh tscl2ssh ss x after sck x edge 1.5 t cy + 40 ? ? ns sp60 tssl2dov sdo x data output valid after ss x edge ??50ns note 1: these parameters are characterized but not tested in manufacturing. 2: data in ?typ? column is at 5v, 25c unless otherwise stated. parameters are for design guidance only and are not tested. 3: the minimum clock period for scx is 100 ns. therefore, the clock generated in master mode must not violate this specification. 4: assumes 50 pf load on all spi pins.
dspic30f3010/3011 ds70141e-page 192 ? 2008 microchip technology inc. figure 23-20: i 2 c? bus start/stop bits timing characteristics (master mode) figure 23-21: i 2 c? bus data timing characteristics (master mode) im31 im34 scl sda start condition stop condition im30 im33 note: refer to figure 23-2 for load conditions. im11 im10 im33 im11 im10 im20 im26 im25 im40 im40 im45 im21 scl sda in sda out note: refer to figure 23-2 for load conditions.
? 2008 microchip technology inc. ds70141e-page 193 dspic30f3010/3011 ) table 23-36: i 2 c? bus data timing requirements (master mode) ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic min (1) max units conditions im10 t lo : scl clock low time 100 khz mode t cy /2 (brg + 1) ? s 400 khz mode t cy /2 (brg + 1) ? s 1 mhz mode (2) t cy /2 (brg + 1) ? s im11 t hi : scl clock high time 100 khz mode t cy /2 (brg + 1) ? s 400 khz mode t cy /2 (brg + 1) ? s 1 mhz mode (2) t cy /2 (brg + 1) ? s im20 t f : scl sda and scl fall time 100 khz mode ? 300 ns c b is specified to be from 10 to 400 pf 400 khz mode 20 + 0.1 c b 300 ns 1 mhz mode (2) ? 100 ns im21 t r : scl sda and scl rise time 100 khz mode ? 1000 ns c b is specified to be from 10 to 400 pf 400 khz mode 20 + 0.1 c b 300 ns 1 mhz mode (2) ? 300 ns im25 t su : dat data input setup time 100 khz mode 250 ? ns 400 khz mode 100 ? ns 1 mhz mode (2) ? ? ns im26 t hd : dat data input hold time 100 khz mode 0 ? ns 400 khz mode 0 0.9 s 1 mhz mode (2) ? ? ns im30 t su : sta start condition setup time 100 khz mode t cy /2 (brg + 1) ? s only relevant for repeated start condition 400 khz mode t cy /2 (brg + 1) ? s 1 mhz mode (2) t cy /2 (brg + 1) ? s im31 t hd : sta start condition hold time 100 khz mode t cy /2 (brg + 1) ? s after this period the first clock pulse is generated 400 khz mode t cy /2 (brg + 1) ? s 1 mhz mode (2) t cy /2 (brg + 1) ? s im33 t su : sto stop condition setup time 100 khz mode t cy /2 (brg + 1) ? s 400 khz mode t cy /2 (brg + 1) ? s 1 mhz mode (2) t cy /2 (brg + 1) ? s im34 t hd : sto stop condition 100 khz mode t cy /2 (brg + 1) ? ns hold time 400 khz mode t cy /2 (brg + 1) ? ns 1 mhz mode (2) t cy /2 (brg + 1) ? ns im40 t aa : scl output valid from clock 100 khz mode ? 3500 ns 400 khz mode ? 1000 ns 1 mhz mode (2) ??ns im45 t bf : sda bus free time 100 khz mode 4.7 ? s time the bus must be free before a new transmission can start 400 khz mode 1.3 ? s 1 mhz mode (2) ?? s im50 c b bus capacitive loading ? 400 pf note 1: brg is the value of the i 2 c? baud rate generator. refer to section 21. ?inter-integrated circuit (i 2 c)? in the ?dspic30f family reference manual? (ds70046) . 2: maximum pin capacitance = 10 pf for all i 2 c pins (for 1 mhz mode only).
dspic30f3010/3011 ds70141e-page 194 ? 2008 microchip technology inc. figure 23-22: i 2 c? bus start/stop bits timing characteristics (slave mode) figure 23-23: i 2 c? bus data timing characteristics (slave mode) table 23-37: i 2 c? bus data timing requirements (slave mode) ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic min max units conditions is10 t lo : scl clock low time 100 khz mode 4.7 ? s device must operate at a minimum of 1.5 mhz 400 khz mode 1.3 ? s device must operate at a minimum of 10 mhz. 1 mhz mode (1) 0.5 ? s is11 t hi : scl clock high time 100 khz mode 4.0 ? s device must operate at a minimum of 1.5 mhz 400 khz mode 0.6 ? s device must operate at a minimum of 10 mhz 1 mhz mode (1) 0.5 ? s is20 t f : scl sda and scl fall time 100 khz mode ? 300 ns c b is specified to be from 10 to 400 pf 400 khz mode 20 + 0.1 c b 300 ns 1 mhz mode (1) ? 100 ns is21 t r : scl sda and scl rise time 100 khz mode ? 1000 ns c b is specified to be from 10 to 400 pf 400 khz mode 20 + 0.1 c b 300 ns 1 mhz mode (1) ? 300 ns note 1: maximum pin capacitance = 10 pf for all i 2 c? pins (for 1 mhz mode only). is31 is34 scl sda start condition stop condition is30 is33 is30 is31 is33 is11 is10 is20 is26 is25 is40 is40 is45 is21 scl sda in sda out
? 2008 microchip technology inc. ds70141e-page 195 dspic30f3010/3011 is25 t su : dat data input setup time 100 khz mode 250 ? ns 400 khz mode 100 ? ns 1 mhz mode (1) 100 ? ns is26 t hd : dat data input hold time 100 khz mode 0 ? ns 400 khz mode 0 0.9 s 1 mhz mode (1) 00.3 s is30 t su : sta start condition setup time 100 khz mode 4.7 ? s only relevant for repeated start condition 400 khz mode 0.6 ? s 1 mhz mode (1) 0.25 ? s is31 t hd : sta start condition hold time 100 khz mode 4.0 ? s after this period the first clock pulse is generated 400 khz mode 0.6 ? s 1 mhz mode (1) 0.25 ? s is33 t su : sto stop condition setup time 100 khz mode 4.7 ? s 400 khz mode 0.6 ? s 1 mhz mode (1) 0.6 ? s is34 t hd : sto stop condition 100 khz mode 4000 ? ns hold time 400 khz mode 600 ? ns 1 mhz mode (1) 250 ns is40 t aa : scl output valid from clock 100 khz mode 0 3500 ns 400 khz mode 0 1000 ns 1 mhz mode (1) 0 350 ns is45 t bf : sda bus free time 100 khz mode 4.7 ? s time the bus must be free before a new transmission can start 400 khz mode 1.3 ? s 1 mhz mode (1) 0.5 ? s is50 c b bus capacitive loading ? 400pf table 23-37: i 2 c? bus data timing requirements (slave mode) (continued) ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic min max units conditions note 1: maximum pin capacitance = 10 pf for all i 2 c? pins (for 1 mhz mode only).
dspic30f3010/3011 ds70141e-page 196 ? 2008 microchip technology inc. table 23-38: 10-bit high-spe ed adc module specifications ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic (1) min. typ max. units conditions device supply ad01 av dd module v dd supply greater of v dd ? 0.3 or 2.7 ? lesser of v dd + 0.3 or 5.5 v ad02 av ss module v ss supply v ss ? 0.3 ? v ss + 0.3 v reference inputs ad05 v refh reference voltage high av ss + 2.7 ? av dd v ad06 v refl reference voltage low av ss ?av dd ? 2.7 v ad07 v ref absolute reference voltage av ss ? 0.3 ? av dd + 0.3 v ad08 i ref current drain ? 200 .001 300 3 a a a/d operating a/d off analog input ad10 v inh -v inl full-scale input span v refl v refh v ad12 ? leakage current ? 0.001 0.244 av inl = av ss = v refl = 0v, av dd = v refh = 5v source impedance = 5 k ad13 ? leakage current ? 0.001 0.244 av inl = av ss = v refl = 0v, av dd = v refh = 3v source impedance = 5 k ad17 r in recommended impedance of analog voltage source ??5k dc accuracy (2) ad20 nr resolution 10 data bits bits ad21 inl integral nonlinearity ? 1 1 lsb v inl = av ss = v refl = 0v, av dd = v refh = 5v ad21a inl integral nonlinearity ? 1 1 lsb v inl = av ss = v refl = 0v, av dd = v refh = 3v ad22 dnl differential nonlinearity ? 1 1 lsb v inl = av ss = v refl = 0v, av dd = v refh = 5v ad22a dnl differential nonlinearity ? 1 1 lsb v inl = av ss = v refl = 0v, av dd = v refh = 3v ad23 g err gain error + 156lsbv inl = av ss = v refl = 0v, av dd = v refh = 5v ad23a g err gain error + 156lsbv inl = av ss = v refl = 0v, av dd = v refh = 3v note 1: these parameters are characterized but not tested in manufacturing. 2: measurements taken with external v ref + and v ref - used as the adc voltage references. 3: the a/d conversion result never decreases with an increase in the input voltage, and has no missing codes.
? 2008 microchip technology inc. ds70141e-page 197 dspic30f3010/3011 ad24 e off offset error (2) 1 2 3 lsb v inl = av ss = v refl = 0v, av dd = v refh = 5v ad24a e off offset error (2) 1 2 3 lsb v inl = av ss = v refl = 0v, av dd = v refh = 3v ad25 ? monotonicity (3) ? ? ? ? guaranteed dynamic performance ad30 thd total harmonic distortion ? -64 -67 db ad31 sinad signal to noise and distortion ?5758db ad32 sfdr spurious free dynamic range ?6771db ad33 f nyq input signal bandwidth ? ? 500 khz ad34 enob effective number of bits 9.29 9.41 ? bits table 23-38: 10-bit high-speed adc module specifications (continued) ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic (1) min. typ max. units conditions note 1: these parameters are characterized but not tested in manufacturing. 2: measurements taken with external v ref + and v ref - used as the adc voltage references. 3: the a/d conversion result never decreases with an increase in the input voltage, and has no missing codes.
dspic30f3010/3011 ds70141e-page 198 ? 2008 microchip technology inc. figure 23-24: 10-bit high-speed adc timing characteristics (chps = 01 , simsam = 0 , asam = 0 , ssrc = 000 ) ad55 t samp clear samp set samp ad61 adclk instruction samp ch0_dischrg ch1_samp ad60 done adif adres( 0 ) adres( 1 ) 1 2 3 4 5 6 8 5 6 7 1 ? software sets adcon. samp to start sampling. 2 ? sampling starts after discharge period. 3 ? software clears adcon. samp to start conversion. 4 ? sampling ends, conversion sequence starts. 5 ? convert bit 9. 9 ? one t ad for end of conversion. ad50 ch0_samp ch1_dischrg eoc 7 ad55 8 6 ? convert bit 8. 8 ? convert bit 0. execution t samp is described in section 17, ?10-bit a/d converter? of the ?dspic30f family reference manual?, (ds70046).
? 2008 microchip technology inc. ds70141e-page 199 dspic30f3010/3011 figure 23-25: 10-bit high-speed adc timing characteristics (chps = 01 , simsam = 0 , asam = 1 , ssrc = 111 , samc = 00001 ) ad55 t samp set adon adclk instruction samp ch0_dischrg ch1_samp done adif adres( 0 ) adres( 1 ) 1 2 3 4 5 6 4 5 6 8 1 ? software sets adcon. adon to start ad operation. 2 ? sampling starts after discharge period. 3 ? convert bit 9. 4 ? convert bit 8. 5 ? convert bit 0. ad50 ch0_samp ch1_dischrg eoc 7 3 ad55 6 ? one t ad for end of conversion. 7 ? begin conversion of next channel 8 ? sample for time specified by samc. t samp t conv 3 4 execution t samp is described in section 17. ?10-bit a/d converter? of the ?dspic30f family reference manual? (ds70046). t samp is described in section 17. ?10-bit reference manual? (ds70046). a/d converter? of the ?dspic30f family
dspic30f3010/3011 ds70141e-page 200 ? 2008 microchip technology inc. table 23-39: 10-bit high-speed a/d conversion timing requirements ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic min. typ max. units conditions clock parameters ad50 t ad a/d clock period 84 ? ? ns see table 20-2 (1) ad51 t rc a/d internal rc oscillator period 700 900 1100 ns conversion rate ad55 t conv conversion time ? 12 t ad ?? ad56 f cnv throughput rate ? 1.0 ? msps see table 20-2 (1) ad57 t samp sample time 1 t ad ???see table 20-2 (1) timing parameters ad60 t pcs conversion start from sample trigger ?1.0 t ad ?? ad61 t pss sample start from setting sample (samp) bit 0.5 t ad ? 1.5 t ad ? ad62 t css conversion completion to sample start (asam = 1 ) ?0.5 t ad ?? ad63 t dpu (2) time to stabilize analog stage from a/d off to a/d on ??20 s note 1: because the sample caps will eventually lose charge, clock periods above 100 sec can affect linearity performance, especially at elevated temperatures. 2: t dpu is the time required for the adc module to stabilize when it is turned on (adcon1 = 1 ). during this time the adc result is indeterminate.
? 2008 microchip technology inc. ds70141e-page 201 dspic30f3010/3011 24.0 packaging information 24.1 package marking information 28-lead pdip (skinny dip) xxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxx yywwnnn example dspic30f3010 0810017 28-lead soic xxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx yywwnnn example dspic30f3010 0810017 xxxxxxxxxx 44-lead qfn xxxxxxxxxx xxxxxxxxxx yywwnnn dspic example 0810017 30i/ml example dspic30f3011 0810017 40-lead pdip xxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxx yywwnnn 30i/sp 3 e 3 e 3 e 3 e 30i/so 30f3011 30i/p legend: xx...x customer-specific information y year code (last digit of calendar year) yy year code (last 2 digits of calendar year) ww week code (week of january 1 is week ?01?) nnn alphanumeric traceability code pb-free jedec designator for matte tin (sn) * this package is pb-free. the pb-free jedec designator ( ) can be found on the outer packaging for this package. note : in the event the full microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e
dspic30f3010/3011 ds70141e-page 202 ? 2008 microchip technology inc. package marking information (continued) 44-lead tqfp xxxxxxxxxx xxxxxxxxxx xxxxxxxxxx yywwnnn example xxxxxxxxxx 44-lead qfn xxxxxxxxxx xxxxxxxxxx yywwnnn example dspic 0810017 30i/pt 30f3011 3 e dspic 0810017 30i/ml 30f3011 3 e
? 2008 microchip technology inc. ds70141e-page 203 dspic30f3010/3011 24.2 package details 
       
      
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dspic30f3010/3011 ds70141e-page 212 ? 2008 microchip technology inc. notes:
? 2008 microchip technology inc. ds70141e-page 213 dspic30f3010/3011 appendix a: revision history revision b (may 2006) previous versions of this data sheet contained advance or preliminary information. they were distributed with incomplete characterization data. this revision reflects these updates: ? supported i 2 c slave addresses (see table 17-1) ? adc conversion clock selection to allow 1 msps operation (see section 19.0 ?10-bit high-speed analog-to-digital converter (adc) module? ) ? operating current (i dd ) specifications (see table 23-5) ? power-down current (i pd ) (see table 23-7) ? i/o pin input specifications (see table 23-8) ? bor voltage limits (see table 23-10) ? watchdog timer time-out limits (see table 23-20) revision c (september 2006) updates made to section 23.0 ?electrical characteristics? . revision d (january 2007) this revision includes updates to the packaging diagrams. revision e (april 2008) this revision reflects these updates: ? added osctun register information and updated the osccon register information (removed tun bits) in system integration register map (see table 20-7) ? changed the location of the input reference in the 10-bit high-speed adc functional block diagram (see figure 19-1) ? added fuse configuration register (ficd) details (see section 20.6 ?device configuration registers? and table 20-8) ? added note 2 in device configuration registers table (table 20-8) ? updated fosc register bit definition in device configuration registers table (table 20-8) ? electrical specifications: - updated values for parameters do10, do16, do20, and do26 (see table 23-9) - 10-bit high-speed adc t pdu timing parame- ter (time to stabilize) has been updated from 20 s typical to 20 s maximum (see table 23-39) - parameter os65 (internal rc accuracy) has been expanded to reflect multiple min and max values for different temperatures (see table 23-18) - parameter dc12 (ram data retention volt- age) has been updated to include a min value (see table 23-4) - parameter d134 (erase/write cycle time) has been updated to include min and max values and the typ value has been removed (see table 23-11) - removed parameters os62 (internal frc jitter) and os64 (internal frc drift) and note 2 from ac characteristics (see table 23-17) - parameter os63 (internal frc accuracy) has been expanded to reflect multiple min and max values for different temperatures (see table 23-17) - updated min and max values and conditions for parameter sy11 and updated min, typ, and max values and conditions for parameter sy20 (see table 23-20) ? additional minor corrections throughout the document
dspic30f3010/3011 ds70141e-page 214 ? 2008 microchip technology inc. notes:
? 2008 microchip technology inc. ds70141e-page 215 dspic30f3010/3011 index a a/d 1 msps configuration guideline................................ 130 600 ksps configuration guideline ............................. 131 conversion rate parameters.................................... 129 selecting the conversion clock ................................ 128 voltage reference schematic .................................. 130 ac characteristics ............................................................ 171 load conditions ........................................................ 171 ac temperature and voltage specifications .................... 171 adc 750 ksps configuration guideline ............................. 131 conversion speeds................................................... 129 address generator units .................................................... 35 alternate 16-bit timer/counter ........................................... 89 alternate vector table ........................................................ 45 assembler mpasm assembler................................................... 160 automatic clock stretch.................................................... 112 during 10-bit addressing (stren = 1) .................... 112 during 7-bit addressing (stren = 1) ...................... 112 receive mode ........................................................... 112 transmit mode .......................................................... 112 b band gap start-up time requirements............................................................ 178 timing characteristics .............................................. 178 barrel shifter ....................................................................... 22 bit-reversed addressing .................................................... 38 example ...................................................................... 38 implementation ........................................................... 38 modifier values (table) ................................................ 39 sequence table (16-entry)......................................... 39 block diagrams 10-bit high-speed adc functional .......................... 126 16-bit timer1 module.................................................. 66 16-bit timer4 .............................................................. 76 16-bit timer5 .............................................................. 77 32-bit timer4/5 ........................................................... 75 dedicated port structure............................................. 59 dsp engine ................................................................ 19 dspic30f3010 .............................................................. 9 dspic30f3011 .............................................................. 8 external power-on reset circuit............................... 145 i 2 c............................................................................. 110 input capture mode .................................................... 79 oscillator system ...................................................... 139 output compare mode ............................................... 83 pwm module .............................................................. 94 quadrature encoder interface .................................... 87 reset system............................................................ 143 shared port structure ................................................. 60 spi ............................................................................ 106 spi master/slave connection ................................... 106 uart receiver ......................................................... 118 uart transmitter ..................................................... 117 bor characteristics ......................................................... 170 bor. see brown-out reset. brown-out reset timing requirements................................................ 177 brown-out reset (bor) .................................................... 137 c c compilers mplab c18 .............................................................. 160 mplab c30 .............................................................. 160 center-aligned pwm .......................................................... 97 clkout and i/o timing characteristics.......................................................... 176 requirements ........................................................... 176 code examples data eeprom block erase ....................................... 54 data eeprom block write ........................................ 56 data eeprom read.................................................. 53 data eeprom word erase ....................................... 54 data eeprom word write ........................................ 55 erasing a row of program memory ........................... 49 initiating a programming sequence ........................... 50 loading write latches ................................................ 50 code protection ................................................................ 137 complementary pwm operation........................................ 98 configuring analog port pins.............................................. 60 control registers ................................................................ 48 nvmadr .................................................................... 48 nvmadru ................................................................. 48 nvmcon.................................................................... 48 nvmkey .................................................................... 48 core overview .................................................................... 15 core register map.............................................................. 31 customer change notification service............................. 220 customer notification service .......................................... 220 customer support............................................................. 220 d data access from program memory using program space visibility............................................. 26 data accumulators and adder/subtracter .......................... 20 overflow and saturation ............................................. 20 data accumulators and adder/subtracter data space write saturation ...................................... 22 round logic ............................................................... 21 write back .................................................................. 21 data address space........................................................... 27 alignment.................................................................... 30 alignment (figure) ...................................................... 30 effect of invalid memory accesses............................. 30 mcu and dsp (mac class) instructions example .......................................... 29 memory map......................................................... 27, 28 near data space ........................................................ 31 software stack ........................................................... 31 spaces........................................................................ 30 width .......................................................................... 30 data eeprom memory...................................................... 53 erasing ....................................................................... 54 erasing, block............................................................. 54 erasing, word ............................................................. 54 protection against spurious write .............................. 57 reading ...................................................................... 53 write verify ................................................................. 57 writing ........................................................................ 55 writing, block.............................................................. 56 writing, word.............................................................. 55
dspic30f3010/3011 ds70141e-page 216 ? 2008 microchip technology inc. dc characteristics ............................................................ 163 bor .......................................................................... 170 brown-out reset ....................................................... 169 i/o pin output specifications .................................... 169 idle current (i idle ) .................................................... 166 operating current (i dd )............................................. 165 power-down current (i pd ) ........................................ 167 program and eeprom............................................. 170 temperature and voltage specifications .................. 163 dead-time generators ....................................................... 98 ranges........................................................................ 98 development support ....................................................... 159 device configuration register map............................................................. 150 device configuration registers......................................... 148 fborpor ................................................................ 148 fgs........................................................................... 148 fosc ........................................................................ 148 fwdt........................................................................ 148 device overview ................................................................... 7 divide support..................................................................... 18 dsp engine......................................................................... 18 multiplier...................................................................... 20 dspic30f3010 port register map................................... 61 dspic30f3011 port register map................................... 62 dual output compare match mode .................................... 84 continuous pulse mode .............................................. 84 single pulse mode ...................................................... 84 e edge-aligned pwm............................................................. 97 electrical characteristics................................................... 163 ac ............................................................................. 171 dc ............................................................................. 163 equations a/d conversion clock ............................................... 128 baud rate ................................................................. 121 pwm period ................................................................ 96 pwm resolution ......................................................... 96 serial clock rate ...................................................... 114 errata .................................................................................... 6 exception processing interrupt priority .......................................................... 42 exception sequence trap sources .............................................................. 43 external clock timing characteristics timer1, 2, 3, 4, 5 ....................................................... 179 external clock timing requirements................................ 172 timer1 ....................................................................... 179 timer2 and timer 4................................................... 180 timer3 and timer5.................................................... 180 external interrupt requests ................................................ 45 f fast context saving............................................................ 45 flash program memory....................................................... 47 in-circuit serial programming (icsp) ......................... 47 run-time self-programming (rtsp) ......................... 47 table instruction operation summary ........................ 47 i i/o pin specifications output ....................................................................... 169 i/o ports .............................................................................. 59 parallel i/o (pio)......................................................... 59 i 2 c 10-bit slave mode operation ..................................... 111 reception ................................................................. 112 transmission ............................................................ 112 i 2 c 7-bit slave mode operation ....................................... 111 reception ................................................................. 111 transmission ............................................................ 111 i 2 c master mode baud rate generator ............................................... 114 clock arbitration ....................................................... 114 multi-master communication, bus collision and bus arbitration ........................................... 114 reception ................................................................. 114 transmission ............................................................ 113 i 2 c module addresses................................................................. 111 bus data timing characteristics master mode..................................................... 192 slave mode....................................................... 194 bus data timing requirements master mode..................................................... 193 slave mode....................................................... 194 bus start/stop bits timing characteristics master mode..................................................... 192 slave mode....................................................... 194 general call address support .................................. 113 interrupts .................................................................. 113 ipmi support............................................................. 113 master operation ...................................................... 113 master support ......................................................... 113 operating function description ................................ 109 operation during cpu sleep and idle modes .......... 114 pin configuration ...................................................... 109 programmer?s model ................................................ 109 register map ............................................................ 115 registers .................................................................. 109 slope control ............................................................ 113 software controlled clock stretching (stren = 1) ..................................................... 112 various modes.......................................................... 109 idle current (i idle ) ............................................................ 166 in-circuit serial programming (icsp)............................... 137 independent pwm output ................................................ 100 initialization condition for rcon register case 1 ........................................................ 146 initialization condition for rcon register case 2 ........................................................ 146 input capture (capx) timing characteristics................... 182 input capture interrupts...................................................... 81 register map .............................................................. 82 input capture module ......................................................... 79 in cpu sleep mode .................................................... 80 simple capture event mode....................................... 80 input capture timing requirements................................. 182 input change notification module....................................... 63 register map (bits 7-0)............................................... 63 instruction addressing modes ............................................ 35 file register instructions ............................................ 35 fundamental modes supported ................................. 35 mac instructions ........................................................ 36 mcu instructions ........................................................ 35 move and accumulator instructions............................ 36 other instructions ....................................................... 36 instruction set overview ................................................... 154 instruction set summary .................................................. 151 internal clock timing examples ....................................... 174
? 2008 microchip technology inc. ds70141e-page 217 dspic30f3010/3011 internet address................................................................ 220 interrupt controller register map............................................................... 46 interrupt priority traps........................................................................... 43 interrupt sequence ............................................................. 45 interrupt stack frame ................................................. 45 interrupts............................................................................. 41 l load conditions ................................................................ 171 m memory organization.......................................................... 23 microchip internet web site .............................................. 220 modulo addressing ............................................................. 36 applicability ................................................................. 38 operation example ..................................................... 37 start and end address................................................ 37 w address register selection .................................... 37 motor control pwm module................................................ 93 fault timing characteristics ..................................... 184 timing characteristics .............................................. 184 timing requirements................................................ 184 mplab asm30 assembler, linker, librarian ................... 160 mplab icd 2 in-circuit debugger ................................... 161 mplab ice 2000 high-performance universal in-circuit emulator .................................... 161 mplab integrated development environment software............................................... 159 mplab pm3 device programmer .................................... 161 mplab real ice in-circuit emulator system................. 161 mplink object linker/mplib object librarian ................ 160 o ocx/pwm module timing characteristics........................ 183 operating current (i dd )..................................................... 165 oscillator operating modes (table) .......................................... 138 oscillator configurations ................................................... 140 fail-safe clock monitor............................................. 142 fast rc (frc) .......................................................... 141 initial clock source selection ................................... 140 low-power rc (lprc)............................................. 141 lp oscillator control ................................................. 141 phase locked loop (pll) ........................................ 141 start-up timer (ost) ................................................ 140 oscillator selection ........................................................... 137 oscillator start-up timer timing characteristics .............................................. 177 timing requirements................................................ 177 output compare interrupts ................................................. 85 output compare mode register map............................................................... 86 output compare module..................................................... 83 timing characteristics .............................................. 182 timing requirements................................................ 182 output compare operation during cpu idle mode............................................................ 85 output compare sleep mode operation ............................ 85 p packaging ......................................................................... 201 details ....................................................................... 203 marking ..................................................................... 201 picstart plus development programmer ..................... 162 pinout descriptions dspic30f3010............................................................ 12 dspic30f3011............................................................ 10 pll clock timing specifications ...................................... 173 por. see power-on reset. port write/read example ................................................... 60 position measurement mode .............................................. 89 power-down current (i pd )................................................ 167 power-on reset (por)..................................................... 137 oscillator start-up timer (ost)................................ 137 power-up timer (pwrt) .......................................... 137 power-saving modes........................................................ 147 idle............................................................................ 148 sleep ........................................................................ 147 power-saving modes (sleep and idle) ............................. 137 power-up timer timing characteristics .............................................. 177 timing requirements ............................................... 177 program address space..................................................... 23 construction ............................................................... 24 data access from program memory using table instructions ..................................... 25 data access from, address generation ..................... 24 memory map............................................................... 23 table instructions tblrdh ............................................................. 25 tblrdl.............................................................. 25 tblwth............................................................. 25 tblwtl ............................................................. 25 program and eeprom characteristics............................ 170 program counter ................................................................ 16 program data table access............................................... 26 program space visibility window into program space operation ..................... 27 programmable .................................................................. 137 programmable digital noise filters .................................... 89 programmer?s model .......................................................... 16 diagram ...................................................................... 17 programming operations.................................................... 49 algorithm for program flash....................................... 49 erasing a row of program memory ........................... 49 initiating the programming sequence ........................ 50 loading write latches ................................................ 50 pwm register map ............................................................ 103 pwm duty cycle comparison units ................................... 97 duty cycle register buffers ....................................... 97 pwm fault pins ................................................................ 101 enable bits ............................................................... 101 fault states .............................................................. 101 modes....................................................................... 101 cycle-by-cycle ................................................. 101 latched............................................................. 101 pwm operation during cpu idle mode ........................... 102 pwm operation during cpu sleep mode........................ 102 pwm output and polarity control..................................... 101 output pin control .................................................... 101 pwm output override ...................................................... 100 complementary output mode .................................. 100 synchronization ........................................................ 100 pwm period........................................................................ 96 pwm special event trigger.............................................. 102 postscaler................................................................. 102
dspic30f3010/3011 ds70141e-page 218 ? 2008 microchip technology inc. pwm time base ................................................................. 95 continuous up/down count modes............................ 95 double-update mode .................................................. 96 free-running mode .................................................... 95 postscaler ................................................................... 96 prescaler..................................................................... 96 single-shot mode ....................................................... 95 pwm update lockout ....................................................... 102 q qea/qeb input characteristics ........................................ 185 qei module external clock timing requirements........................ 181 index pulse timing characteristics........................... 186 index pulse timing requirements ............................ 186 operation during cpu idle mode ............................... 90 operation during cpu sleep mode ............................ 89 register map............................................................... 91 timer operation during cpu idle mode ..................... 90 timer operation during cpu sleep mode.................. 89 quadrature decoder timing requirements ...................... 185 quadrature encoder interface (qei) module ...................... 87 quadrature encoder interface interrupts ............................ 90 quadrature encoder interface logic ................................... 88 r reader response ............................................................. 221 reset......................................................................... 137, 143 reset sequence.................................................................. 43 reset sources ............................................................ 43 reset timing characteristics ............................................ 177 reset timing requirements.............................................. 177 resets bor, programmable................................................. 145 por .......................................................................... 143 por with long crystal start-up time ....................... 145 por, operating without fscm and pwrt .............. 145 revision history ................................................................ 213 s simple capture event mode capture buffer operation ............................................ 80 capture prescaler ....................................................... 80 hall sensor mode ....................................................... 80 input capture in cpu idle mode ................................. 81 timer2 and timer3 selection mode ............................ 80 simple ocx/pwm mode timing requirements ................ 183 simple output compare match mode................................. 84 simple pwm mode ............................................................. 84 input pin fault protection............................................ 84 period.......................................................................... 85 single pulse pwm operation............................................ 100 software simulator (mplab sim)..................................... 160 software stack pointer, frame pointer............................... 16 call stack frame...................................................... 31 spi mode slave select synchronization ................................... 107 spi1 register map .................................................... 108 spi module........................................................................ 105 framed spi support ................................................. 106 operating function description ................................ 105 sdox disable ........................................................... 105 timing characteristics master mode (cke = 0) .................................... 187 master mode (cke = 1) .................................... 188 slave mode (cke = 1) .............................. 189, 190 timing requirements master mode (cke = 0).................................... 187 master mode (cke = 1).................................... 188 slave mode (cke = 0)...................................... 189 slave mode (cke = 1)...................................... 191 word and byte communication ................................ 105 spi operation during cpu idle mode .............................. 107 spi operation during cpu sleep mode........................... 107 status register ............................................................... 16 symbols used in opcode descriptions ............................ 152 system integration............................................................ 137 overview................................................................... 137 register map ............................................................ 150 t temperature and voltage specifications ac............................................................................. 171 dc ............................................................................ 163 timer1 module.................................................................... 65 16-bit asynchronous counter mode........................... 65 16-bit synchronous counter mode............................. 65 16-bit timer mode ...................................................... 65 gate operation ........................................................... 66 interrupt ...................................................................... 67 operation during sleep mode .................................... 66 prescaler .................................................................... 66 real-time clock ......................................................... 67 rtc interrupts .................................................... 67 rtc oscillator operation ................................... 67 register map .............................................................. 68 timer2 and timer3 selection mode.................................... 84 timer2/3 module................................................................. 69 32-bit synchronous counter mode............................. 69 32-bit timer mode ...................................................... 69 adc event trigger...................................................... 72 gate operation ........................................................... 72 interrupt ...................................................................... 72 operation during sleep mode .................................... 72 register map .............................................................. 73 timer prescaler .......................................................... 72 timer4/5 module................................................................. 75 register map .............................................................. 78 timerq (qei module) external clock timing characteristics .............................................. 181 timing characteristics spi module slave mode (cke = 0)...................................... 189 timing diagrams a/d conversion 10-bit high-speed (chps = 01, simsam = 0, asam = 1, ssrc = 111, samc = 00001)........................................ 199 adc conversion 10-bit high-speed (chps = 01, simsam = 0, asam = 0, ssrc = 000) ............................................ 198 band gap start-up time........................................... 178 center aligned pwm .................................................. 97 clkout and i/o ...................................................... 176 dead time .................................................................. 99 edge-aligned pwm .................................................... 97 external clock........................................................... 171 i 2 c bus data master mode..................................................... 192 slave mode....................................................... 194
? 2008 microchip technology inc. ds70141e-page 219 dspic30f3010/3011 i 2 c bus start/stop bits master mode ..................................................... 192 slave mode ....................................................... 194 input capture (capx)................................................ 182 motor control pwm module...................................... 184 motor control pwm module fault............................. 184 ocx/pwm module .................................................... 183 oscillator start-up timer ........................................... 177 output compare module........................................... 182 pwm output ............................................................... 85 qea/qeb inputs ....................................................... 185 qei module index pulse ........................................... 186 reset......................................................................... 177 spi module master mode (cke = 0) .................................... 187 master mode (cke = 1) .................................... 188 slave mode (cke = 1) ...................................... 190 time-out sequence on power-up (mclr not tied to v dd ), case 1...................... 144 time-out sequence on power-up (mclr not tied to v dd ), case 2...................... 144 time-out sequence on power-up (mclr tied to v dd ).......................................... 144 timer1, 2, 3, 4, 5 external clock............................... 179 timerq (qei module) external clock ....................... 181 timing diagrams and specifications dc characteristics - internal rc accuracy ..................................................... 174 timing diagrams.see timing characteristics. timing requirements a/d conversion 10-bit high-speed ............................................ 200 band gap start-up time ........................................... 178 brown-out reset ....................................................... 177 clkout and i/o....................................................... 176 external clock........................................................... 172 i 2 c bus data (master mode)..................................... 193 i 2 c bus data (slave mode)....................................... 194 input capture ............................................................ 182 motor control pwm module...................................... 184 oscillator start-up timer ........................................... 177 output compare module........................................... 182 power-up timer ........................................................ 177 qei module external clock................................................... 181 index pulse ....................................................... 186 quadrature decoder ................................................. 185 reset......................................................................... 177 simple ocx/pwm mode ........................................... 183 spi module master mode (cke = 0) .................................... 187 master mode (cke = 1) .................................... 188 slave mode (cke = 0) ...................................... 189 slave mode (cke = 1) ...................................... 191 timer1 external clock............................................... 179 timer3 and timer5 external clock ........................... 180 watchdog timer........................................................ 177 timing specifications pll clock.................................................................. 173 trap vectors ....................................................................... 44 u uart address detect mode ............................................... 121 auto baud support ................................................... 122 baud rate generator ............................................... 121 enabling and setting up uart ................................ 119 alternate i/o ..................................................... 119 disabling........................................................... 119 enabling ........................................................... 119 setting up data, parity and stop bit selections ................................... 119 loopback mode ........................................................ 121 module overview...................................................... 117 operation during cpu sleep and idle modes.......... 122 receiving data ......................................................... 120 in 8-bit or 9-bit data mode ............................... 120 interrupt ............................................................ 120 receive buffer (uxrxb)................................... 120 reception error handling ......................................... 120 framing error (ferr) ...................................... 121 idle status ........................................................ 121 parity error (perr) .......................................... 121 receive break .................................................. 121 receive buffer overrun error (oerr bit) ............................................... 120 transmitting data ..................................................... 119 in 8-bit data mode............................................ 119 in 9-bit data mode............................................ 119 interrupt ............................................................ 120 transmit buffer (uxtxb) .................................. 119 uart1 register map ............................................... 123 uart2 register map ............................................... 123 unit id locations .............................................................. 137 universal asynchronous receiver transmitter module (uart) ..................................... 117 w wake-up from sleep ......................................................... 137 wake-up from sleep and idle ............................................. 45 watchdog timer timing characteristics .............................................. 177 timing requirements ............................................... 177 watchdog timer (wdt)............................................ 137, 147 enabling and disabling............................................. 147 operation.................................................................. 147 www address ................................................................. 220 www, on-line support ..................... .................................. 6
dspic30f3010/3011 ds70141e-page 220 ? 2008 microchip technology inc. notes:
? 2008 microchip technology inc. ds70141e-page 221 dspic30f3010/3011 the microchip web site microchip provides online support via our www site at www.microchip.com. this web site is used as a means to make files and information easily available to customers. accessible by using your favorite internet browser, the web site contains the following information: ? product support ? data sheets and errata, application notes and sample programs, design resources, user?s guides and hardware support documents, latest software releases and archived software ? general technical support ? frequently asked questions (faq), technical support requests, online discussion groups, microchip consultant program member listing ? business of microchip ? product selector and ordering guides, latest microchip press releases, listing of seminars and events, listings of microchip sales offices, distributors and factory representatives customer change notification service microchip?s customer notification service helps keep customers current on microchip products. subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. to register, access the microchip web site at www.microchip.com, click on customer change notification and follow the registration instructions. customer support users of microchip products can receive assistance through several channels: ? distributor or representative ? local sales office ? field application engineer (fae) ? technical support ? development systems information line customers should contact their distributor, representative or field application engineer (fae) for support. local sales offices are also available to help customers. a listing of sales offices and locations is included in the back of this document. technical support is available through the web site at: http://support.microchip.com
dspic30f3010/3011 ds70141e-page 222 ? 2008 microchip technology inc. reader response it is our intention to provide you with the best documentation possible to ensure successful use of your microchip prod- uct. if you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please fax your comments to the technical publications manager at (480) 792-4150. please list the following information, and use this outline to provide us with your comments about this document. to : technical publications manager re: reader response total pages sent ________ from: name company address city / state / zip / country telephone: (_______) _________ - _________ application (optional): would you like a reply? y n device: literature number: questions: fax: (______) _________ - _________ ds70141e dspic30f3010/3011 1. what are the best features of this document? 2. how does this document meet your hardware and software development needs? 3. do you find the organization of this document easy to follow? if not, why? 4. what additions to the document do you think would enhance the structure and subject? 5. what deletions from the document could be made without affecting the overall usefulness? 6. is there any incorrect or misleading information (what and where)? 7. how would you improve this document?
? 2008 microchip technology inc. ds70141e-page 223 dspic30f3010/3011 product identification system to order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. dspic30f3010at-30i/pf-000 example: dspic30f3010at-30i/pt = 30 mips, industrial temp., tqfp package, rev. a trademark architecture flash e = extended high temp -40c to +125c i = industrial -40c to +85c temperature device id memory size in bytes 0 = romless 1 = 1k to 6k 2 = 7k to 12k 3 = 13k to 24k 4 = 25k to 48k 5 = 49k to 96k 6 = 97k to 192k 7 = 193k to 384k 8 = 385k to 768k 9 = 769k and up custom id (3 digits) or t = tape and reel a,b,c? = revision level engineering sample (es) speed 20 = 20 mips 30 = 30 mips package pt = tqfp 10x10 pt = tqfp 12x12 p=dip so = soic sp = spdip ml = qfn 6x6 or 8x8 s = die (waffle pack) w = die (wafers)
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